• KSCE Journal of Civil and Environmental Engineering Research
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• v.31 no.4A
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• pp.303-309
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• 2011

Laminated rubber bearing is the most commonly used device for seismic base isolation of bridge structures. It is important to know performance and behavior characteristics of the laminated rubber bearings. The main evaluation factors of the rubber bearing are classified as compressive, shear and tensile behavior characteristics. The reference data of compressive and shear characteristics are rich, but the reference data of tensile characteristics is scarce. In this study, tensile test results of the rubber bearing with variation of shape factor and shear deformation are investigated for mechanical property. When tensile deformation in normal condition is increasing, tensile cycle behavior curve becomes non-linear and tensile breaking point is 300%. On the other hand, tensile breaking point is shear deformation condition is about 40%. Furthermore, when shape factor is lower, tensile breaking point is decrease. This results mean that tensile breaking point is decreased in triaxial tensile deformation because of cracks caused by internal void of the rubber bearings. This experimental data can be used as the reference data of tensile characteristics for designing seismic isolation of structures.

• Smart Structures and Systems
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• v.24 no.3
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• pp.345-360
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• 2019

The shear keys are set in a seismic isolation system to resist the long-term service loadings, and are cut off to isolate the earthquakes. This paper investigated the influence of shear keys on the seismic performance of a vertical spring-viscous damper-concave Coulomb friction isolation system by an incremental dynamic analysis (IDA) and a performance-based assessment. Results show that the cutting off process of shear keys should be simulated in a numerical analysis to accurately predict the seismic responses of isolation system. Ignoring the cutting off process of shear keys usually leads to untrue seismic responses in a numerical analysis, and many of them are unsafe for the design of isolated structure. And those errors will be increased by increasing the cutting off force of shear keys and decreasing the spring constant of shear keys, especially under a feeble earthquake. The viscous damping action postpones the cutting off time of shear keys during earthquakes, and reduces the seismic isolation efficiency. However, this point can be improved by increasing the spring constant of shear keys.

• Journal of the Earthquake Engineering Society of Korea
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• v.7 no.3
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• pp.23-30
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• 2003

The seismic base isolation design approach has been reviewed and modified to fit the nonlinear static analysis procedure for determination of the performance point of structures in a simpler way, such an adaptation may be possible for the fact that a structural system under development of damage due to earthquake loading keeps softening to result in period shifting toward longer side. The superiority of the proposed method to the state-of-the-practice approach is that the reasonably accurate performance point can be obtained without constructing the so-called acceleration displacement response spectrum required in application of capacity spectrum method. The validity of the proposed approach was verified by comparing the predicted values to the exact ones presented in the literature.

• Transactions on Electrical and Electronic Materials
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• v.2 no.3
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• pp.24-27
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• 2001

The end point of oxide chemical mechanical polishing (CMP) have determined by polishing time calculated from removal rate and target thickness of oxide. This study is about control of oxide removal amounts on the shallow trench isolation (STI) patterned wafers using removal rate and thickness of blanket (non-patterned) wafers. At first, it was investigated the removal properties of PETEOS blanket wafers, and then it was compared with the removal properties and the planarization (step height) as a function of polishing time of the specific STI patterned wafers. We found that there is a relationship between the oxide removal amounts of blanket and patterned wafers. We analyzed this relationship, and the post CMP thickness of patterned wafers could be controlled by removal rate and removal target thickness of blanket wafers. As the result of correlation analysis, we confirmed that there was the strong correlation between patterned and blanket wafer (correlation factor: 0.7109). So, we could confirm the repeatability as applying for STI CMP process from the obtained linear formula. As the result of repeatability test, the differences of calculated polishing time and actual polishing time was about 3.48 seconds. If this time is converted into the thickness, then it is from 104 $\AA$ to 167 $\AA$. It is possible to be ignored because process margin is about 1800 $\AA$.

• 한국신재생에너지학회:학술대회논문집
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• 2005.06a
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• pp.132-135
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• 2005

A modular photovoltaic PCS with high-frequency isolation is proposed. The proposed system consists of a SEPIC converter and a full-bridge inverter. Using the power slope versus voltage of the PV array, the MPPT controller is proposed that produces a smooth transition to the maximum power point. The disturbance of the line voltage is detected using a fast sensing technique. Experimental results obtained on a 500W prototype show high performance such as almost unity power factor, $90\%$ power efficiency, $3.6\%$ THD.

