• 한국표면공학회지
• /
• 제34권2호
• /
• pp.125-134
• /
• 2001

($Ti_{1-x}$ $Cr_{x}$ )N coatings were deposited by an ion-plating method in a reactor with two separate metal sources, Ti and Cr. Ti was evaporated using an electron beam, while Cr evaporation was carried out by resistant heating. The Ti and Cr concentrations in the coatings were controlled by the Ti and Cr evaporation ratio. The coating hardness increased with increasing the Cr content(x) and showed a maximum value of 6,000 HK at around x=0.8. The critical load of the coatings, measured by the scratch test, was around 30 N. The wear resistance properties of the ($Ti_{1-x}$$Cr_{ x}$)N coatings were evaluated using a CSEM pin-on-disk type tribometer. A Cr-steel ball as well as a SiC ball, which had hardness values of 590 HK and 2,600 HK respectively, were used as the pin. After the wear test, the surface morphology, roughness and the concentration of the coatings were investigated, with the main focus being on the effect of wear debris and the transferred layer on the wear behavior.

• 멤브레인
• /
• 제4권2호
• /
• pp.106-112
• /
• 1994

$ZnSo_4{\cdot}7H_2O$에 의한 모델폐수에서 Zn 농도 및 pH를 변화하여 역삼투 실험하였고, Zn용액의 pH에 따라 아연의 제거율은 상당히 변화하였고, pH 3.0~11.5 범위에서 실험한 바 pH 8.3일 때가 아연제거율은 99.9% 이상, 투과 속도는 $1.49 {\times} 10^{-3}cm/sec$로 가장 큰 값을 보였다. 아연모델폐수에 Cyanide를 아연농도와 동량으로 첨가하였을 때, 아연은 99%, Cyanide는 93% 정도 제거가 가능하였다. 또한 첨가제로 음이온계면활성제 등을 첨가하여 실험한 결과, Membrane에서의 투과속도가 $0.76 {\times} 10^{-3}cm/sec$로 현저히 감소하였다.

• 한국표면공학회:학술대회논문집
• /
• 한국표면공학회 2009년도 추계학술대회 초록집
• /
• pp.119-120
• /
• 2009

진공증착 및 이온플레이팅 방법을 이용하여 냉간 압연된 강판상에 알루미늄 피막을 형성시킨 후, 증발율 및 증기분포 변화를 측정하고 각 증착방법에서의 증발율에 따른 증기분포 변화를 비교 및 검토하였다. 본 실험에서의 이온플레이팅은 증발원 근처에 이온화전극을 설치하는 방법으로 고전류 아크 방전을 유도하여 $10^{-4}$ Torr 이하에서도 기존의 이온플레이팅에 비해 높은 이온화율을 얻을 수 있는 아크방전 유도형 이온플레이팅 (Arc-induced Ion Plating; AIIP) 방법을 이용하였다. 전자빔을 이용하면서 알루미나 크루시블을 사용하여 알루미늄을 증발시킬 경우 분당 $2.0{\mu}m$ 이상의 높은 증발율을 얻을 수 있었으며, 이온플레이팅의 경우 이온화된 증기의 상호작용에 따른 산란 효과로 증발율이 다소 낮아짐을 알 수 있었다. $cos^n\phi$로 이루어지는 증기분포의 결정인자(n)의 값이 진공증착의 경우는 1에 근접하는 것으로 나타났고 AIIP의 경우는 2 또는 그보다 더 큰 값으로 이루어지는 것을 확인하였다. 이로부터 이온플레이팅의 경우 불활성 가스의 존재 여부와 이온화율 또는 기판 바이어스 전압의 효과가 다른 조건에 비해 증기분포에 더 크게 영향을 미치는 것을 확인할 수 있었다.

• 한국표면공학회지
• /
• 제53권6호
• /
• pp.280-284
• /
• 2020

Electron beam irradiation is widely used as a type of surface modification technology to advance surface properties. In this study, the effect of electron beam irradiation on properties, such as surface hardness, wear resistance, roughness, and critical load of Titanium Aluminium nitride (TiAlN) films was investigated. TiAlN films were deposited on the SKD-61 substrate by using cathode arc ion plating. After deposition, the films were bombarded with intense electron beam for 10 minutes. The surface hardness was increased up to 4520 HV at electron irradiation energy of 1500 eV. In addition, surface root mean square (RMS) roughness of the films irradiated at 1500 eV shows the lowest roughness of 484 nm in this study.

• Corrosion Science and Technology
• /
• 제22권4호
• /
• pp.232-241
• /
• 2023

The mechanical properties of the hydrogen valve responsible for supplying and blocking hydrogen gas in a hydrogen fuel cell electric vehicle (FCEV) were researched. Mechanical properties by hydrogen embrittlement were investigated by coating chromium nitride (CrN) and titanium nitride (TiN) on aluminum alloy by arc ion plating method. The coating layer was deposited to a thickness of about 2 ㎛, and a slow strain rate test (SSRT) was conducted after hydrogen embrittlement to determine the hydrogen embrittlement resistance of the CrN and TiN coating layers. The CrN-coated specimen presented little decrease in mechanical properties until 12 hours of hydrogen charging due to its excellent resistance to hydrogen permeation. However, both the CrN and TiN-coated specimens exhibited deterioration in mechanical properties due to the peeling of the coating layer after 24 hours of hydrogen charging. The specimens coated at 350 ℃ presented a significant decrease in ultimate tensile strength due to abnormal grain growth.

