• 제목/요약/키워드: laser cutting

검색결과 370건 처리시간 0.034초

Er:YAG laser와 Conventional bur의 유치와 영구치 치아삭제효과 비교 (CUTTING EFFICACY OF Er:YAG LASER AND CONVENTIONAL BUR IN DECIDUOUS AND PERMANENT TEETH)

  • 박인천;이창섭;이난영;이상호
    • 대한소아치과학회지
    • /
    • 제30권2호
    • /
    • pp.272-285
    • /
    • 2003
  • 본 연구는 유치와 영구치의 법랑질과 상아질을 bur를 이용하여 삭제한 경우와 Er:YAG laser를 이용하여 삭제한 경우 형성되는 와동의 미세학적인 형태를 관찰하고 삭제 효과를 비교하기 위함이다. 유치와 영구치의 법랑질과 상아질을 #330 bur 와 5 Hz의 150mJ, 200mJ, 250mJ 그리고 300mJ 조사세기로 Er:YAG laser를 조사하여 1mm 두께의 표본이 삭제되는 시간을 측정하였다. 또한 삭제된 표면을 관찰하기 위해서 유치와 영구치 각각 5개에 #330 bur와 5Hz의 150mJ, 200mJ, 250mJ, 300mJ 조사세기로 Er:YAG laser를 1초동안 조사하여 횡단면과 종단면으로 나누어 관찰하였다. 1. Er:YAG 레이저를 사용하여 삭제한 경우 유치와 영구치, 법랑질과 상아질 모두 bur를 이용하여 삭제한 경우보다 삭제 시간이 길었다(P<0.05). 2. 법랑질을 삭제할 경우 bur를 사용시 영구치보다 유치에서 삭제시간이 더 길었다. 그러나 Er:YAG 레이저 사용시에는 유치와 영구치 사이에 유의한 차이를 보이지 않았다(P>0.05). 3. 상아질을 삭제할 경우 bur사용시 영구치에서 삭제시간이 더 길었으며 Er:YAG레이저 사용시 150mJ, 5Hz에서는 유의하게 영구치에서 더 긴 삭제시간을 보였으나 나머지 다른 출력의 레이저에서는 유의한 차이를 보이지 않았다(P<0.05). 4. SEM 관찰시 bur를 이용하여 치아를 삭제한 경우 치질유형에 관계없이 경계가 비교적 명확한 와동 변연을 보였다. 그러나 와동 변연에서 균열과 $10-100{\mu}m$의 microchipping이 관찰되었다. 와동벽은 회전식 bur에 따른 줄무늬 모양의 표면을 보이고 있었다. 편평한 와동저를 관찰할 수 있었으며 역시 와동벽과 마찬가지로 거친 표면을 보이고 있었다. 5. 레이저를 이용하여 치아를 삭제한 경우 와동의 변연이 명확하고 날카롭게 형성되었다. 와동의 상부의 직경은 조사에너지와 pulse repetition rate가 커질수록 점차 증가하였다. 와동벽은 불규칙하게 배열되었으며 와동의 변연이나 바닥에 비해 불규칙한 양상을 보여주었다. 와동저는 일반적으로 둥근 원추형이며 비교적 부드러운 표면을 보였다. 이상의 결과를 요약해보면 Er:YAG 레이저는 유치와 영구치에서 비슷한 삭제 시간이 소요되었다. 그러나, 법랑질보다는 상아질에 더 효과적인 것으로 나타났다. 실험 결과 레이저를 이용하여 치아를 삭제한 경우 bur사용에 비해 3배 이상의 삭제시간이 소요되었다. 그러나, 레이저를 이용하여 치아를 삭제할 경우 깨끗한 와동 변연이 형성되고 smear layer가 형성되지 않는 점이 장점으로 사료된다.

  • PDF

밀링가공에서 공구마모와 스핀들의 비틀림 진동과의 상관관계에 관한 연구 (Research on the Effect of Cutter Wear on the Torsional Vibration of Spindle in Milling)

  • 김석관
    • 한국정밀공학회지
    • /
    • 제16권9호
    • /
    • pp.62-67
    • /
    • 1999
  • In milling, cutting tool ins directly attached to spindle and this tells that spindle can provide very useful information on the cutting tool condition such as wear or breakage. Since spindle is rotating at a high speed, measuring spindle velocity using a noncontacting measurement system gives the best information which can be obtained. Due to the force applied to spindle through cutting tool, velocity of spindle changes. And any change in cutting tool condition affects cutting force and consequently spindle vibration. With the intent of continuously monitoring cutting tool condition in intermittent machining operations in a benign manner, a noncontacting velocity measurement system using a laser Doppler velocimeter was assembled to measure spindle torsional vibration. Spindle vibration was measured and analysis of it in the frequency domain yielded a measure which corresponded to amount of cutting tool wear in milling.

