• 제목/요약/키워드: laser device

검색결과 816건 처리시간 0.042초

Laser Scanning Path Generation for the Fabrication of Large Size Shape

  • Choi, Kyung-Hyun;Choi, Jae-Won;Doh, Yang-Hoe;Kim, Dong-Soo
    • 제어로봇시스템학회:학술대회논문집
    • /
    • 제어로봇시스템학회 2005년도 ICCAS
    • /
    • pp.2175-2178
    • /
    • 2005
  • Selective Laser Sintering(SLS) method is one of Rapid Prototyping(RP) technologies. It has been used to fabricate desirable part to sinter powder and stack the fabricated layer. Since the sintering process occurs using infrared laser having high thermal energy, shrinkage and curling of the fabricated part occurs according to thermal distribution. Therefore, the fast scanning path generation is necessary to eliminate the factors of quality deterioration. In case of fabricating larger size parts, the unique scanning device and scanning path generation should be considered. In this paper, the development of SLS machines being capable of large size fabrication(800${\times}$1000${\times}$800 mm, W${\times}$D${\times}$H) will be addressed. The dual laser system and the unique scanning device have been designed and built, which employ CO2 lasers and dynamic 3-axis scanners. The developed system allows scanning a larger planar surface with the desired laser spot size. Also, to generate the fast scanning paths, adaptive path generation is needed with respect to the shape of each layer, and not simply x, y scanning, but the scanning of arbitrary direction should be enabled. To evaluate the suggested method, the complex part will be used for the experiment fabrication.

  • PDF

Collective laser-assisted bonding process for 3D TSV integration with NCP

  • Braganca, Wagno Alves Junior;Eom, Yong-Sung;Jang, Keon-Soo;Moon, Seok Hwan;Bae, Hyun-Cheol;Choi, Kwang-Seong
    • ETRI Journal
    • /
    • 제41권3호
    • /
    • pp.396-407
    • /
    • 2019
  • Laser-assisted bonding (LAB) is an advanced technology in which a homogenized laser beam is selectively applied to a chip. Previous researches have demonstrated the feasibility of using a single-tier LAB process for 3D through-silicon via (TSV) integration with nonconductive paste (NCP), where each TSV die is bonded one at a time. A collective LAB process, where several TSV dies can be stacked simultaneously, is developed to improve the productivity while maintaining the reliability of the solder joints. A single-tier LAB process for 3D TSV integration with NCP is introduced for two different values of laser power, namely 100 W and 150 W. For the 100 W case, a maximum of three dies can be collectively stacked, whereas for the 150 W case, a total of six tiers can be simultaneously bonded. For the 100 W case, the intermetallic compound microstructure is a typical Cu-Sn phase system, whereas for the 150 W case, it is asymmetrical owing to a thermogradient across the solder joint. The collective LAB process can be realized through proper design of the bonding parameters such as laser power, time, and number of stacked dies.

Hair Loss Treatment Using Erbium:YAG Fractional Laser with Hair Growth-promoting Solution

  • Ahn, Dong Hyun
    • Medical Lasers
    • /
    • 제10권3호
    • /
    • pp.176-180
    • /
    • 2021
  • Several methods have been used to treat androgenetic hair loss, ranging from hair transplants to finasteride and minoxidil. Sometimes platelet-rich plasma injection therapy may be used to increase the satisfaction of patients who come to the hospital. However, some patients are sensitive to pain and are subjected to the inconvenience of requiring treatment after each blood sampling. The author had reported the effects of using a hair growth-promoting solution and JetpeelTM in parallel with a painless hair loss treatment method. However, the author was interested in more effective methods for patients with M-shaped or vertex hair loss who do not want to take medications or undergo hair transplant. In addition to the existing light-emitting diode therapy and electromagnetic field treatment, the author has made considered attempts to use various laser wavelength bands. However, the equipment for these methods can be expensive and are not suitable for patients who emphasize on cost-effectiveness. Therefore, the author used an existing reported method and a device based on the fractional erbium:YAG laser to provide the hair growth-promoting solution in parallel. The author chose a fractional 2940 nm-based laser device as a medium that could efficiently increase the growth phase, reduce the catagen phase, and facilitate intradermal product and drug delivery. As a result, there was a therapeutic benefit without any significant side effects such as redness and itching. Among the patients, the author reported the effects of the treatment on one patient with frontal M-shaped, mid, and vertex hair loss.

