• Current Photovoltaic Research
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• v.4 no.3
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• pp.119-123
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• 2016

We discussed various cover glass substrates available for photovoltaic (PV) modules, and investigated the fabrication methods of light trapping structures for the efficiency enhancement of PV modules: wet and dry etching or laser and direct patternings. We also introduced the analysis of haze at etched glass surfaces as a function of wavelength and also presented a anti-reflection coating technology for PV module.

• Proceedings of the KIEE Conference
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• 1998.11c
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• pp.1017-1019
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• 1998

In this paper, the fabrication of a micropump with two giant magnetostrictive films of Sm-Fe and Tb-Fe is presented. The pump consist of one silicon wafer and one cover glass. The micropump consists of an actuator diaphragm, a paired nozzle and diffuser, and two through holes. The Structure of the micropump is fabricated by the chemical vapor deposition, the etching and the sputtering of the magnetostrictive films. The deflection of the actuator measured diaphragm is measured by using the laser vibrometer and the flow rate of the micro pump is observed by using a video microscope.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.934-937
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• 2001

It is well-known that the micro fabrication technology of micro parts are the high energy beam or silicon-based micro machining method such as LIGA Process, Laser machining, photolithography and etching technology. But, for fabricating complex 3-D structure it is better to use mechanical machining. This machining method by the mechanical machine tool with nanometer accuracy is getting attention in some field-especially micro optics machining such as grating, holographic lens, micro lens array, fresnel lens, encoder disk etc.. In this study, we survey the micro fabrication by mechanical cutting method and set up the mechanical micro machining system. And we carried out micro cutting experiments for micro parts with v-shape groove.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.12
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• pp.1061-1066
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• 2014

Generally electrical circuits are fabricated as PCB(Printed Circuit Board) and mounted on a casing of the product. And it requires lots of other parts and some labor for assembly. Recently a molding technology is increasingly applied to embed simple circuits on a plastic casing. The technology is called as MID(Molded Interconnected Device). Therefore this paper introduces a new MID fabrication process by using direct 3D printing technology.

• Journal of the Korean Graphic Arts Communication Society
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• v.29 no.3
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• pp.17-30
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• 2011

The polarizer is an important optical element used in a variety of applications. Nano-wire grid polarizers in the form of sub-wavelength metallic gratings are an attractive alternative to conventional polarizers, because they provide high extinction ratio. This study has been carried out to fabrication of the 17inch area size nano-wire grid polarizer(NWGP) The master for NWGPs with a pitch of 200nm and the area size $730mm{\times}450mm$ were fabricated using laser interference lithography and aluminum sputtering and wet etching. And The NWGP fabrication process was using by the Roll to-Roll UV imprinting and was applied to flexible PET film. The results were a transmission of light (Tp) 46.7%, reflectance (Rs) 40.1% and Extinction ratio of above 16 for the visible light range.

• Design & Manufacturing
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• v.2 no.3
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• pp.6-9
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• 2008

This paper describes the process of structure analysis and injection molding analysis to manufacture the forming injection dies for huge glass insert. Factors such as filling time, filling pressure, material temperature, shrinkage, warpage were investigated by using the analysis software, Moldflow. Runner system and cavity structure were designed and manufactured through the results of deformation analysis data for glass insert. Filling time and filling pressure were analyzed in 3.756sec and 43.37MPa.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.53 no.1
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• pp.30-35
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• 2004

We have carried out a basic experiment in order to develope a super high-resolution optical microscope which transcend the limitation of diffraction and the wavelength of lightwave. The image of this scope is composed by measuring the evanescent wave which is localized on the surface of the testing materials. A detecting probe was fabricated with a single mode optical fiber to be sharpened by the chemical etching, and drived by PZT. The standing wave of $0.33\mu\textrm{m}$ wavelength evanescent wave which was generated from the $0.78\mu\textrm{m}$-wavelength semiconductor laser was detected by the $0.5\mu\textrm{m}$-thickness optical fiber probe.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.12 no.1
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• pp.27-34
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• 1999

We investigated the effect of mechanical back side damage in viewpoint of electrical and surface morphological characteristics in Czochralski silicon wafer. The intensity of mechanical damage was evaluated by minority carrier recombination lifetime by laser excitation/microwave reflection photoconductance decay technique, atomic force microscope, optical microscope, wet oxidation/preferential etching methods. The data indicate that the higher the mechanical damage degree, the lower the minority carrier lifetime, and surface roughness, damage depth and density of oxidation induced stacking fault increased proportionally.

• Proceedings of the KIEE Conference
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• 1999.07g
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• pp.3328-3330
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• 1999

In this paper, the fabrication of a micro actuator with a micro electromagnet and an actuator diaphragm is presented. The micro electromagnet consists of a magnetic core and a micro inductive planar coil. The actuator diaphragm is the p+ silicon diaphragm on both sides of which magnetostrictive materials are deposited by sputtering. The micro electromagnet is fabricated by sputtering, evaporating, etching and electroplating. The magnetic flux density of the micro electromagnet is measured by using the gauss meter. The deflection of the actuator diaphragm is measured by using the laser vibrometer and optic microscope.

• Journal of Sensor Science and Technology
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• v.14 no.5
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• pp.357-361
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• 2005

Low-stress silicon nitride (LSN) thin films with embedded metal line have been developed as free standing structures to keep microspheres in proper locations and localized heat source for application to a chip-based sensor array for the simultaneous and near-real-time detection of multiple analytes in solution. The LSN film has been utilized as a structural material as well as a hard mask layer for wet anisotropic etching of silicon. The LSN was deposited by LPCVD (Low Pressure Chemical Vapor Deposition) process by varing the ratio of source gas flows. The residual stress of the LSN film was measured by laser curvature method. The residual stress of the LSN film is 6 times lower than that of the stoichiometric silicon nitride film. The test results showed that not only the LSN film but also the stack of LSN layers with embedded metal line could stand without notable deflection.