• Title/Summary/Keyword: ion plating

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The properties and wear behavior of HVOF spray coating layer of Co-alloy powder

  • Cho, Tong-Yul;Yoon, Jae-Hong;Kim, Kil-Su;Youn, Suk-Jo;Back, Nam-Ki;Chun, Hui-Gon
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.16 no.6
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    • pp.273-277
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    • 2006
  • High velocity of oxy-fuel (HVOF) thermal spray coating is progressively replacing the other classical hard coatings such as chrome plating and ceramic coating by the classical methods, since the very toxic $Cr^{6+}$ ion is well known as carcinogen causing lung cancer, and the ceramic coatings are brittle. Co-alloy T800 powder is coated on the Inconel 718 substrates by the HVOF coating procesess developed by this laboratory. For the study of the possibility of replacing of chrome plating, the wear properties of HVOF Co-alloy T800 coatings are investigated using the reciprocating sliding tester with a counter sliding SUS 304 ball both at room and at an elevated temperature of $1000^{\circ}F\;(538^{\circ}C)$. The possibility as durability improvement coating is studied for the application to the high speed spindles vulnerable to frictional heat and wear. Wear mechanisms at the reciprocating sliding wear test are studied far the application to the systems similar to the sliding test such as high speed spindles. Wear debris and frictional coefficients of T800 coatings both at room and at an elevated temperature of $538^{\circ}C$ are drastically reduced compared to those of non-coated surface of Inconel 718 substrates. Wear traces and friction coefficients of both coated and non-coated surfaces are drastically reduced at a high temperature of $538^{\circ}C$ compared with those at room temperature. These show that the coating is highly recommendable far the durability Improvement coating on the surfaces vulnerable to frictional heat and wear.

High Speed Cu Filling into Tapered TSV for 3-dimensional Si Chip Stacking (3차원 Si칩 실장을 위한 경사벽 TSV의 Cu 고속 충전)

  • Kim, In Rak;Hong, Sung Chul;Jung, Jae Pil
    • Korean Journal of Metals and Materials
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    • v.49 no.5
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    • pp.388-394
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    • 2011
  • High speed copper filling into TSV (through-silicon-via) for three dimensional stacking of Si chips was investigated. For this study, a tapered via was prepared on a Si wafer by the DRIE (deep reactive ion etching) process. The via had a diameter of 37${\mu}m$ at the via opening, and 32${\mu}m$ at the via bottom, respectively and a depth of 70${\mu}m$. $SiO_2$, Ti, and Au layers were coated as functional layers on the via wall. In order to increase the filling ratio of Cu into the via, a PPR (periodic pulse reverse) wave current was applied to the Si chip during electroplating, and a PR (pulse reverse) wave current was applied for comparison. After Cu filling, the cross sections of the vias was observed by FE-SEM (field emission scanning electron microscopy). The experimental results show that the tapered via was filled to 100% at -5.85 mA/$cm^2$ for 60 min of plating by PPR wave current. The filling ratio into the tapered via by the PPR current was 2.5 times higher than that of a straight via by PR current. The tapered via by the PPR electroplating process was confirmed to be effective to fill the TSV in a short time.

The Fabrication of HCD Ion Plating Apparatus and XPS Analysis on the Fine Color Changes of TiN Films on Stainless Steel (HCD 이온플레이팅 장치 제작 및 Stainless Steel 위에 TiN 박막의 미세색상변화에 따른 XPS분석)

  • Park, Moon Chan;Lee, Jong Geun;Choi, Kwang Ho;Cha, Jung Won;Kim, Eung Soon;Park, Jin Hong
    • Journal of Korean Ophthalmic Optics Society
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    • v.15 no.4
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    • pp.361-366
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    • 2010
  • Purpose: HCD ion plating apparatus by hollow cathod discharge method was fabricated and TiN films were deposited on stainless steel by this apparatus with increasing in $N_2$ gas flow and the fine color changes of TiN films were analyzed. Methods: The spectroradiometer and spectrophotometer were used to observe optically the fine color changes of TiN thin films, and XPS was used to analyze the compositions of TiN thin films with increasing in $N_2$ gas flow. Results: The color coordinate of TiN thin film with $N_2$ 120 sccm gas flow showed (0.382, 0.372) which had the mixed colors of gold and silver, and the color coordinate changed to the increasing value of (x,y) with increasing in $N_2$ gas flow which indicated the deep gold color. It was found that the slopes of the reflectances at 550nm were increased with increasing in $N_2$ gas flow. And from the Ti scans using XPS, it was found that the peak heights of 455 eV derived from TiN composition were increased with increasing in $N_2$ gas flow, while the peak heights of 459 eV from $TiO_2$ composition were decreased. Conclusions: The results obtained above were that the color of TiN film with 120 sccm $N_2$ gas flow had been observed from the mixed color of silver and gold due to TiC, $N_2$, TiN on the surface and TiN, $N_2$ inside film, and the color of TiN films changed a deep gold color with increasing in $N_2$ gas flow due to increasing TiN composition.

