• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 1995.11a
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• pp.18-18
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• 1995

• Proceedings of the KWS Conference
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• 2006.05a
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• pp.33-35
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• 2006

The interactions between Cu/Sn-Ag-(Cu) and Sn-Ag-(Cu)/Ni interfacial reactions were studied during isothermal aging at $150^{\circ}C$ for up to 1000h using Cu(ENIG)/Sn-3.5Ag-(0.7Cu)/Cu(ENIG) sandwich solder joints. A typical scallop-type Cu-Sn intermetallic compound (IMC) layer formed at the upper Sn-Ag/Cu interface after reflowing, whereas a $(Cu,Ni)_6Sn_5$ IMC layer was observed at the Sn-Ag/ENIG interface. The Cu in the $(Cu,Ni)_6Sn_5$ IMC layer formed on the Ni side was sourced from the dissolution of the opposite Cu metal pad or Cu-Sn IMC layer. When the dissolved Cu arrived at the interface of the Ni pad, the $(Cu,Ni)_6Sn_5$ IMC layer formed on the Ni interface, preventing the Ni pad from reacting with the solder. Although a long isothermal aging treatment was performed at $150^{\circ}C$, no Ni was detected in the Cu-Sn IMC layer formed on the Cu side. Compared to the single Sn-Ag/ENIG solder joint, the formation of the $(Cu,Ni)_6Sn_5$ IMC layer of the Cu/sn-Ag/ENIG sandwich joint effectively retarded the Ni consumption from the electroless Ni-P layer.

• Transactions of Materials Processing
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• v.15 no.2 s.83
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• pp.112-117
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• 2006

Sliding wear mechanism of a high nitrogen austenitic 18Cr-18Mn-2Mo-0.9N steel has been investigated. Dry sliding wear tests of the steel were carried out at various loads of IN-10N under a constant sliding speed condition of 0.15m/s against AISI 52100 bearing steel balls. Solution ($1050^{\circ}C$) and isothermal aging ($900^{\circ}C$) heat treatments were performed on the steel and the effect of the heat treatments on the wear was investigated. Wear rates of the solution-treated steel specimen remained low until 5N load, and then increased abruptly at loads above 5N. The rates of isothermally aged specimens were low and increased gradually with the applied load. Worn surfaces, their cross sections, and wear debris of the steel specimens were examined with a scanning electron microscopy. Phases of the heat-treated specimen and the wear debris were identified using XRD. The transformed phase underneath a sliding track was investigated and analyzed using a TEM. Effects of the phase transformation during the wear and $Cr_{2}N$ precipitates formed during the isothermal aging on the wear of the austenitic steel were discussed.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.10a
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• pp.105-108
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• 2005

Sliding wear mechanism of a high nitrogen austenitic 18Cr-18Mn-2Mo-0.9N steel has been investigated. Dry sliding wear tests of the steel were carried out at various loads of 1N-10N under a constant sliding speed condition of 0.15m/s against AISI 52100 bearing steel balls. Solution $(1050^{\circ}C)$ and isothermal aging $(900^{\circ}C)$ heat treatments were performed on the steel and the effect of the heat treatments on the wear were investigated. Wear rates of the solution-treated steel specimen remained low until 5N, and then increased abruptly at loads above 5N. The rates of isothermally aged specimens were low and increased gradually with the applied load. Worn surfaces, their cross sections, and wear debris of the steel specimens were examined with a scanning electron microscopy. Phases of the heat-treated specimen and the wear debris were identified using XRD. Phases transformed underneath the sliding track during the wear were investigated and analyzed using TEM. Effects of the phase transformation during the wear and $Cr_2N$ precipitates formed during the isothermal aging on the wear of the austenitic steel were discussed.

