• Tribology and Lubricants
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• v.34 no.6
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• pp.209-216
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• 2018

Sapphire is a substrate material that is widely used in optical and electronic devices. However, the processing of sapphire into a substrate takes a long time owing to its high hardness and chemical inertness. In order to process the sapphire ingot into a substrate, ingot growth, multiwire sawing, lapping, and polishing are required. The lap grinding process using pellets is known as one of the ways to improve the efficiency of sapphire substrate processing. The lap grinding process ensures high processing efficiency while utilizing two-body abrasion, unlike the lapping process which utilizes three-body abrasion by particles. However, the lap grinding process has a high material removal rate (MRR), while its weakness is in obtaining the required surface roughness for the final polishing process. In this study, we examine the effects of free abrasives in lap grinding on the material removal characteristics of sapphire substrate. Before conducting the lap grinding experiments, it was confirmed that the addition of free abrasives changed the friction force through the pin-on-disk wear test. The MRR and roughness reduction rate are experimentally studied to verify the effects of free abrasive concentration on deionized water. The addition of free abrasives (colloidal silica) in the lap grinding process can improve surface roughness by three-body abrasion along with two-body abrasion by diamond grits.

• Tribology and Lubricants
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• v.35 no.6
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• pp.323-329
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• 2019

Sapphire is currently used as a substrate material for blue light-emitting diodes (LEDs). The market for sapphire substrates has expanded rapidly as the use of LEDs has extended into various industries. However, sapphire is classified as one of the most difficult materials to machine due to its hardness and brittleness. Recently, a lap-grinding process has been developed to combine the lapping and diamond mechanical polishing (DMP) steps in a single process. This paper studies, the effect of wafer surface roughness on the chemical mechanical polishing (CMP) process by pressure and abrasive concentration in the lap-grinding process of a sapphire wafer. In this experiment, the surface roughness of a sapphire wafer is measured after lap-grinding by varying the pressure and abrasive concentration of the slurry. CMP is carried out under pressure conditions of 4.27 psi, a plate rotation speed of 103 rpm, head rotation speed of 97 rpm, and slurry flow rate of 170 ml/min. The abrasive concentration of the CMP slurry was 20wt, implying that the higher the surface roughness after lapgrinding, the higher the material removal rate (MRR) in the CMP. This is likely due to the real contact area and actual contact pressure between the rough wafer and polishing pad during the CMP. In addition, wafers with low surface roughness after lap-grinding show lower surface roughness values in CMP processes than wafers with high surface roughness values; therefore, further research is needed to obtain sufficient surface roughness before performing CMP processes.

• Journal of Technologic Dentistry
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• v.9 no.1
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• pp.51-55
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• 1987

One of the primary advantages of acrylic resin teeth is their ability to bond chemically to the denture base resins. Fracture od acrylic resin teeth from a maxillary denture, however, is not uncommon. Bonding failures have been attributed to faulty boil-out procedures that fail to eliminate all traces of wax from the ridge lap surfaces of the teeth and to contamination of the ridge lap surface by careless application of tinfoil substitute. Attempts to increase the strength of the bond between acrylic resin teeth and heat-cured denture base resin include grinding the glossy ridge lap surface (in fluid system), painting the ridgelap surface of the teeth with monomer-polymer solution, and cutting retention grooves in the ridge lap surface of the teeth. This latter method has been tested by applying a tensile force in a labial direction to the incisal part of the lingual surface of the acrylic resin teeth. A progressive shear compressive load was applied at an angle to the lingual surface of acrylic resin teeth bonded to denture base acrylic resin. No statistically singificant advantage was derived by preparing retention grooves of different shapes in the ridgelap surface of the denture teeth.

• Tribology and Lubricants
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• v.32 no.2
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• pp.50-55
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• 2016

Recently, a double-side machining process has been adopted in fabricating a sapphire glass to enhance the manufacturability. Double-side lap grinding (DLG) is one of the emerging processes that can reduce process steps in the fabrication of sapphire glasses. The DLG process uses two-body abrasion with fixed abrasives including pallet. This process is designed to have a low pressure and high rotational speed in order to obtain the required material removal rate. Thus, the temperature is distributed on the DLG platen during the process. This distribution affects the shape of the substrate after the DLG process. The coolant that is supplied into the cooling channel carved in the base platen can help to control the temperature distribution of the DLG platen. This paper presents the results of computational fluid dynamics with regard to the heat transfer in a DLG platen, which can be used for fabricating a sapphire glass. The simulation conditions were 200 rpm of rotational speed, 50℃ of frictional temperature on the pallet, and 20℃ of coolant temperature. The five cases of the coolant flow rate (20~36 l/min) were simulated with a tetrahedral mesh and prism mesh. The simulation results show that the capacity of the generated cooling system can be used for newly developed DLG machines. Moreover, the simulation results may provide a process parameter influencing the uniformity of the sapphire glass in the DLG process.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.27 no.5
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• pp.840-847
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• 2003

The bonding of adhesive joints of adhesive joints is influenced by the surface roughness of the joining Parts. However, the magnitude of the influence has not yet been clarified because of the complexity of the phenomena. In this study, it is shown that surface treatment affects adhesive strength and durability of alumina/polycarbonate single-lap .joints, and leading speed affects tensile-shea strength of adhesive Joints. To evaluate effect of surface treatments on the adhesive strength, several surface treatment methods are used, that is, cleaning, grinding, SiC polishing and sand blasting. It is shown that an optimum value of the surface roughness exists with respect to the tensile-shea strength of adhesive joints. The adhesive strength shows linear relationship with the surface roughness and loading speed. And the mechanical removal of disturbing films of lubricants, impurities and oxides make adhesive strength increase significantly.