• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.657-658
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• 2010

• Journal of the Korean Society for Precision Engineering
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• v.27 no.6
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• pp.32-38
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• 2010

Laser material processing technology is adopted in several industry as alternative process which could overcome weakness and problems of present adopted process, especially semiconductor and display industry. In semiconductor industry, laser photo lithography is doing at front-end level, and cutting, drilling, and marking technology for both wafer and EMC mold package is adopted. Laser cleaning and de-flashing are new rising technology. There are 3 kinds of main display industry which use laser technology - TFT LCD, AMOLED, Touch screen. Laser glass cutting, laser marking, laser direct patterning, laser annealing, laser repairing, laser frit sealing are major application in display industry.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.911-914
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• 1997

This Experiment was carried out for bur minimization in drilling. New drill geometries are proposed to minimize the burr formation in drilling operation. Three types of drills are made, champer, round and step drill. The burr formed in first cutting by front cutting edge ca be removed in second cutting by the cutting edges in chamfer, round edge and step. New burrs are formed by second cutting and can be minimized according to the change of drill geometry like, chamfer size and angle, corner radius in round drill and step size and angle in step drill. To measure the burr formed in drilling, laser sensor is used.

• Journal of Embryo Transfer
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• v.16 no.3
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• pp.193-201
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• 2001

This study was designed to examine the factors affecting in fertilization and development of embryos in vitro, and to examine whether zone drilling by laser irradiation can improve the hatching rate of IVF embryos from DNA marker-proved Hanwoo. DNA markers related to marbling score were identified using DNA fingerprinting with Ml3 probe and restriction enzyme Hae III. Oocytes were aspirated from immature ovarian follicles using a combined method of rectal ovarian-palpation and transvaginal ultrasound-guidance(6.5MHz) under local anesthesia. The aspirated oocytes were washed twice with fresh D-PBS containing 5% FBS and were rewashed 4 to 5 times with TCM-199 containing 5% FBS. A morphological grade of I to IV was assigned to each oocyte. Data were analyzed using the GLM procedure of SAS. Sperm separation methods did not have any significant effect on cleavage or developmental abilities of IVF embryos. Significantly(P<0.05) higher cleavage rate was observed in embryos from GI(60.0%, 3/5), GII(69.2%, 18/26) and GIII(62.1%, 59/95) compared to embryos from GIV oocytes(36.2%, 25/69). And the developmental rate to blastocyst stage was higher(P<0.05) in embryos from GI(33.3%, 1/3) and GII oocytes(38.9%, 7/18) than those from GIII(16.9%,10/59) and GIV oocytes(4.0%, 1/25). There was no significant difference in development of IVF embryos to blastocyst by media for in vitro culture. Proportion of hatched blastocyst was significantly(P<0.05) higher in embryos received zona drilling by laser than those of non-drilled.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1991.04a
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• pp.321-327
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• 1991

High power laser beams are used in a wide variety of materials processing applications such as cutting, welding, drilling and surface treatment. The CO$\sub$2/ laser is increasingly used in laser beam welding because of the highly potential advantages. High power laser welding is a high energy density, no filler metals and low heat input process to join metals. As the comparison with the conventiona welding, precision work and good fit-up to join the metals are required and maintenance is expensive at present. The principal variables of laser beam welding are the laser beam power, travel speed and bean spot size. The penetration depth during laser beam welding is directly related to the power density of the laser beam. Generally, for a constant beam size, the penetration depth increases with increasing laser beam power.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.78-78
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• 1999

Experimental studies of laser micromachining on Mo metal using piezo Q-switched Nd:YAG laser have been performed. Miniaturized microcolumn electron gun arrays as a potential electron beam lithography or portable mini-scanning electron microscope application have recently extensively examined. For these purpose, the electro-static electron lens and deflector system called microcolumn has to be assembled. The conventional microcolumn fabrication technique would gave a limitation on the minimization of aberration. The current technique of a 1 $\mu$m misalignment would lead to ~1.3 nm coma. In order to reduce aberration, assembling the microcolumn component followed by laser drilling should be very beneficial. In this report, we will address the preliminary report of laser micromachining on Mo substrate using piezo Q-switched Nd:YAG laser. The geometrical figures, such as the diameter and the depth of the frilled aperture are dependent upon the total energy of the laser pulse train, laser pulsewidth, and the diameter of laser beam in addition to the materials-dependent parameters.

• Korean Journal of Optics and Photonics
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• v.1 no.1
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• pp.98-106
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• 1990

Lasers are used increasingly for specialized engineering applications such as drilling, profile cutting, welding and surface heat-treatment(hardening, alloying, annealing0 of metals and non-metals. The most important characteristics of lasers used for these materials-processing applications are reviewed, with special emphasis on the importance of the controlled heating process. In addition to these processes, some optical devices and supplementary equipment used in laser processing are introduced. Finally, some examples shows the wide variety of laser capability for substitution of traditional materials processing.

• Laser Solutions
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• v.6 no.1
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• pp.33-40
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• 2003

The ablative decomposition mechanism of PMMA(polymethyl methacrylate) and PET(polyethylene terephthalate) with KrF excimer laser(λ : 248nm, pulse duration: 5㎱) is investigated. The UV/Vis spectrometer analysis showed that PMMA is a weak absorber and PET is a strong absorber at the wavelength of 248nm. The results(surface debris, melt, etch depth, etching shape) from drilling and direct writing experiments imply that ablation mechanism of PMMA is dominated by photothermal process, while that of PET is dominated by photochemical process.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1475-1480
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• 2007

In the last few years, lasers have found new applications in production engineering as tools for surface treatment, cutting, welding, drilling and marking. So far, the laser has mainly been used in special laser processing machines ('laser-only') directly integrated into a production line or serving as stand-alone stations in the workshop. By combining conventional metal cutting technologies with laser processes in one machine, complete processing of a workpiece with different technologies in one setting can be realized. The main advantages are a reduction of the material flow between the production machines, which leads to a reduction in processing time and logistics, and an enhancement of manufacturing quality due to the processing in one setting. In addition to this approach new processing technologies such as laser-assisted machining are possible.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.4
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• pp.32-38
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• 2004

Laser-induced thermochemical wet etching of titanium in phosphoric acid has been investigated to examine the feasibility of this method fur fabrication of microstructures. Cutting, drilling, and milling of titanium foil were carried out while examining the influence of process parameters on etch width, etch depth, and edge straightness. Laser power, scanning speed of workpiece, and etchant concentration were chosen as major process parameters influencing on temperature distribution and reaction rate. Etch width increased almost linearly with laser power showing little dependence on scanning speed while etch depth showed wide variation with both laser power and scanning speed. A well-defined etch profile with good surface quality was obtained at high concentration condition. Fabrication of a hole, micro cantilever beam, and rectangular slot with dimension of tess than 100${\mu}{\textrm}{m}$ has been demonstrated.