• Journal of Powder Materials
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• v.2 no.3
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• pp.247-254
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• 1995

The theoretical optimum quaternary composition for improving the thermal stability of Al-Ti alloy was recently proposed. On the basis of the suggestion, quaternary Al-Ti-V-Zr alloy powders corresponding to the optimum compositions, one of which belongs to the region of the smallest lattice misfit between the matrix and the precipitates and the other belongs to the region of the smallest rate constant of coarsening, were prepared by mechanical alloying and the powders were vacuum-hot-pressed at $430^{\circ}C$ under the pressure of 800 MPa. The thermal stability of the specimens was evaluated by hardness testing after isothermal aging up to 400 hrs at various temperatures. The decrease of hardness of Al-Ti-V-Zr alloys was smaller than that of Al-Ti alloys. It was considered to be due to the formation of $Al_3Zr$ type and$Al_3Ti$ type quaternary precipitates having smaller lattice misfit than $Al_3Ti$ and the increase of volume fraction of All0v during the isothermal aging. The quaternary Al-Ti-V-Zr alloys corresponding to the smallest lattice misfit showed the most improved thermal stablilty and it was mainly considered to be due to the formation of All0v.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.53 no.5
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• pp.258-263
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• 2004

The purpose of this experiment is to modify diagnosis criterion of isothermal relaxation current(IRC) measurement equipment which is using for distribution cable diagnosis. We're using this system for several years in the field instead of DC leakage current measurement and lots of cables were replaced. But we have to investigate on the reliability of this equipment for our cables because we didn't carried out condition assessment of extracted cables after field diagnosis by this equipment. It is important thing for cable maintenance. If the replacement criterion is improper we can not prevent failures or will waste budget on account of replacement of the sound cables. In this paper we selected field installed cables and injected silicone fluid to the cables for insulation rehabilitation. In order to prove reliability of the diagnosis equipment we compared diagnosis results and AC breakdown strength according to operating time after silicone treatment. This is the results of the field test for 1 year.

• Journal of the Korean Society for Heat Treatment
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• v.35 no.4
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• pp.177-184
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• 2022

The present study aims to investigate the influence of Zn addition on hardness and microstructural characteristics of discontinuous precipitates (DPs) formed by isothermal aging in Mg-9%Al and Mg-9%Al-1%Zn alloys. To obtain large DPs volume fractions in the microstructure, the alloy specimens were solution-treated at 688 K for 24 h followed by water quenching, and then aged at 413 K for 48 h. The aged Mg-9%Al-1%Zn alloy had higher DPs content than the Mg-9%Al alloy, indicating that the Zn addition plays a beneficial role in enhancing age-hardening response. The DPs in the Zn-containing alloy possessed the higher hardness than those of the Zn-free alloy. Microstructural examination revealed that the increased hardness of the DPs resulting from the Zn addition is closely associated with the lower α-(Mg)/β(Mg₁₇Al₁₂) interlamellar spacing and the higher volume fraction of β phase layer of the DPs.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.3
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• pp.64-72
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• 2023

In this study, after transferring graphene on a Cu substrate and printing a Sn-3.0Ag-0.5Cu Pb-free solder paste on the Cu substrate, effects of the transferred graphene on formations and growths of intermetallic compound (IMC) at the interface between the Cu substrate and the solder were reported during processes of reflow soldering and isothermal aging for 1000 h with various temperatures (125, 150, and 175 ℃). Thicknesses of Cu₆Sn₅ and Cu₃Sn IMCs at the interfaces with graphene were decreased during the reflow soldering and isothermal aging processes compared to those without graphene. The transferred graphene layers also showed that the growth rate constant and square of growth rate constant which related to the growth mechanisms of Cu₆Sn₅ and Cu₃Sn IMCs with t he t emperature a nd t ime of t he i sothermal aging c ould dramatically decreased.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.3
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• pp.267-271
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• 2004

The joint strength and fracture surface of Sn-Pb solder bump in photo diode packages after isothermal aging testing were studied experimentally. Cu/Sn-Pb solders were adopted, and aged for up to 900 hours at 12$0^{\circ}C$ and 17$0^{\circ}C$ to analyze the effect of intermetallic compound(IMC). In 900-hour aging experiments, the maximum shea strength of Sn-Pb solder decreased by 20％ and 9％. The diffraction patterns of Cu$_{6}$Sn$_{5}$, scallop-shape IMC, and planar-shape Cu$_3$Sn were observed by Transmission Electron Microscopy (TEM).EM).

• Journal of Mechanical Science and Technology
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• v.18 no.10
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• pp.1730-1737
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• 2004

The BI (Ball Indentation) method has the potential to assess the mechanical properties and to replace conventional fracture tests. In this study, the effect of aging on mechanical behavior of 1Cr-1Mo-0.25V steels procured by isothermal aging heat-treatment at four different aging times in the range of 0～1820 hours at 630$^{\circ}C$, were investigated using BI system.