PREPARATION OF AMORPHOUS CARBON NITRIDE FILMS AND DLC FILMS BY SHIELDED ARC ION PLATING AND THEIR TRIBOLOGICAL PROPERTIES

  • Takai, Osamu
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2000.11a
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    • pp.3-4
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    • 2000
  • Many researchers are interested in the synthesis and characterization of carbon nitride and diamond-like carbon (DLq because they show excellent mechanical properties such as low friction and high wear resistance and excellent electrical properties such as controllable electical resistivity and good field electron emission. We have deposited amorphous carbon nitride (a-C:N) thin films and DLC thin films by shielded arc ion plating (SAIP) and evaluated the structural and tribological properties. The application of appropriate negative bias on substrates is effective to increase the film hardness and wear resistance. This paper reports on the deposition and tribological OLC films in relation to the substrate bias voltage (Vs). films are compared with those of the OLC films. A high purity sintered graphite target was mounted on a cathode as a carbon source. Nitrogen or argon was introduced into a deposition chamber through each mass flow controller. After the initiation of an arc plasma at 60 A and 1 Pa, the target surface was heated and evaporated by the plasma. Carbon atoms and clusters evaporated from the target were ionized partially and reacted with activated nitrogen species, and a carbon nitride film was deposited onto a Si (100) substrate when we used nitrogen as a reactant gas. The surface of the growing film also reacted with activated nitrogen species. Carbon macropartic1es (0.1 -100 maicro-m) evaporated from the target at the same time were not ionized and did not react fully with nitrogen species. These macroparticles interfered with the formation of the carbon nitride film. Therefore we set a shielding plate made of stainless steel between the target and the substrate to trap the macropartic1es. This shielding method is very effective to prepare smooth a-CN films. We, therefore, call this method "shielded arc ion plating (SAIP)". For the deposition of DLC films we used argon instead of nitrogen. Films of about 150 nm in thickness were deposited onto Si substrates. Their structures, chemical compositions and chemical bonding states were analyzed by using X-ray diffraction, Raman spectroscopy, X-ray photoelectron spectroscopy and infrared spectroscopy. Hardness of the films was measured with a nanointender interfaced with an atomic force microscope (AFM). A Berkovich-type diamond tip whose radius was less than 100 nm was used for the measurement. A force-displacement curve of each film was measured at a peak load force of 250 maicro-N. Load, hold and unload times for each indentation were 2.5, 0 and 2.5 s, respectively. Hardness of each film was determined from five force-displacement curves. Wear resistance of the films was analyzed as follows. First, each film surface was scanned with the diamond tip at a constant load force of 20 maicro-N. The tip scanning was repeated 30 times in a 1 urn-square region with 512 lines at a scanning rate of 2 um/ s. After this tip-scanning, the film surface was observed in the AFM mode at a constant force of 5 maicro-N with the same Berkovich-type tip. The hardness of a-CN films was less dependent on Vs. The hardness of the film deposited at Vs=O V in a nitrogen plasma was about 10 GPa and almost similar to that of Si. It slightly increased to 12 - 15 GPa when a bias voltage of -100 - -500 V was applied to the substrate with showing its maximum at Vs=-300 V. The film deposited at Vs=O V was least wear resistant which was consistent with its lowest hardness. The biased films became more wear resistant. Particularly the film deposited at Vs=-300 V showed remarkable wear resistance. Its wear depth was too shallow to be measured with AFM. On the other hand, the DLC film, deposited at Vs=-l00 V in an argon plasma, whose hardness was 35 GPa was obviously worn under the same wear test conditions. The a-C:N films show higher wear resistance than DLC films and are useful for wear resistant coatings on various mechanical and electronic parts.nic parts.

