• 제목/요약/키워드: ion plating

검색결과 322건 처리시간 0.024초

The properties and wear behavior of HVOF spray coating layer of Co-alloy powder

  • Cho, Tong-Yul;Yoon, Jae-Hong;Kim, Kil-Su;Youn, Suk-Jo;Back, Nam-Ki;Chun, Hui-Gon
    • 한국결정성장학회지
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    • 제16권6호
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    • pp.273-277
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    • 2006
  • High velocity of oxy-fuel (HVOF) thermal spray coating is progressively replacing the other classical hard coatings such as chrome plating and ceramic coating by the classical methods, since the very toxic $Cr^{6+}$ ion is well known as carcinogen causing lung cancer, and the ceramic coatings are brittle. Co-alloy T800 powder is coated on the Inconel 718 substrates by the HVOF coating procesess developed by this laboratory. For the study of the possibility of replacing of chrome plating, the wear properties of HVOF Co-alloy T800 coatings are investigated using the reciprocating sliding tester with a counter sliding SUS 304 ball both at room and at an elevated temperature of $1000^{\circ}F\;(538^{\circ}C)$. The possibility as durability improvement coating is studied for the application to the high speed spindles vulnerable to frictional heat and wear. Wear mechanisms at the reciprocating sliding wear test are studied far the application to the systems similar to the sliding test such as high speed spindles. Wear debris and frictional coefficients of T800 coatings both at room and at an elevated temperature of $538^{\circ}C$ are drastically reduced compared to those of non-coated surface of Inconel 718 substrates. Wear traces and friction coefficients of both coated and non-coated surfaces are drastically reduced at a high temperature of $538^{\circ}C$ compared with those at room temperature. These show that the coating is highly recommendable far the durability Improvement coating on the surfaces vulnerable to frictional heat and wear.

3차원 Si칩 실장을 위한 경사벽 TSV의 Cu 고속 충전 (High Speed Cu Filling into Tapered TSV for 3-dimensional Si Chip Stacking)

  • 김인락;홍성철;정재필
    • 대한금속재료학회지
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    • 제49권5호
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    • pp.388-394
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    • 2011
  • High speed copper filling into TSV (through-silicon-via) for three dimensional stacking of Si chips was investigated. For this study, a tapered via was prepared on a Si wafer by the DRIE (deep reactive ion etching) process. The via had a diameter of 37${\mu}m$ at the via opening, and 32${\mu}m$ at the via bottom, respectively and a depth of 70${\mu}m$. $SiO_2$, Ti, and Au layers were coated as functional layers on the via wall. In order to increase the filling ratio of Cu into the via, a PPR (periodic pulse reverse) wave current was applied to the Si chip during electroplating, and a PR (pulse reverse) wave current was applied for comparison. After Cu filling, the cross sections of the vias was observed by FE-SEM (field emission scanning electron microscopy). The experimental results show that the tapered via was filled to 100% at -5.85 mA/$cm^2$ for 60 min of plating by PPR wave current. The filling ratio into the tapered via by the PPR current was 2.5 times higher than that of a straight via by PR current. The tapered via by the PPR electroplating process was confirmed to be effective to fill the TSV in a short time.

HCD 이온플레이팅 장치 제작 및 Stainless Steel 위에 TiN 박막의 미세색상변화에 따른 XPS분석 (The Fabrication of HCD Ion Plating Apparatus and XPS Analysis on the Fine Color Changes of TiN Films on Stainless Steel)

  • 박문찬;이종근;최광호;차정원;김응순;박진홍
    • 한국안광학회지
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    • 제15권4호
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    • pp.361-366
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    • 2010
  • 목적: Hollow Cathode Discharge방법을 이용한 HCD 이온플레이팅 장비를 제작하였고, 이 장비를 이용하여 stainless steel 위에 TiN 박막을 질소 가스양을 변화하면서 코팅하였으며, 이때 TiN 박막의 미세색상변화를 분석하였다. 방법: 질소 가스에 대한 TiN박막의 미세색상변화를 광학적으로 관찰하기 위해 분광복사계와 분광광도계를 사용하였고, 질소 가스에 대한 TiN 박막의 성분 변화를 알기위해 XPS로 분석하였다. 결과: 질소가스 120 sccm의 TiN 박막의 CIE 색좌표는 (0.382, 0.372)로 은색과 금색의 혼합색으로 나타나고 질소 가스양이 증가함에 따라 x, y값 둘다 조금씩 커져 금색이 점점 진해지는 것을 알 수 있었다. 또한 분광광도계에 의한 TiN 박막의 반사율에 있어서 질소 가스양이 증가함에 따라 550 nm 파장근처에서의 반사율의 기울기가 대체적으로 점점 커지는 것을 알 수 있었다. 그리고 XPS를 사용하여 Ti scan 한 결과, $N_2$ 성분에서 유래된 458 eV의 조그마한 피크는 조금씩 더 들어가며 TiN 성분에서 유래된 455 eV의 큰 피크는 약간씩 커지는 것을 볼 수 있었다. 결론: 질소 가스양이 120 sccm인 TiN 박막에서는 표면에 있는 TiC 성분과 표면과 내부에 존재하는 $N_2$, TiN 성분으로 인해 은색과 금색의 혼합색으로 나타났으나, 질소 가스양이 증가함에 따라 TiN 성분이 다른 성분에 비해 점점 많아져 금색이 점점 진해진 것으로 유추할 수 있었다.