• Earthquakes and Structures
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• v.19 no.2
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• pp.129-144
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• 2020

In this study, the idea of damping force linearly proportional to horizontal isolation displacement is implemented into sloped rolling-type bearings in order to meet different seismic performance goals. In addition to experimentally demonstrating its practical feasibility, the previously developed analytical model is further modified to be capable of accurately predicting its hysteretic behavior. The numerical predictions by using the modified analytical model present a good match of the shaking table test results. Afterward, several sloped rolling-type bearings designed with linearly variable damping force are numerically compared with a bearing designed with conventional constant damping force. The initial friction damping force adopted in the former is designed to be smaller than the constant one adopted in the latter. The numerical comparison results indicate that when the horizontal isolation displacement does not exceed the designed turning point (or practically when subjected to minor or frequent earthquakes that seldom have a great displacement demand for seismic isolation), the linearly variable damping force design can exhibit a better acceleration control performance than the constant damping force design. In addition, the former, in general, advantages the re-centering performance over the latter. However, the maximum horizontal displacement response of the linearly variable damping force design, in general, is larger than that of the constant damping force design. It is particularly true when undergoing a horizontal isolation displacement response smaller than the designed turning point and designing a smaller value of initial friction damping force.

• Phonetics and Speech Sciences
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• v.5 no.2
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• pp.43-51
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• 2013

English native listeners have a tendency to treat strong syllables in a speech stream as the potential initial syllables of new words, since the majority of lexical words in English have a word-initial stress. The current study investigates whether Korean (L1) - English (L2) late bilinguals perceive strong syllables in English continuous speech as word onsets, as English native listeners do. In Experiment 1, word-spotting was slower when the word-initial syllable was strong, indicating that Korean listeners do not perceive strong syllables as word onsets. Experiment 2 was conducted in order to avoid any possibilities that the results of Experiment 1 may be due to the strong-initial targets themselves used in Experiment 1 being slower to recognize than the weak-initial targets. We employed the gating paradigm in Experiment 2, and measured the Isolation Point (IP, the point at which participants correctly identify a word without subsequently changing their minds) and the Recognition Point (RP, the point at which participants correctly identify the target with 85% or greater confidence) for the targets excised from the non-words in the two conditions of Experiment 1. Both the mean IPs and the mean RPs were significantly earlier for the strong-initial targets, which means that the results of Experiment 1 reflect the difficulty of segmentation when the initial syllable of words was strong. These results are consistent with Kim & Nam (2011), indicating that strong syllables are not perceived as word onsets for Korean listeners and interfere with lexical segmentation in English running speech.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2008.04a
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• pp.166-170
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• 2008

In this study, it proved that transfer path analysis is a proper technique to estimate the interior noise from comparing measured interior noise in case of 3 point supported engine mount system. And the simulation of the vibration isolation for active engine mount using FXLMS algorithm is performed. Also, it verified that reduction of estimated interior noise from transfer path analysis and simulation of the vibration isolation.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.52 no.10
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• pp.441-446
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• 2003

The chemical mechanical polishing (CMP) process is now widely employed in the ultra large scale integrated (ULSI) semiconductor fabrication. Especially, shallow trench isolation (STI) has become a key isolation scheme for sub-0.13/0.10${\mu}{\textrm}{m}$ CMOS technology. The most important issues of STI-CMP is to decrease the various defects such as nitride residue, dishing, and tom oxide. To solve these problems, in this paper, we studied the planarization characteristics using slurry additive with the high selectivity between $SiO_2$ and $Si_3$$N_4$ films for the purpose of process simplification and in-situ end point detection. As our experimental results, it was possible to achieve a global planarization and STI-CMP process could be dramatically simplified. Also, we estimated the reliability through the repeated tests with the optimized process conditions in order to identify the reproducibility of STI-CMP process.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.501-504
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• 1999

In the shallow trench isolation(STI) chemical mechanical polishing(CMP) process, the key issues are the optimized thickness control within- wafer-non-uniformity, and the possible defects such as nitride residue and pad oxide damage. These defects after STI CMP process were discussed to accomplish its optimum process condition. To understand its optimum process condition, overall STI related processes including reverse moat etch, trench etch, STI filling and STI CMP were discussed. It is represented that the nitride residue can be occurred in the condition of high post CMP thickness and low trench depth. In addition there are remaining oxide on the moat surface after reverse moat etch. It means that reverse moat etching process can be the main source of nitride residue. Pad oxide damage can be caused by over-polishing and high trench depth.