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Copper Filling to TSV (Through-Si-Via) and Simplification of Bumping Process (비아 홀(TSV)의 Cu 충전 및 범핑 공정 단순화)

  • Hong, Sung-Jun;Hong, Sung-Chul;Kim, Won-Joong;Jung, Jae-Pil
    • Journal of the Microelectronics and Packaging Society
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    • v.17 no.3
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    • pp.79-84
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    • 2010
  • Formation of TSV (Through-Si-Via) with an Au seed layer and Cu filling to the via, simplification of bumping process for three dimensional stacking of Si dice were investigated. In order to produce the via holes, the Si wafer was etched by a DRIE (Deep Reactive Ion Etching) process using $SF_6$ and $C_4F_8$ plasmas alternately. The vias were 40 ${\mu}m$ in diameter, 80 ${\mu}m$ in depth, and were produced by etching for 1.92 ks. On the via side wall, a dielectric layer of $SiO_2$ was formed by thermal oxidation, and an adhesion layer of Ti, and a seed layer of Au were applied by sputtering. Electroplating with pulsed DC was applied to fill the via holes with Cu. The plating condition was at a forward pulse current density of 1000 mA/$dm^2$ for 5 s and a reverse pulse current density of 190 mA/$dm^2$ for 25 s. By using these parameters, sound Cu filling was obtained in the vias with a total plating time of 57.6 ks. Sn bumping was performed on the Cu plugs without lithography process. The bumps were produced on the Si die successfully by the simplified process without serious defect.

Wastewater Recycling from Electroless Printed Circuit Board Plating Process Using Membranes (분리막을 이용한 무전해 PCB 도금 폐수의 재활용)

  • 이동훈;김래현;정건용
    • Membrane Journal
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    • v.13 no.1
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    • pp.9-19
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    • 2003
  • Membrane process was investigated to recover process water and valuable gold from washing water of electroless PCB plating processes. The filtration experiments were carried out using not only a RO membrane test cell to determine suitable membrane for washing water but also spiral wound membrane modules of nanofiltration and reverse osmosis for scale-up. At first, RO-TL(tap water, low pressure), RO-BL(brackish water, low pressure) and RO-normal(for water purifier) sheet membranes made by Saehan Co. were tested, and the performance of RO-TL membrane showed most suitable f3r recovery of soft etching, catalyst and Ni washing waters. As a result of RO test cell, the experiments for scale-up were carried out using RO-TL modules far water purifier at 7bar and $25^{\circ}C $The permeate flux fur Au washing water was about 30 LMH, but Au rejection was less than 80%. The permeate fluxes for Pd, Ni and soft etching washing water were about 22, 17 and 10 LMH, respectively. The Pd, Ni and Cu rejections showed more than 85, 97 and 98% respectively. The nanofiltration module for water purifier was introduced to recover Au selectively from Au, Ni and Cu ions in Au washing water. Most of Ni and Cu ions in the feed washing water were removed, and only Au ion was existed 81.9% in the permeate. Furthermore, Au ion in the permeate was concentrated and recovered by RO-TL membrane module. Finally, Au was also able to recover effectively by using 4 inch diameter spiral wound modules of NF and RO-TL membranes, in series.

Limitation of Nitrogen ion Implantation and Ionplating Techniques Applied for Improvement of Wear Resistance of Metallic Implant Materials (금속 임플란트 소재의 내마모성 향상을 위하여 적용되는 질소 이온주입 및 이온도금법의 한계)

  • 김철생
    • Journal of Biomedical Engineering Research
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    • v.25 no.2
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    • pp.157-163
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    • 2004
  • Nitrogen ion implantation and ion plating techniques were applied for improvement of the wear resistance of metallic implant materials. In this work, the wear dissolution behaviour of a nitrogen ion implanted super stainless steel (S.S.S, 22Cr-20Ni-6Mo-0.25N) was compared with those of S.S.S, 316L SS and TiN coated 316L SS. The amounts of Cr and Ni ions worn-out from the specimens were Investigated using an electrothermal atomic absorption spectrometry. Furthermore, the Ti(Grade 2) disks were coated with TiN, ZrN and TiCN by use of low temperature arc vapor deposition and the wear resistance of the coating layers was compared with that of titanium. The chemical compositions of the nitrogen ion implanted and nitride coated layers were examined with a scanting auger electron spectroscopy. It wat observed that the metal ions released from the nitrogen ion implanted S.S.S surface were significantly reduced. From the results obtained, it was shown that the nitrogen ion implanted zone obtained with 100 KeV ion energy was easily removed within 200,000 revolutions from a wear dissolution testing under a similar load condition when applied to artificial hip joint. The remarkable improvement in wear resistance weir confirmed by the nitrides coated Ti materials and the wear properties differ greatly according to the chemical composition of the coating layers. for specimens with the same coating thickness of about 3$\mu\textrm{m}$, TiCN coated Ti showed the highest wear resistance. However, after removing the coating layers, the wear rates of all nitrides coated Ti reverted to their normal rates of below 10,000 revolutions from Ti-disk-on-disk wear testing under the same load condition. From the results obtained, it is suggested that the insufficient depth of the 100 Kel N$\^$+/ ion implanted zone and of the nitrides coated layers of 3$\mu\textrm{m}$ are subject to restriction when used as frictional parts of load bearing implants.