마이크로 금형 제작을 위한 PET의 엑시머 레이저 어블레이션 - 퓨리에 광학을 이용한 가공 단면 형상의 제어 - (The excimer laser ablation of PET for micro-mold insert - The control of cross sectional shape using Fourier optics -)

  • 신동식;이제훈;서정;김도훈
    • 한국레이저가공학회지
    • /
    • 제6권3호
    • /
    • pp.19-28
    • /
    • 2003
  • The manufacturing process for the microfluidic device can include sequential steps such as master fabrication, electroforming, and injection molding. The laser ablation, using masks, has been applied to the fabrication of channels in microfluidic devices. In this research, an excimer laser was used to engrave microscopic channels on the surface of PET (polyethylene terephthalate), which shows a high absorption ratio for an excimer laser beam with a wavelength of 248 m. When 50-${\mu}{\textrm}{m}$-wide rectangular microscopic channels are ablated with a 500 ${\times}$ 500 ${\mu}{\textrm}{m}$ square mask at a magnification ratio of 1/10, ditch-shaped defects were found in both corners. The measurement of laser beam intensity showed that a coherent image in the PET target caused such defects. Analysis based on the Fourier diffraction theory enabled the prediction of the coherent shape at the image surface as well as the diffraction beam shape between the mask and the image surface. It also showed that the diameter of the aperture had a dominant effect. The application of aperture with a diameter of less than 3 mm helped to eliminate such defects in the ablated rectangular microscopic channels on PET without such ditch-shaped defects.

  • PDF

Laser Thermal Processing System for Creation of Low Temperature Polycrystalline Silicon using High Power DPSS Laser and Excimer Laser

  • Kim, Doh-Hoon;Kim, Dae-Jin
    • 한국정보디스플레이학회:학술대회논문집
    • /
    • 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
    • /
    • pp.647-650
    • /
    • 2006
  • Low temperature polycrystalline silicon (LTPS) technology using a high power laser have been widely applied to thin film transistors (TFTs) for liquid crystal, organic light emitting diode (OLED) display, driver circuit for system on glass (SOG) and static random access memory (SRAM). Recently, the semiconductor industry is continuing its quest to create even more powerful CPU and memory chips. This requires increasing of individual device speed through the continual reduction of the minimum size of device features and increasing of device density on the chip. Moreover, the flat panel display industry also need to be brighter, with richer more vivid color, wider viewing angle, have faster video capability and be more durable at lower cost. Kornic Systems Co., Ltd. developed the $KORONA^{TM}$ LTP/GLTP series - an innovative production tool for fabricating flat panel displays and semiconductor devices - to meet these growing market demands and advance the volume production capabilities of flat panel displays and semiconductor industry. The $KORONA^{TM}\;LTP/GLTP$ series using DPSS laser and XeCl excimer laser is designed for the new generation of the wafer & FPD glass annealing processing equipment combining advanced low temperature poly-silicon (LTPS) crystallization technology and object-oriented software architecture with a semistandard graphical user interface (GUI). These leading edge systems show the superior annealing ability to the conventional other method. The $KORONA^{TM}\;LTP/GLTP$ series provides technical and economical benefits of advanced annealing solution to semiconductor and FPD production performance with an exceptional level of productivity. High throughput, low cost of ownership and optimized system efficiency brings the highest yield and lowest cost per wafer/glass on the annealing market.

