• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.161-162
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• 2005

2G HTS coated conductor wire consists of textured substrate, buffer layer, superconduct layer, Ag cap layer, stabilizer. For practical application filed, coated conductor have mechanical and electrical stability and environment protection properties. This property Cu and stainless steel strip is laminated to Ag cap layer as stabilizer materials. Lamination process join stabilizer material strip and Ag cap layer with soldering method. we have laminated HTS with continuous dipping soldering process different stabilizer Cu and stainless steel strip and changed lamination process condition. The effect of lamination stabilizer and process condition has been investigated mechanical and electrical properties.

• 한국전기화학회:학술대회논문집
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• 1999.11a
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• pp.83-91
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• 1999

Technical advances in manufacturing techniques and applied technologies have been made for bi cell manufacture, and are currently being implemented in the areas of discrete electrode / bi cell assembly, and electrode / separator lamination. Not only have improvements been noted in the reliability of the mechanical assembly and the increase in yields and decrease in costs, battery electrical performance has also been enhanced thru these assembly techniques. Evidence has been shown that the lamination techniques can influence porosity and electrolyte dispersion, and therefore electrical performance and long term reliability of the cells.

• Steel and Composite Structures
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• v.16 no.3
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• pp.233-252
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• 2014

In this paper a computer program is developed for the determination of geometrical and material properties of composite thin-walled beams with arbitrary open cross-section and any arbitrary laminate stacking sequence. Theory of thin-walled composite beams is based on assumptions consistent with the Vlasov's beam theory and classical lamination theory. The program is written in Fortran 77. Some numerical examples are given, with complete information about input and output.

• Journal of the Korea Institute of Military Science and Technology
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• v.6 no.2
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• pp.65-72
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• 2003

Composite sabot can increase the penetration performance of APFSDS projectile by reduction of the sabot weight. However, it has a thick-sectioned lamination and the lamination structure is different from those of the conventional composite parts. In this study, modeling technique for a thick and radially-laminated composite part has been applied in the finite element analysis of composite sabot. Four models of composite lamination for the sabot have been proposed and evaluated for their structural strength.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1997.11a
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• pp.443-446
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• 1997

This paper presents green sheet Properties of multilayer chip filter for mobile communication. The role of solid loading content and lamination conditions in determining some of the green sheet properties are present. The optimun conditions were obtained solid loading 62:38, lamination temperature 7$0^{\circ}C$, lamination press 300~400 Kg/$\textrm{cm}^2$.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.05a
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• pp.67-70
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• 2007

LTCC (Low Temperature Co-fired Ceramic) has been emerged as a promising technology in packaging industry. In this technology the lamination and the sintering process are very important because they change the permittivity of ceramics and the dimension of metal pattern which have influences on electric property. In this paper we studied on influence of the permittivity and the dimension change by lamination pressure and sintering temperature of LTCC process. As a results, permittivity increase along with increasing of lamination pressure and sintering temperature.

• Transactions of Materials Processing
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• v.16 no.5 s.95
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• pp.396-400
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• 2007

LTCC(Low Temperature Co-fired Ceramic) which offers a good performance to produce multilayer structures with electronic circuits and components has emerged as an attractive technology in the electronic packaging industry. In LTCC module fabrication process, the lamination and the sintering are very important processes and affect the electrical characteristics of the final products because the processes change the permittivity of ceramics and the dimension of the circuit patterns which have influences on electronic properties. This paper discusses the influence of lamination pressure and sintering temperature on the permittivity and the dimensional change of LTCC products. In the present investigation, it is shown that the permittivity increases along with increasing of the lamination pressure and the sintering temperature.

• Journal of the Korean Ceramic Society
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• v.31 no.6
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• pp.595-600
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• 1994

Ni0.3Zn0.7Fe2O4 ferrite specimens were fabricated by dry pressing and tape casting method. The properties of each specimen were measured and compared. In order to design and manufacture the chip devices effectively, one important criterion can be that the sintered density of the laminated body should approach close to that of the dry pressed body which is regarded as standard. This requirement could be satisfied by controlling the solid loading of the ferrite sheet, lamination temperature and pressure. Using the optimum conditions (solid loading 55 wt%, lamination temperature 6$0^{\circ}C$, lamination pressure 400 kg/$\textrm{cm}^2$, sintered at 125$0^{\circ}C$ 2h) a sintered ferrite, with the density of 5.18g/㎤ and permeability of 1390 at 0.5 MHz, were obtained.

• Korean Journal of Computational Design and Engineering
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• v.8 no.4
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• pp.212-221
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• 2003

In order to reduce the lead-time and cost, the technology of rapid prototyping (RP) has been widely used. A new rapid prototyping process, transfer-type variable lamination manufacturing process by using expandable polystyrene foam (VLM-ST), has been developed to reduce building time, apparatus cost and additional post-processing. At the same time, VLM Slicer, the CAD/CAM software for VLM-ST has been developed. In this study, algorithms for accuracy improvement of VLM-ST, which include offset and overrun of a cutting path and generation of a reference shape are developed. Offset algorithm improves cutting accuracy, overrun algorithm enables the VLM-ST process to make a shape of sharp edge and reference shape generation algorithm adds additional shape which makes off-line lamination easier. In addition, proposed algorithms are applied to practical CAD models for verification.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2000.04a
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• pp.618-623
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• 2000

In order to increase the porductivity of electrical parts, manufacturing processes using progressive dies have been widely used in the industry. Motor cores have been fabricated using progressive stacking die with the lamination procedure for better electro-magnetic property. for the proper design of a process, a prediction of the process is required to obtain many design parameters. In this work, rigid-plastic finite element analysis is carried out in order to simulate the lamination this work, rigid-plastic finite element analysis is carried out in order to simulate the lamination process of the motor core. The effects of the embossing depth and the amount of deviation are investigated and compared with experiments. The forming process can then be predicted successfully from the results of analyses, which enables to design appropriately the die and the process.