• Laser Solutions
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• v.11 no.1
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• pp.25-31
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• 2008

The characteristics of femtosecond laser ablation of $Al_2O_3$ for prescision microfabrication are studied experimentally. Specifically, the process time during femtosecond laser drilling of microholes with $sub-100{\mu}m$ diameter are investigated for varying laser fluence, scan speed and beam path designs like trepanning with continuously changed start points. The accumulation of sub-micrometer size particles within the hole and the deterioration of edge clarity and roundness for decreasing hole diameter are examined and through process optimization the microdrilling with good hole quality is achieved using a femtosecond laser system (repetitionrate 1 kHz, wavelength 785 nm, pulse duration 185 fs)

• Laser Solutions
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• v.9 no.2
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• pp.11-15
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• 2006

We report experimental results on the high-speed micromachining using a femtosecond laser (800 nm, 130 fs, 1kHz) and galvanometer scanner system (Raylase, Germany). Periodic hole drilling of silicon and glass with the scan speed of 1-20 mm/s is demonstrated. Finally, we demonstrate the utility of the femtosecond laser application to ITO patterning by using a high-speed femtosecond laser scanner system.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1253-1256
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• 2005

An Experiment was carried out to study burr minimization in drilling on the inclined exit surface. Several different drills, exit surface angles and cutting conditions were selected to determine their influences on burr formation. In drilling operation, there are not only flat exit surfaces but also inclined exit surfaces which is described as inclination angle. Inclination of exit surface causes a quiet different burr formation when comparing with flat surface. Burr formation mechanisms are analyzed according to the drill geometries and cutting conditions. Several schemes for burr minimization on inclined exit surface were proposed. Burr geometry in each drill and cutting condition are measured by laser measurement system.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.7 s.172
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• pp.38-46
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• 2005

In laser machining such as drilling with $CO_2$ or Nd:YAG laser, and etching or ablation with Excimer laser, one of the most important parameters affecting the machining is known to be beam characteristics. In this paper a numerical study is performed to investigate the effects of beam parameters, especially in the process of excimer laser ablation of polymers. Results of different beam conditions reveal that if the ablated depth is small compared to beam size the simple photochemical etching model is suitable to predict the etched shape, and that the importance of precise alignment becomes large as beam quality factor becomes larger.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.11a
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• pp.211-212
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• 2007

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.729-730
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• 2010

• Journal of the Optical Society of Korea
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• v.13 no.3
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• pp.335-340
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• 2009

Ultrashort pulse laser drilling of polycarbonate track-etched membrane (pTEM) material was used to fabricate a mouse embryo cell trapping device. Holes with a diameter of $2{\mu}m$ to $5{\mu}m$ were fabricated on a $10{\mu}m$ thick membrane using a femtosecond laser with a 150 fs pulse width and 775 nm wavelength and multiple-pulse irradiation. In cell trapping tests, the overall cell occupancy of the machined holes in the fabricated pTEM was found to be more than 80%. The results of a single pulse and multiple pulse irradiation were compared in terms of the surface quality. It was generally found that a single pulse with high energy was less desirable than irradiation with multiple pulses of lower energy.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.887-890
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• 1997

Recently micromachining using DPSSL(Diode Pumped Solid State Laser) with 3rd harmonic wavelength is actively studied in laser machining area. Micromachining using DPSSL have outstanding advantages as UV source comparing with excimer laser in various aspect such a maintenance cost, maskless machining, high repetition rate and so on. In this study micro-drilling of PCB type substrate which consists of Cu-PI-Cu layer was performed using DPSS Nd:YAG laser(355nm, wavelength) in vector scanning method. Experimental and numerical method(Matlab simulation, FEM) are used to optimize process parameter and control machining depth. The man mechanism of this process is laser ablation. It is known that there is large gap between energy threshold of copper and that of PI. Matlab simulation considering energy threshold of material is performed to effect of duplication of pulse and FEM thermal analysis is used to predict the ablation depth of copper. This study could be widely used in various laser micromachining including via hole microdrilling of PCB, and micromachining of semiconductor components, medical parts and printer nozzle and so on.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1857-1860
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• 2003

The ablative decomposition mechanism of PMMA(polymethyt methacrylate), PET(polyethylene terephthalate) and PC(polycarbonate) with KrF excimer laser(λ: 248nm, pulse duration: 5ns) is investigated. The UV/Vis spectrometer analysis showed that PMMA is a weak absorber and PET, PC are a strong absorber at the wavelength of 248nm. The results(surface debris, melt, etch depth, etching shape) from drilling and direct writing experiments imply that ablation mechanism of PMMA is dominated by photothermal process, while that of PET, PC are dominated by photochemical process.

• International Journal of Quality Innovation
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• v.2 no.2
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• pp.69-92
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• 2001

The laser-assisted seeding (LAS) process has potential to replace conventional electroless copper plating in Printed Circuit Board (PCB) manufacturing since it combines the steps of laser drilling and plating into one single process. In the LAS process, the single extra LAS step can metallize a microvia. Thus, the process steps can be greatly reduced and the productivity enhanced, but also the high aspect ratio microvias can be metallized. The objectives of this paper are to study the LAS copper thickness within PCB microvias and the thermal reliability of the microvias produced by this process. It was found that results were satisfactory in both the reliability test and also the LAS copper thickness which both comply with IPC standard, the copper thickness produced by the LAS process is sufficient for subsequent electro-plating process. The reliability of the microvias produced by LAS process is acceptable which are free from any voids, corner cracks, and distortion in the plated copper.