PREPARATION OF AMORPHOUS CARBON NITRIDE FILMS AND DLC FILMS BY SHIELDED ARC ION PLATING AND THEIR TRIBOLOGICAL PROPERTIES

  • Takai, Osamu
    • 한국표면공학회:학술대회논문집
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    • 한국표면공학회 2000년도 추계학술발표회 초록집
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    • pp.3-4
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    • 2000
  • Many researchers are interested in the synthesis and characterization of carbon nitride and diamond-like carbon (DLq because they show excellent mechanical properties such as low friction and high wear resistance and excellent electrical properties such as controllable electical resistivity and good field electron emission. We have deposited amorphous carbon nitride (a-C:N) thin films and DLC thin films by shielded arc ion plating (SAIP) and evaluated the structural and tribological properties. The application of appropriate negative bias on substrates is effective to increase the film hardness and wear resistance. This paper reports on the deposition and tribological OLC films in relation to the substrate bias voltage (Vs). films are compared with those of the OLC films. A high purity sintered graphite target was mounted on a cathode as a carbon source. Nitrogen or argon was introduced into a deposition chamber through each mass flow controller. After the initiation of an arc plasma at 60 A and 1 Pa, the target surface was heated and evaporated by the plasma. Carbon atoms and clusters evaporated from the target were ionized partially and reacted with activated nitrogen species, and a carbon nitride film was deposited onto a Si (100) substrate when we used nitrogen as a reactant gas. The surface of the growing film also reacted with activated nitrogen species. Carbon macropartic1es (0.1 -100 maicro-m) evaporated from the target at the same time were not ionized and did not react fully with nitrogen species. These macroparticles interfered with the formation of the carbon nitride film. Therefore we set a shielding plate made of stainless steel between the target and the substrate to trap the macropartic1es. This shielding method is very effective to prepare smooth a-CN films. We, therefore, call this method "shielded arc ion plating (SAIP)". For the deposition of DLC films we used argon instead of nitrogen. Films of about 150 nm in thickness were deposited onto Si substrates. Their structures, chemical compositions and chemical bonding states were analyzed by using X-ray diffraction, Raman spectroscopy, X-ray photoelectron spectroscopy and infrared spectroscopy. Hardness of the films was measured with a nanointender interfaced with an atomic force microscope (AFM). A Berkovich-type diamond tip whose radius was less than 100 nm was used for the measurement. A force-displacement curve of each film was measured at a peak load force of 250 maicro-N. Load, hold and unload times for each indentation were 2.5, 0 and 2.5 s, respectively. Hardness of each film was determined from five force-displacement curves. Wear resistance of the films was analyzed as follows. First, each film surface was scanned with the diamond tip at a constant load force of 20 maicro-N. The tip scanning was repeated 30 times in a 1 urn-square region with 512 lines at a scanning rate of 2 um/ s. After this tip-scanning, the film surface was observed in the AFM mode at a constant force of 5 maicro-N with the same Berkovich-type tip. The hardness of a-CN films was less dependent on Vs. The hardness of the film deposited at Vs=O V in a nitrogen plasma was about 10 GPa and almost similar to that of Si. It slightly increased to 12 - 15 GPa when a bias voltage of -100 - -500 V was applied to the substrate with showing its maximum at Vs=-300 V. The film deposited at Vs=O V was least wear resistant which was consistent with its lowest hardness. The biased films became more wear resistant. Particularly the film deposited at Vs=-300 V showed remarkable wear resistance. Its wear depth was too shallow to be measured with AFM. On the other hand, the DLC film, deposited at Vs=-l00 V in an argon plasma, whose hardness was 35 GPa was obviously worn under the same wear test conditions. The a-C:N films show higher wear resistance than DLC films and are useful for wear resistant coatings on various mechanical and electronic parts.nic parts.