  • PDF

Enhancement of Anticancer Effect through Photodynamic Therapy with High Oxygen Concentration

  • ;;;;;안진철
    • 대한의생명과학회지
    • /
    • 제15권1호
    • /
    • pp.87-91
    • /
    • 2009
  • In photodynamic therapy (PDT), oxygen plays important role. Because of singlet oxygen which is produced by activated photosensitizer after laser irradiation of specific wavelength. The aim of this study is to find how oxygen concentration affects anticancer effect in PDT. Groups were divided into PDT with oxygen applied group and only PDT applied group. PDT with oxygen applied group supplied oxygen for 15 minute before laser irradiation. In vitro, CT-26 cell was incubated with various concentration of photofrin $(50.0{\sim}0.05{\mu}g/ml)$ and was irradiated with 632nm diode laser 6hr after application of photofrin. The cell viability of two groups was assessed by MTT assay. In vivo, CT-26 cell line was transplanted into the subcutaneous tissue of BALB/c mouse. The anticancer effect of two groups was measured by tumor volume change. In vitro study, the cell viability was significantly decreased at $1.56{\sim}3.13{\mu}g/ml$ in PDT with oxygen applied group. In vivo study, the PDT with oxygen applied group significantly higher reduction rate of tumor volume 7 days after PDT compared to PDT only group. The high oxygen concentration might enhance the anticancer effect of the photodynamic therapy.

  • PDF

A SE Approach to Designing and Developing of Motion Control for Radioactive Waste Decontamination

  • Ngbede, Utah Michael;Olaide, Oluwasegun Adebena;Jung, Jae Cheon
    • 시스템엔지니어링학술지
    • /
    • 제17권1호
    • /
    • pp.11-20
    • /
    • 2021
  • Decontamination of systems, structures and components (SSC) during the decommissioning of a Nuclear Power Plant (NPP) can be for a variety of reasons. The main reasons for decontamination are: to reduce the contamination of SSC to a reasonably low level, to reduce the potential for the spread of contaminants into the environment and to reduce the cost of disposal due to the reduced level of contamination in a particular SSC. The decontamination technique can be aggressive or non-aggressive depending on the intent after the decontamination process. Aggressive decontamination technique is used when the intent is not to reuse the SSC while a non-aggressive decontamination technique is used with the intent of SSC reuse. For different SSCs there are different decontamination techniques that can be used, each having its own advantages and drawbacks. Metal components such as pipes in the nuclear power plant account for a large amount of nuclear wastes generated. Some of these wastes can be reused if the contaminant level is reduced to an acceptable level. Laser ablation is a non-aggressive decontamination technique that can be used to reduce the contamination in pipes to an acceptable level with no secondary waste generated during the process. The operation and control of a laser ablation device must be precise to achieve a high decontamination factor. This precision can be achieved by a well-designed motion control system. For this purpose, a motion control system was developed consisting of two parts: the first part being the precise control of the laser ablation device inside the pipe and the second part is the control of the laser ablation device outside the pipe. This paper describes the Systems Engineering approach for the development process of a motion control system for the Laser decontamination system.

용접부 품질향상을 위한 지능형 용접 와이어 공급 장치 개발 (Development of Intelligent Filler Wire Feeding Device for Improvement of Weld quality)

  • 이재석;손영일;박기영;이경돈
    • 한국정밀공학회:학술대회논문집
    • /
    • 한국정밀공학회 2005년도 춘계학술대회 논문집
    • /
    • pp.950-955
    • /
    • 2005
  • This paper describes an intelligent filler wire feeding device which can control 3- dimensional seam tracking and the filler wire speed by measuring the gap position and the joint gap width in laser welding. By means of visual sensor controlled filling the missing material into the joint gap and 3 dimensional seam tracking, lineup errors from manufacturing tolerances and the repeatability of lineup jigs and weld robot can be balanced and at an even seam quality which avoids weld defects. In this paper, we assessed weld quality in 2mm sheets of A16061 which had various gap width by using the intelligent filler wire feeding device.

  • PDF

통계적 분석법을 활용한 도로용 원더링 장비개발 (Development of Portable Wandering Device using Statistical Analysis)

  • 김낙석;박창우;박현식;김주열
    • 한국재난정보학회 논문집
    • /
    • 제3권1호
    • /
    • pp.5-20
    • /
    • 2007
  • The role of a pavement means a social axis for the future as well as a function of road itself. To achieve its intended purposes, the maintenance technique of the pavement performance should be improved. For this, pavement investigators have dealt with the simulated pavement sites under actual environmental conditions. One of them is wandering device to improve the maintenance system of a pavement. The primary purpose of this research is to develop a portable wandering device using statistical analysis technique. It is noted that the new device using laser sensor demonstrates better field applications and reliability compare to the conventional one.

  • PDF