• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.652-655
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• 2001

In this paper, I have studied minimization of the kerf-width and surface burning which are occurred after the singulation process of multi layer $\mu$-BGA( thickness 1.1 mm, 0.9 mm) with a pulsed Nd:YAG( = 532 nm, repetition rate = 10 Hz) laser. The thermal energy of a pulsed Nd:YAG laser is used to cut the copper layer. I have studied are minimization of the surface burning and kerf-width using a photo resist, $N_2$blowing and polyester double sided tape as a cutting parameter. The $N_2$blowing reduces a laser energy loss by debris and suppresses a surface carbonization. Also, I have studied characters of cutting with a choice of side of laser beam incidence. The SEM(Scanning Electron Microscope), non-contact 3D inspector and high-resolution microscope are used to measure kerf width and surface state. The optimum value of 1.1 mm $\mu$-BGA singulation is 524 $\mu$m that is reduced kerf width of 60 % with $N_2$blowing. And I obtained reduction of carbonization of 68 % with a polyester double side tape in 0.9 mm $\mu$-BGA. I used laser intensity of 1.91$\times$10$^{6}$ / $\textrm{cm}^2$ in this study.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.3
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• pp.171-179
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• 2004

Micro-stereolithography technology has made it possible to fabricate a freeform 3D microslructure. This technology is based on conventional stereolithography, in which a UV laser beam irradiates the open surface of a UV-curable liquid photopolymer, causing it to solidify. In micro-stereolithography, a laser beam of a few $\mu m$ diameter is used to solidify a very small area of the photopolymer. This is one of the key technological elements, and can be achieved by using a focusing lens. Thus, the solidification phenomena of the liquid photopolymer must be carefully investigated. In this study, the photopolymer solidification phenomena in response to variations in the scanning pitch of a focused laser beam was investigated experimentally. The effect of layer thickness on the solidification width and depth was also examined. These studies were conducted under the conditions of relatively lower laser power and relatively higher scanning speed. Moreover, the photopolymer solidification phenomena for the relatively higher laser power and lower scanning speed was investigated, too. In this case, comparing to the case of lower laser power and higher scanning speed, the photopolymer absorbed large amount of irradiation energy of the laser beam. These results were compared with those obtained from a photopolymer solidification model. From these results, a new laser-scanning scheme was proposed according to the shape of the 3D model. Samples by each method were fabricated successfully.

• Laser Solutions
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• v.4 no.3
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• pp.30-39
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• 2001

This work was tamed out to apply a laser welding technique in joining between a Zn coated low carbon steel plate(SECC) and a free cutting carbon steel shaft(SUM24L) with or without W coating. Experiments were carried out and analysed by applying the FD(factorial design)method to obtain the optimum Laser welding condition. Optical microscopy, SEM, TEM and XRD analyses were performed in order to observe the microstructures in the fusion zone and the HAZ. Mechanical properties of the welded specimens were examined by microhardness test, tensile test and twist test. There was no flawed Zn in the fusion zone by EDS analysis. This means that during the welding process, Zn gas could be eliminated by appropriate shielding gas flow rate and butt welding gap. Ni coating itself did not influence on the tensile strength and hardness. However, twist bending strength and the weld depth of the Ni-coated free cutting carbon steel were lower as compared with those of the uncoated free cutting carbon steel. It was attributed to a lower absorbance of laser beam to the shin Ni surface. According to the results of the factorial design tests, the twist bending strength of welded specimens was primarily affected by pulse width, laser power, frequency and speed.

• Journal of Welding and Joining
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• v.9 no.1
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• pp.32-39
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• 1991

A 200W pulsed Nd: YAG laser for fine welding was developed. The important laser parameters such as laser peak power, average power, pulse width, and pulse energy for welding were studied. In order to obtain the sufficient laser power density for welding, thermal lensing effects were analyzed and a laser resonator with laser beam divergence was designed. The power supply unit was designed to support up to 7kW input. The pulse control unit was developed using a GTO thyristor and could control over 100kW input power to obtain 3.5kW peak power laser. Also due to the GTO thyristor the pulse width could be varied continuously from 0.1 to 20 msec and maximum repetition rate was as high as 300pps.