  • PDF

질화규소의 예열선삭가공시 경사각에 따른 절삭특성 (Cutting Characteristics on Rake Angle in Laser-Assisted Machining of Silicon Nitride)

  • 선동식;이제훈;임세환;김종도;이수전
    • 한국정밀공학회지
    • /
    • 제26권4호
    • /
    • pp.47-54
    • /
    • 2009
  • In the last few years, lasers have found new applications as tools for ceramic machining which is laser-assisted machining(LAM). LAM process for the machining of difficult-to-machine materials such as structural ceramics, has recently been studied on silicon nitride workpiece for a wide range of operating condition. However, there have been few studies on rake angle in LAM process. In this paper we analyzed difference of machinability between positive and negative rake angle in tools. We have obtained interesting results that we could eliminate chattering, lower specific cutting and cutting ratio in case of positive rake angle. The results suggest that positive rake angled tools can make more plastic deformation and stable cutting of silicon nitride in comparison with negative rake angled one.

임의형상가공시스템을 위한 레이저 5축 경사절단기 및 궤적생성 알고리즘의 개발 (Development of Five Axis Laser Cutting System for the Tangent Cutting Solid Freeform Fabrication System)

  • 주영철;엄태준;이차훈;공용해;천인국;김승우;방재철
    • 한국산학기술학회논문지
    • /
    • 제4권1호
    • /
    • pp.1-6
    • /
    • 2003
  • 제품의 소재를 미리 테입 형태로 만들어 단면치 경계면을 따라 레이저로 절단하여 적층하는 방식의 임의형상시스템은 제품의 표면에 계단 모양의 무의가 생기므로 정밀한 제품을 제작하는데 어려움이 있었다 이를 극복하기 위하여 단면의 경계선을 절단할 때 수직으로 절단하는 것이 아니라 경사면을 따라 절단하여 전체적인 제품의 옆면이 부드럽게 연결되는 경사절단형 임의형상가공시스템을 개발하였다 이를 위하여 레이저 5축 경사절단기를 개발하였는데, x축과 y축은 상용화되어있는 x-y table을 이용하였고 z축은 한 개의 z축 이송대를 이용하였다 롤과 피치를 위하여는 서보모터 두 개를 이용하여 작업대가 회전할 수 있도록 하였다. 이와 같은 레이저 5축 경사절단기를 개발함으로써 시편의 어느 위치에서든 어느 각도로도 절단이 가능하게 할 수 있었다. 또한 3차원 CAD 데이터로부터 단면정보를 생성하고 경사절단면에 맞추어 레이저 궤적을 생성 할 수 있는 소프트웨어를 개발하였다

  • PDF

Modern Laser Technology and Metallurgical Study on Laser Materials Processing

  • Kutsuna, Muneharu
    • 대한용접접합학회:학술대회논문집
    • /
    • 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
    • /
    • pp.561-569
    • /
    • 2002
  • Laser has been called a "Quantum Machine" because of its mechanism of generation since the development on July 7,1960.by T.H.Maiman. We can now use this machine as a tool for manufacturing in industries. At present, 45kW CO2 laser, 10kW Nd:YAG laser, 6kW LD pumped YAG laser and 4kW direct diode laser facilities are available for welding a heavy steel plate of 40mm in thickness and for cutting metals at high speed of 140m/min. Laser Materials Processing is no longer a scientific curiosity but a modern tool in industries. Lasers in manufacturing sector are currently used in welding, cutting, drilling, cladding, marking, cleaning, micro-machining and forming. Recently, high power laser diode, 10kW LD pumped YAG laser, 700W fiber laser and excimer laser have been developed in the industrialized countries. As a result of large numbers of research and developments, the modem laser materials processing has been realized and used in all kinds of industries now. In the present paper, metallurgical studies on laser materials processing such as porosity formation, hot cracking and the joint performances of steels and aluminum alloys and dissimilar joint are discussed after the introduction of laser facilities and laser applications in industries such as automotive industry, electronics industry, and steel making industry. The wave towards the use of laser materials processing and its penetration into many industries has started in many countries now. Especially, development of high power/quality diode laser will be accelerate the introduction of this magnificent tool, because of the high efficiency of about 50%, long life time and compact.

  • PDF

Characteristics of Si3N4 Laser Assisted Machining according to the Laser Power and Feed Rate

  • Kim, Jong-Do;Lee, Su-Jin;Suh, Jeong
    • Journal of Advanced Marine Engineering and Technology
    • /
    • 제34권7호
    • /
    • pp.963-970
    • /
    • 2010
  • This study makes an estimate of the laser-assisted machining (LAM) of an economically viable process for manufacturing precision silicon nitride ceramic parts using a high-power diode laser (HPDL). The surface is locally heated by an intense laser source prior to material removal, and the resulting softening and damage of the workpiece surface simplify the machining of the ceramics. The most important advantage of LAM is its ability to produce much better workpiece surface quality compared to conventional machining. Also important are its larger material removal rates and longer tool life. The cutting force and surface temperature were measured on-line using a pyrometer and a dynamometer, respectively. Tool wear, chips and the surface of the workpiece were measured using optical microscopy, and the surface and fractured cross-section of $Si_3N_4$ were measured by SEM. During the LAM process, the cutting force and tool wear were reduced and oxidation of the machined surface was increased according to the increase in the laser power. Moreover, the more the feed rate increased, the more the cutting force and tool wear increased.

