• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.287-288
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• 2010

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.06a
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• pp.329-330
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• 2008

• Laser Solutions
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• v.18 no.3
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• pp.9-13
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• 2015

The development of a reliable, high-power source of mind-IR laser light gives process develop important tool with unique characteristics that will significantly impact a diverse range of applications.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.418-421
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• 2005

The objective of this research work is to investigate the effects of process parameters, such as power of laser, travel speed of laser and material thickness, on kerfwidth and characteristics of the cut surface for the case of cutting of CSP 1N sheet using high power continuous wave Nd:YAG laser. In order to find relationship between the process parameters on the quality of the cut section, such as kerfwidth, surface roughness and the striation formation, several laser cutting experiments are carried out. From the results of experiments, an optimal cutting speed for each cutting condition has been obtained to improve the quality of the cut surface.

• Nuclear Engineering and Technology
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• v.49 no.4
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• pp.865-872
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• 2017

For more than 10 years, the laser process has been studied for dismantling work; however, relatively few research works have addressed the effect of high-power fiber laser cutting for thick sections. Since in the nuclear sector, a significant quantity of thick material is required to be cut, this study aims to improve the reliability of laser cutting for such work and indicates guidelines to optimize the cutting procedure, in particular, nozzle combinations (standoff distance and focus position), to minimize waste material. The results obtained show the performance levels that can be reached with 10 kW fiber lasers, using which it is possible to obtain narrower kerfs than those found in published results obtained with other lasers. Nonetheless, fiber lasers appear to show the same effects as those of $CO_2$ and ND:YAG lasers. Thus, the main factor that affects the kerf width is the focal position, which means that minimum laser spot diameters are advised for smaller kerf widths.

• International Journal of Precision Engineering and Manufacturing
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• v.4 no.1
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• pp.23-29
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• 2003

Stencil is used normally as a mask for solder pasting on pad of a printed circuit board (PCB). The objective of this study is to develop a stencil cutting system and determine the optimal conditions to make good-quality stencil by using a Nd:YAG laser. The effects of process parameters such as laser power, type of mask, gas pressure, cutting speed and pulse duration on the cut edge quality were investigated. In order to analyze the cut surface characteristics (roughness, kerfwidth, dross) optical microscopy, SEM microscopy and roughness measurements were used. As a result, the optimal conditions of cutting process parameters were determined, and the practical feasibility of the proposed system was also examined by using a commercial Gerber file for PCB stencil manufacturing.

• Laser Solutions
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• v.11 no.4
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• pp.29-34
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• 2008

Ultraviolet laser micromachining has increasingly been applied to the electronics industry where precision machining of high-density, multi-layer, and multi material components is in a strong demand. Due to the ever-decreasing size of electronic products such as cellular phones, MP3 players, digital cameras, etc., flexible printed circuit board (FPCB), multi-layered with polymers and metals, tends to be thicker. In present, multi-layered FPCBs are being mechanically cut with a punching die. The mechanical cutting of FPCBs causes such defects as burr on layer edges, cracks in terminals, delamination and chipping of layers. In this study, the laser cutting mechanism of FPCB was examined to solve problems related to surface debris and short-circuiting that can be caused by the photo-thermal effect. The laser cutting of PI and FCCL, which are base materials of FPCB, was carried out using a pico-second laser(355nm, 532nm) and nano-second UV laser with adjusting variables such as the average/peak power, scanning speed, cycles, gas and materials. Points which special attention should be paid are that a fast scanning speed, low repetition rate and high peak power are required for precision machining.

• Journal of the Korean Society of Industry Convergence
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• v.26 no.6_3
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• pp.1197-1204
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• 2023

Ti-alloy, a high-strength alloy material among the materials used in aircraft that are trending toward lighter weight, is classified as a difficult-to-cut material that requires a lot of energy for cutting. Cutting in a high-temperature environment is considered one means of making this possible, and various studies have been conducted on it. In particular, research on LAM (Laser Assisted Machining (LAM)), which utilizes laser heating of the cutting area, is being actively conducted. Before processing of the milling cutter begins, the temperature is raised locally by the laser irradiated through the laser head carrier, and the resistance during milling is reduced. Therefore, in this paper, in order to derive such conditions, we performed heat transfer analysis according to transfer conditions and compared it with actually applied test data to use it to establish appropriate processing conditions.

• Proceedings of the KWS Conference
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• 1992.10a
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• pp.21-31
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• 1992

CO2 laser had enabled accurate and effective cutting. But its application has been limited to thin and small parts. Development of a high power oscillator and oscillator built-in cutting machine have realized cutting of thick and large steel parts. This machine brings also possibility of fully automated cutting systems to practical steel parts such as for construction machinery.

• Proceedings of the KWS Conference
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• 1994.05a
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• pp.186-189
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• 1994

This paper proposes an expert system for the selection of the appropriate laser cutting variables from the available database. Optimum cutting conditions were searched and qualitative comments which are hard to choose as database variables were shown using the binary and fuzzy inference.