Effects of TiN and ZrN Coating on Surface Characteristics of Orthodontic Wire (교정용 와이어의 표면특성에 미치는 TiN 및 ZrN 코팅영향)

  • Kim, W.G.;Kim, D.Y.;Choe, H.C.
    • Journal of the Korean institute of surface engineering
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    • v.41 no.4
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    • pp.147-155
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    • 2008
  • The dental orthodontic wire provides a good combination of strength, corrosion resistance and moderate cost. The purpose of this study was to investigate the effects of TiN and ZrN coating on corrosion resistance and physical property of orthodontic wire using various instruments. Wires(round type and rectangular type) were used, respectively, for experiment. Ion plating was carried out for wire using Ti and Zr coating materials with nitrogen gas. Ion plated surface of each specimen was observed with field emission scanning electron microscopy(FE-SEM), energy dispersive X-ray spectroscopy(EDS), atomic force microscopy(AFM), vickers hardness tester, and electrochemical tester. The surface of TiN and ZrN coated wire was more smooth than that of other kinds of non-coated wire. TiN and ZrN coated surface showed higher hardness than that of non-coated surface. The corrosion potential of the TiN coated wire was comparatively high. The current density of TiN coated wire was smaller than that of non-coated wire in 0.9% NaCl solution. Pit nucleated at scratch of wire. The pitting corrosion resistance $|E_{pit}-E_{rep}|$ increased in the order of ZrN coated(300 mV), TiN coated(120 mV) and non-coated wire(0 mV).

Improved Coating Process for Enhanced Wear Resistance of CrAl Coated Claddings for Accident Tolerant Fuel (공정 개선에 따른 사고저항성 CrAl 코팅 피복관의 내마모성 향상)

  • Kim, Sung Eun;Lee, Young-Ho;Kim, Dae Ho;Kim, Hyun-Gil
    • Tribology and Lubricants
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    • v.38 no.4
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    • pp.136-142
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    • 2022
  • This paper investigates the enhanced wear performance of a CrAl coated accident tolerant fuel (ATF) cladding. In the wake of the Fukushima accident, extensive research on ATF with respect to improving the oxidation resistance of cladding materials is ongoing. Since coated Zr claddings can be applied without major changes to the criteria for reactor core design, many researchers are studying coatings for claddings. To improve the quality of the CrAl coating layer, optimization of the manufacturing process is imperative. This study employs arc ion plating to obtain improved CrAl coated claddings using CrAl binary alloy targets through an improved coating method. Surface roughness and adhesion are improved, and droplets are reduced. Furthermore, the coated layer has a dense and fine microstructure. In scratch tests, all the tested CrAl coated claddings exhibit a superior resistance compared to the Zr cladding. In a fretting wear test, the wear volume of the CrAl coated claddings is smaller compared to the Zr cladding. Furthermore, the coated cladding manufactured through the improved process exhibits better wear resistance than other CrAl coated claddings. Based on these results, we suggest that fine microstructure is attributed to a mechanically and microstructurally robust CrAl coating layer, which enhances wear resistance.

Antibacterial Properties of TiAgN and ZrAgN Thin Film Coated by Physical Vapor Deposition for Medical Applications

  • Kang, Byeong-Mo;Lim, Yeong-Seog;Jeong, Woon-Jo;Kang, Byung-Woo;Ahn, Ho-Geun
    • Transactions on Electrical and Electronic Materials
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    • v.15 no.5
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    • pp.275-278
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    • 2014
  • We deposited TiAgN and ZrAgN nanocomposite coatings on pure Titanium specimens, by using arc ion plating (AIP) with single alloy targets. TiAg ZrAg alloy targets of 5 wt.%, 10 wt.% silver content by vacuum arc remelting (VAR), followed by homogenization for 2 hours at $1,100^{\circ}C$ in non-active Ar gas atmosphere and characterized these samples for morphology and chemical composition. We investigated the biocompatibility of TiAg and ZrAg alloys by examining the proliferation of L929 fibroblast cells by MTT test assay, after culturing the cells ($4{\times}10^4cells/cm^2$) for 24 hours; and exploring the antibacterial properties of thin films by culturing Streptococus Mutans (KCTC3065), using paper disk techniques. Our results showed no cytotoxic effects in any of the specimens, but the antibacterial effects against Streptococus Mutans appeared only in the 10 wt.% silver content specimens.