• 한국표면공학회지
• /
• 제34권5호
• /
• pp.421-428
• /
• 2001

New WC-CrN superlattice film was deposited on Si substrate (500$\mu\textrm{m}$) using cathodic arc ion plating system. The microstructure and mechanical properties of the film depend on the superlattice period (λ). In the X-ray diffraction analysis (XRD), preferred orientation of microstructure was changed according to various superlattice periods(λ). During the Transmission Electron Microscope analysis (TEM), microstructure and superlattice period (λ) of the WC - CrN superlattice film was confirmed. Hardness and adhesion of the deposited film was evaluated by nanoindentation test and scratch test, respectively. As a result of nanoindentation test, the hardness of WC - CrN superlattice film was gained about 40GPa at superlattice period (λ) with 7nm. Also residual stress with various superlattice period (λ) was measured on Si wafer (100$\mu\textrm{m}$) by conventional beam-bending technique. The residual stress of the film was reduced to a value of 0.2 GPa by introducing Ti - WC buffer layers periodically with a thickness ratio ($t_{buffer}$/$t_{buffer+superlattice}$ ). To the end, for the evaluation of oxidation resistance at the elevated temperature, CrN single layer and WC - CrN superlattice films with various superlattice periods on SKD61 substrate was measured and compared with the oxidation resistance.

• 한국표면공학회지
• /
• 제56권5호
• /
• pp.335-340
• /
• 2023

Quinary component of 3㎛ thick Ti-Al-Si-Cu-N films were deposited onto WC-Co and Si wafer substrates by using an arc ion plating(AIP) system. In this study, the influence of copper(Cu) contents on the mechanical properties and microstructure of the films were investigated. The hardness of the films with 3.1 at.% Cu addition exhibited the hardness value of above 42 GPa due to the microstructural change as well as the solid-solution hardening. The instrumental analyses revealed that the deposited film with Cu content of 3.1 at.% was a nano-composites with nano-sized crystallites (5-7 nm in dia.) and a thin layer of amorphous Si₃N₄ phase.

• Bulletin of the Korean Chemical Society
• /
• 제33권5호
• /
• pp.1603-1607
• /
• 2012

The effects of plating process on the surface coverage of the accelerator were investigated in terms of Cu superfilling for device metallization. When a substrate having 500 nm-wide trench patterns on it was immersed in an electrolyte containing poly (ethylene glycol) (PEG)-chloride ion ($Cl^-$)-bis(3-sulfopropyl) disulfide (SPS) additives without applying deposition potential for such a time of about 100s, voids were generated inside of the electrodeposit. In time-evolved electrochemical analyses, it was observed that the process (immersion without applying potential) in the electrolyte led to the build-up of high initial coverage of SPS-Cl on the surface, resulting in the fast saturation of the coverage. Repeated experiments suggested that the fast saturation of SPS-Cl failed in superfilling while a gradual increase in the SPS-Cl coverage through competition with initially adsorbed PEG-Cl enabled it. Consequently, superfilling was achievable only in the case of applying the plating potential as soon as the substrate is dipped in an electrolyte to prevent rapid accumulation of SPS-Cl on the surface.

• 한국재료학회지
• /
• 제13권7호
• /
• pp.420-423
• /
• 2003

Coatings of TiCrN ion-plated on a steel substrate was oxidized at $800^{\circ}C$ in air, and their oxidation mechanism was presented. During oxidation, substrate elements and Ti and Cr in the coating always diffused outwardly to form the oxide scale. Simultaneously, oxygen from the atmosphere diffused inward1y to react with Ti and Cr to form $TiO_2$and $Cr_2$$O_3$, respectively. Also, the counter-diffusion of cations and oxygen resulted in some oxygen dissolution in the unoxidized TiCrN coating, and Fe dissolution in the oxide scale. When the Ti content in the coating was high, the $TiO_2$-forming tendency was strong, while when the Cr content was high, the $Cr_2$$O_3$-forming tendency was strong.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 1995년도 추계학술대회 논문집 학회본부
• /
• pp.472-474
• /
• 1995

A Sputter ion Plating(SIP) system with a r.f. coil electrode and the Facing Target Sputter(FTS) source was designed for high-quality thin film formation. The rf discharge was combined with DC facing target sputtering in order to enhance ionization degree of a sputtered atoms. The energy of ions incident on the substrate depended on the health potential of DC biased substrate. The mean impact ion energy increased with negative bias voltage and rf power. The adhesive force of the TiN film formed was in the range of 30$\sim$50N, and markedly influenced by substrate bias voltage.