• Elastomers and Composites
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• v.51 no.4
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• pp.280-285
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• 2016

The purpose of this study is to get optimum design and operation conditions of the heating rubber roller for laminating process. The cause of performance degradation of heating rubber roller is delamination of rubber on metal tube, rubber aging due to high temperature. We measured the material properties of thermal expansion, thermal conductivity, specific heat and density and analyzed thermal distributions of rubber layer using finite element method. As a result of heat/flow analysis, the density distribution of heating coil must shorten the stabilization time by reducing the temperature deviation on the length direction at the temperature rising section after increasing the density of the area contacting with the laminate film at the center part which is an opposite of the current composition while enabling to maintain the temperature of heater to be consistent while maintaining the temperature deviation to be low when heat loss is created. Finally, we determined optimum heating method of heating rubber roller.

• The monthly packaging world
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• s.197
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• pp.79-83
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• 2009

• Proceedings of the Korean Society For Composite Materials Conference
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• 2005.04a
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• pp.141-145
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• 2005

Since the electromagnetic properties of fiber reinforced polymeric laminate composite can be tailored effectively by adjusting its composition and regulating the stacking sequence, it is plausible material for fabricating the radar absorbing structures (RAS) of desired performance. In order to design the effective electromagnetic wave (EM) absorber with the fiber reinforced polymeric laminate composite, its electromagnetic characteristics should be available and could be regulated easily in the target frequency bands. In this study, dielectric characteristics of the E-glass/epoxy laminate composites were measured by the free space method in the X-band frequency range ($8.2\;{\sim}\;12.4\;GHz$). In order to describe the dielectric behavior of laminate composites of arbitrary stacking sequences, the equivalent circuit model and the laminating equations for estimating dielectric properties were proposed, and experimentally verified. From the comparison of the predicted and measured data, the proposed method predicted well the experimentally measured data.

• Journal of Korean Association for Spatial Structures
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• v.11 no.4
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• pp.101-108
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• 2011

Glass Reinforced Plastic(GRP) shows very high strength, comparing to the lightness of material. And the effect of transparency or semitransparency can be obtained by this material. However, due to the hand laminating for the GRP, the material properties can not be credible. Thus, the material test of GRP must be performed before the structural design. In this paper, material tests were performed for the design of the artistic column with 30m high and 4mm thickness. And the results of tests could be compared with DIN to evaluate the material properties for the application on the column.

• Air Cleaning Technology
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• v.26 no.4
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• pp.21-25
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• 2013

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 1998.05a
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• pp.73-73
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• 1998

• Textile Coloration and Finishing
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• v.25 no.1
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• pp.70-74
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• 2013

For amine gas detection, we incorporated two well-known isomers, 2-chloro-3,5-dinitro-benzotrifluoride and 4-chloro-3,5-dinitro-benzotrifluoride, in polyurethanes. Nanoweb and thin film were prepared by electrospinning and lamination, respectively, in order to compare their sensing behaviors. Moreover, we studied photophysical property using UV-Vis spectrometer and observed surface area through scanning electron microscope to compare between the Nanoweb and thin film. We found out that nanowebs exhibited high sensitivity specifically to primary amine gas.

• Journal of the Korea Furniture Society
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• v.18 no.1
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• pp.20-30
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• 2007

This experiment was carried out to investigate the effects of number and location of finger joints on the bending strength of glue-laminated lumbers. Urea resin adhesives were used in this experiment and the resin content was 70% for cold pressing. The lamina were edge-jointed and end-jointed. The specimen were composed of one or three layers. The obtained results are summarized as follows; The effects of finger joints on the decrease of bending strength of glue laminated woods were different according to the number and location of finger joints. The decrease of MOR was highest on the middle position of laminated woods. The effects of several arrangements of finger joints on the bending strength of glue laminated woods showed on Figure 7 and 8. The variance of thickness-laminating on the bending strength of glue laminated woods were larger than those of width-laminating.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.169-173
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• 2003

We demonstrated the applicability of dry film photoresist (DFR) in photolithography process for fine pitch solder bumping on the polytetrafluoroethylene (PTFE/Teflon) printed circuit board (PCB). The copper lines were formed with $100\;{\mu}m$ width and $18\;{\mu}m$ thickness on the PTFE test board, and varying the gaps between two copper lines in a range of $100-200\;{\mu}m$. The DFRs of $15\;{\mu}m$ thickness were laminated by hot roll laminator, by varying laminating temperature from $100^{\circ}C\;to\;150^{\circ}C$ and laminating speed. We found the optimum process of DFR lamination on PTFE PCB and accomplished the formation of indium solder bumps. The optimum lamination condition was temperature of $150^{\circ}C$ and speed of about 0.63 cm/s. And the smallest size of indium solder bump was diameter of $50\;{\mu}m$ with pitch of $100\;{\mu}m$.

• Transactions on Electrical and Electronic Materials
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• v.9 no.1
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• pp.33-37
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• 2008

This paper describes the development of a new $5.0{\times}3.2mm$ SAW filter bank which is consist of 12 L, C matching components and 4 SAW bare chips on PCB substrate with CSP technology. We improved the manufacturing cost by removing the ceramic package through direct flip bonding of $LiTaO_3$ SAW bare chip on PCB board after mounting L, C passive element on PCB board. After that we realized the hermitic sealing by laminating the epoxy film. To confirm the confidentiality and durability of the above method, we have obtained the optimum flip bonding & film laminating condition, and figured out material property and structure to secure the durability & moisture proof of PCB board. The newly developed super mini $5.0{\times}3.2mm$ filter bank shows the superior features than those of existing products in confidence, electrical, mechanical characters.