• Transactions of the Korean Society of Mechanical Engineers
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• v.19 no.2
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• pp.427-432
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• 1995

Surface heat treatment using a laser beam or an electron beam is studied through numerical analyses and experiments. For the surface heat treatment process, a theoretical model is developed to predict the effects of laser beam power, travel speed and properties of a workpiece on the depth and width of the heat affected zone(HAZ). The shape of HAZ and the hardness of heat-treated surface are experimentally obtained using an electron beam. Three materials(SS41, S45C and S55C) are selected as workpiece materials. The hardness of HAZ is increased up to 3 times for materials of a low carbon content. The results of the numerical analysis are compared with those of experiments. The comparison shows that the numerical model predicts larger depths and widths.

• Laser Solutions
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• v.4 no.2
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• pp.21-28
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• 2001

The laser strengthening of 35kgf/㎟ and 60kgf/㎟ grade steel sheets is investigated by using CO$_2$ laser beam irradiation. The increase of tensile strength is dominated by the number of fully penetrated melting line. Also. the optimal laser input energy(hardness) and the number of melting line (melting width) are important variables for laser strengthening. Local strengthening by laser beam may be effective for the weight reduction of components where the tailored welded blank can not be applied.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.709-713
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• 2004

Characteristics of laser-assisted wet etching of titanium in phosphoric acid were investigated to examine the feasibility of this method for fabrication of high aspect ratio microchannels. Laser power, number of scans, etchant concentration, position of beam waist and scanning speed were taken into consideration as the major process parameters exerting the temperature distribution and the cross sectional profile of etched channels. Experimental results indicated that laser power influences on both etch width and depth while number of scans and scanning speed mainly affect on the etch depth. At a low etchant concentration, the cross sectional profile of an etched channel becomes a U-shape but it gradually turns into a V-shape as the concentration increases. On the other hand, surface of the laser beam focus with respect to the sample surface is found to be a key factor determining the bubble dynamics and thus the process stability. It is demonstrated that metallic microchannels with different cross sectional profiles can be fabricated by properly controlling the process parameters. Microchannels of aspect ratio up to 8 with the width and depth ranges of 8∼32 m and 50∼300 m, respectively, were fabricated.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.10
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• pp.23-28
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• 2010

Resistance trimming and cutting processes of printed circuit board by making use of high power UV laser with nano-second pulse width have been proposed and investigated experimentally. Also laser-based application system with high flexibility and complex has been designed and adopted power controller, auto beam size control, auto-focusing and control program developed for ourselves. The function of each module shows that they can be reliable for industrial equipments. Resistance trimming method used a plunge and double cut process with $20{\mu}m$ spot size beam. Results show that double cut process is more effective to control resistance trimming in precision than plunge cut process.

• Current Optics and Photonics
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• v.7 no.6
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• pp.701-707
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• 2023

In laser imaging, accurate extraction of the laser's center is essential. Several methods exist to extract the laser's center in an image, such as the geometric mean, the parabolic curve fitting, and the Gaussian curve fitting, etc. The Gaussian curve fitting is the most suitable because it is based on the physical properties of the laser. The width of the Gaussian laser beam depends on the distance from the laser source to the target object. It is assumed in general that the distance remains constant at a laser spot resulting in a symmetric Gaussian model for the laser image. However, on a curved surface of the object, the distance is not constant; The laser beam is narrower on the side closer to the focal point of the laser light and wider on the side closer to the laser source, which causes the distribution of the laser beam to skew. This study presents a modified Gaussian model in the laser imaging to incorporate the slant angle of a curved object. The proposed method is verified with simulation and experiments.

• Current Optics and Photonics
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• v.3 no.5
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• pp.445-450
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• 2019

The influence of high-power laser diode (HPLD) emitter width on the device performance is investigated for 975-nm (In,Ga)(As,P)/(Al,Ga)As broad-area HPLDs, using self-consistent electro-thermal-optical simulation. To guarantee the simulation's accuracy, simulated results are matched with the measured results for a sample HPLD with fitting parameters. The influences of HPLD emitter width on temperature distribution, output power, and the beam product parameter (BPP) are analyzed for three different emitter widths of 50, 70, and $90{\mu}m$. It is found that a device with smaller emitter width exhibits both thermal rollover and thermal blooming at lower output power, but smaller BPP.