• Title/Summary/Keyword: laser drilling

Search Result 126, Processing Time 0.036 seconds

Tilt Measurement of Drilling Machine Using the Laser Interferometer (레이저 간섭계를 이용한 드릴링 머신의 틸트 측정)

  • 이승수;손영지;김순경;전언찬
    • Proceedings of the Korean Society of Precision Engineering Conference
    • /
    • 1996.11a
    • /
    • pp.479-484
    • /
    • 1996
  • This paper describes a method of measuring tilt motion. This method measures the tilt motion of drilling machines using a laser interferometer, a simple sliding linear bearing, measurement of the probe and the LSC(least square center) method. The next order of business is discussing the procedure of measurement. First, The measured position is considered to be the point of contact between the drill shank and the probe. The revolution of the drill axis delivers the point of contact to the probe. Second, because the laser interferometer is attached on the sliding linear bearing, any movement of probe influences laser reflector. Thus, the laser program displays the moving factor of laser reflector. Namely, this is tilt factor. Third. the points of measurement are a full circle which has 8 points (each are 45$^{\circ}$), After it is finished measuring the 8 points, let the spindle of the drilling machine move down about 5 cm. Repeating this procedure three times, we can get tilt motion's values which are calculated by LSC method. Many error factors affect the accurate measurement of tilt motion. However in this paper we ignore some error factors because they are less significant than tilt motion.

  • PDF

Glass Drilling using Laser-induced Backside Wet Etching with Ultrasonic Vibration (초음파 진동과 레이저 후면 에칭을 통한 유리 구멍 가공)

  • Kim, Hye Mi;Park, Min Soo
    • Journal of the Korean Society for Precision Engineering
    • /
    • v.31 no.1
    • /
    • pp.75-81
    • /
    • 2014
  • Laser beam machining has been known as efficient for glass micromachining. It is usually used the ultra-short pulsed laser which is time-consuming and uneconomic process. In order to use economic and powerful long pulsed laser, indirect processing called laser-induced backside wet etching (LIBWE) is good alternative method. In this paper, micromachining of glass using Nd:YAG laser with nanosecond pulsed beam has been attempted. In order to improve shape accuracy, combined processing with magnetic stirrer has been widely used. Magnetic stirrer acts to circulate the solution and remove the bubble but it is not suitable for deep hole machining. To get better effect, ultrasonic vibration was applied for improving shape accuracy.

Micro Machining of Aluminium using Pulsed Laser Beam (레이저빔을 이용한 알루미늄의 미세가공)

  • Shin, Hong Shik
    • Journal of Institute of Convergence Technology
    • /
    • v.4 no.2
    • /
    • pp.41-45
    • /
    • 2014
  • Micro fabrication technologies of aluminium have been required to satisfy many demands in technology fields. Pulsed laser beam machining can be an alternative method to accomplish the micro machining of aluminium. Pulsed laser beam can be applied to micro machining such as micro drilling and milling. Using pulsed laser beam, the machining characteristics of aluminium in micro drilling and milling were investigated according to average power, repetition rate, moving speed of spot. The laser beam machining with the optimal conditions can achieve precise micro figures. As a result, micro pattern, text and structures on aluminium surface was successfully fabricated by pulsed laser beam machining.

Micro-drilling of Fused Silica by Laser Induced Wet Etching (레이저습식각을 이용한 용융실리카의 미세구멍가공)

  • Baek, Byeong-Seon;Lee, Jong-Kil;Jeon, Byung-Hee
    • Proceedings of the KSME Conference
    • /
    • 2003.04a
    • /
    • pp.1344-1348
    • /
    • 2003
  • It is generally known to be difficult to etch a surface of a transparent material such as fused silica by conventional laser ablation in which the surface is simply irradiated with a laser beam. A lot of studies have been done to provide a method capable of efficiently etching transparent materials without defects such as cracks. One of the promising methods or the micro-machining of optically transparent materials is laser induced etching. In this study, micro-drilling of fused silica by laser induced wet etching was conducted. KrF excimer and YAG laser were used as light sources. Acetone solution pyrene and ethanol solution of rhodamine were used as etchant.

  • PDF

Scattering analysis of laser beam drilling in porous ceramic materials (극초단 레이저를 이용한 기공성 세라믹 드릴링시 발생하는 레이저빔 산란해석)

  • Choi, Hae Woon
    • Laser Solutions
    • /
    • v.15 no.4
    • /
    • pp.6-11
    • /
    • 2012
  • Laser beam can be either absorbed or scattered in porous ceramic material and its optical characteristics need to be understood. Electro-magnetic multiphysics software was used to simulate and understand the actual scattering phenomena in porous materials. 785nm femtosecond laser was irradiated on the surface of ceramic material and strong scattering occurred in drilling process. The computer results showed the scattering and absorption phenomena of Aluminum oxide were a mixture of dielectric and metallic material. The computer simulation showed the laser beam was almost extinct at the aspect rate of 5 approximately.

  • PDF

Two-dimensional Laser Drilling Using the Superposition of Orthogonally Polarized Images from Two Computer-generated Holograms

  • Lee, Hwihyeong;Cha, Seongwoo;Ahn, Hee Kyung;Kong, Hong Jin
    • Current Optics and Photonics
    • /
    • v.3 no.5
    • /
    • pp.451-457
    • /
    • 2019
  • Laser processing using holograms can greatly improve processing speed, by spatially distributing the laser energy on the target material. However, it is difficult to reconstruct an image with arrays of closely spaced spots for laser processing, because the specklelike interference pattern prevents the spots from getting close to each other. To resolve this problem, a line target was divided in two, reconstructed with orthogonally polarized beams, and then superposed. Their optical reconstruction was performed by computer-generated holograms and a pulsed laser. With this method, we performed two-dimensional (2D) laser drilling of polyimide film, with a kerf width of $20{\mu}m$ and a total processing length of 20 mm.