질화규소 세라믹의 레이저 예열선삭에 관한 연구 (II) - 예열선삭된 SSN 및 HIPSN 질화규소 세라믹의 표면특성 - (A Study on Laser Assisted Machining for Silicon Nitride Ceramics (II) - Surface Characteristics of LAM Machined SSN and HIPSN -)

  • 김종도;이수진;강태영;서정;이제훈
    • Journal of Welding and Joining
    • /
    • 제28권5호
    • /
    • pp.80-85
    • /
    • 2010
  • This study focused on laser assisted machining (LAM) of silicon nitride ceramic that efficiently removes the material through machining of the softened zone by local heating. The effects of laser-assisted machining parameters were studied for cost reduction, and active application in processing of silicon nitride ceramics in this study. Laser assisted machining of silicon nitride allows effective cutting using CBN tool by local heating of the cutting part to the softening temperature of YSiAlON using by the laser beam. When silicon nitride is sufficiently preheated, the surface is oxidized and decomposed and then forms bloating, micro crack and silicate layer, thereby making the cutting process more advantageous. HIPSN and SSN specimens were used to study the machining characteristics. Higher laser power makes severer oxidation and decomposition of both materials. Therefore, HIPSN and SSN specimens were machined more effectively at higher power.

컴퓨터수치제어(CNC) 플라즈마 아아크 절단장치 개발에 관한 연구 (A study on development of plasma-arc cutting system with computer-numerical control)

  • 노태정;나석주;나규환
    • Journal of Welding and Joining
    • /
    • 제8권3호
    • /
    • pp.60-69
    • /
    • 1990
  • Plasma arc cutting is a fusion cutting process in which a gas-constricted arc is employed to produce a high-temperature, high-velocity plasma jet on the workpiece. This process provides some advantages such as increased cutting velocity, excellent working accuracy and the ability to cut special materials (widely used stainless steels and Al-alloys, for example), when compared with iconventional oxyfuel gas cutting. From the view point of price and reliability of the power source, plasma arc cutting has also some distinct advantages over laser beam cutting. High-speed machines with NC or CNC systems are needed for the plasma arc or laser beam cutting process, while for oxyfuel gas cutting, low-speed machines with copying templates or optical-shape tracking sensors can be applied. The low price and high flexibility of the microprocessor arc contributing more and more the application of CNC system in the plasma arc cutting process, as in other manufacturing fields. From these points of view, a microprocessor-based plasma arc cutting system was developed by using a reference-pulse system, and its performance was tested. The interpolating routines were programmed in the assembly language for saving the memory volume and improving the compouting speed, which has an intimate relationship with the available cutting velocity.

  • PDF

$\mu$-BGA 절단을 위한 레이저 가공 파라미터 연구 (The study of laser processing parameter for $\mu$-BGA cutting)

  • 백광렬;이천
    • 한국전기전자재료학회:학술대회논문집
    • /
    • 한국전기전자재료학회 2001년도 하계학술대회 논문집
    • /
    • pp.652-655
    • /
    • 2001
  • In this paper, I have studied minimization of the kerf-width and surface burning which are occurred after the singulation process of multi layer $\mu$-BGA( thickness 1.1 mm, 0.9 mm) with a pulsed Nd:YAG( = 532 nm, repetition rate = 10 Hz) laser. The thermal energy of a pulsed Nd:YAG laser is used to cut the copper layer. I have studied are minimization of the surface burning and kerf-width using a photo resist, $N_2$blowing and polyester double sided tape as a cutting parameter. The $N_2$blowing reduces a laser energy loss by debris and suppresses a surface carbonization. Also, I have studied characters of cutting with a choice of side of laser beam incidence. The SEM(Scanning Electron Microscope), non-contact 3D inspector and high-resolution microscope are used to measure kerf width and surface state. The optimum value of 1.1 mm $\mu$-BGA singulation is 524 $\mu$m that is reduced kerf width of 60 % with $N_2$blowing. And I obtained reduction of carbonization of 68 % with a polyester double side tape in 0.9 mm $\mu$-BGA. I used laser intensity of 1.91$\times$10$^{6}$ / $\textrm{cm}^2$ in this study.

  • PDF

나노초 펄스폭을 갖는 자외선 레이저를 이용한 전자회로기판의 저항체 트리밍과 절단공정 특성에 관한 연구 (Study of Laser Trimming and Cutting of Printed Circuit Board by using UV Laser with Nanosecond Pulse Width)

  • 류광현;신석훈;박형찬;남기중;권남익
    • 한국정밀공학회지
    • /
    • 제27권10호
    • /
    • pp.23-28
    • /
    • 2010
  • Resistance trimming and cutting processes of printed circuit board by making use of high power UV laser with nano-second pulse width have been proposed and investigated experimentally. Also laser-based application system with high flexibility and complex has been designed and adopted power controller, auto beam size control, auto-focusing and control program developed for ourselves. The function of each module shows that they can be reliable for industrial equipments. Resistance trimming method used a plunge and double cut process with $20{\mu}m$ spot size beam. Results show that double cut process is more effective to control resistance trimming in precision than plunge cut process.