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비아 홀(TSV)의 Cu 충전 및 범핑 공정 단순화 (Copper Filling to TSV (Through-Si-Via) and Simplification of Bumping Process)

  • 홍성준;홍성철;김원중;정재필
    • 마이크로전자및패키징학회지
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    • 제17권3호
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    • pp.79-84
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    • 2010
  • 3차원 Si 칩 패키징 공정을 위한 비아 홀(TSV: Through-Si-Via) 및 Au 시드층 형성, 전기 도금을 이용한 Cu 충전기술과 범핑 공정 단순화에 관하여 연구하였다. 비아 홀 형성을 위하여 $SF_6$$C_4F_8$ 플라즈마를 교대로 사용하는 DRIE(Deep Reactive Ion Etching) 법을 사용하여 Si 웨이퍼를 에칭하였다. 1.92 ks동안 에칭하여 직경 40 ${\mu}m$, 깊이 80 ${\mu}m$의 비아 홀을 형성하였다. 비아 홀의 옆면에는 열습식 산화법으로 $SiO_2$ 절연층을, 스퍼터링 방법으로 Ti 접합층과 Au 시드층을 형성하였다. 펄스 DC 전기도금법에 의해 비아 홀에 Cu를 충전하였으며, 1000 mA/$dm^2$ 의 정펄스 전류에서 5 s 동안, 190 mA/$dm^2$의 역펄스 조건에서 25 s 동안 인가하는 조건으로 총 57.6 ks 동안 전기도금하였다. Si 다이 상의 Cu plugs 위에 리소그라피 공정 없이 전기도금을 실시하여 Sn 범프를 형성할 수 있었으며, 심각한 결함이 없는 범프를 성공적으로 제조할 수 있었다.

분리막을 이용한 무전해 PCB 도금 폐수의 재활용 (Wastewater Recycling from Electroless Printed Circuit Board Plating Process Using Membranes)

  • 이동훈;김래현;정건용
    • 멤브레인
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    • 제13권1호
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    • pp.9-19
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    • 2003
  • 무전해 PCB 도금 공정 수세액을 분리막으로 처리하여 투과수는 공업용수로 재사용하고 유가금속인 금(Au)을 회수하는 방법에 관하여 연구하였다. 역삼투 분리막 테스트 셀을 이용하여 수세액 처리에 적합한 분리막을 선정하였으며 scale-up을 위한 나권형 모듈 투과 실험을 실시하였다. 먼저, (주)새한에서 생산되는 RO-TL(tap water, low pressure), RO-BL(brackish water, low pressure), RO-normal(for water purifier)막으로 투과실험하였으며 그 중 RO-TL막이 soft etching, 촉매 및 Ni 수세액 처리에 우수한 것으로 판명되었다. 따라서 RO-TL막으로 제작한 나권형 가정용 정수기 모듈로 7bar, $25^{\circ}C$에서 scale-up 실험을 수행하였다. Au수세액의 투과 유속은 약 30 LMH로서 가장 높았으나 Au 제거율이 80% 미만이었다. Pd, Ni 및 soft etching 수세액의 투과유속은 각각 약 22, 17, 10 LMH 정도이며 Pd의 제거율은 85% 이상, Ni 및 Cu 제거율은 97% 이상이었다. 또한 Au, Ni 및 Cu 이온이 함유된 수세액 중 유가금속인 Au를 선택적으로 회수하기 위하여 NF막을 사용하였다. Au수세액 중 Ni 및 Cu 이온은 대부분 제거되었으며 투과액 중에 Au이온이 81.9% 존재하였고 계속하여 RO-TL막으로 Au를 농축 회수하였다. 마지막으로 4"직경의 NF 및 RO-TL 나권형 모듈을 연속적으로 사용하여 Au를 효과적으로 회수할 수 있음을 재확인하였다.인하였다.

금속 임플란트 소재의 내마모성 향상을 위하여 적용되는 질소 이온주입 및 이온도금법의 한계 (Limitation of Nitrogen ion Implantation and Ionplating Techniques Applied for Improvement of Wear Resistance of Metallic Implant Materials)

  • 김철생
    • 대한의용생체공학회:의공학회지
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    • 제25권2호
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    • pp.157-163
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    • 2004
  • 금속 임플란트 재료들의 마모저항을 향상시키기 위하여 질소 이온주입 및 이온도금 기술을 적용하였다. 질소 이온주입 된 초내식성 스테인리스강(S.S.S)의 마모이온용출 특성을 S.S.S, 316L SS, TiN코팅된 316S SS와 비교 평가하기 위하여 탄소로 원자흡수분광분석기를 이용하여 시편들로부터 마모용출된 Cr과 Ni 이온량을 측정하였다. 또한, 저온아크증착법을 이용하여 TiN, ZrN, TiCN코팅된 Ti(Grade 2)원반의 마모저항을 비교하였고, 질소이온주입 및 질화물 코팅된 표면충의 화학적 조성은 SAES(scanning Auger electron spectroscopy)를 이용하여 분석하였다. 질소 이온주입된 S.S.S 표면으로부터 마모에 의하여 용출된 Cr과 Ni 이온량은 표면처리하지 않은 스테인리스강들에 비하여 크게 감소하였다 그러나 인공고관절에 걸리는 하중조건 하에서 실행된 마모이온용출실험에서 이온에너지 100 KeV로 질소이온 주입된 표면층은 20만회 내에서 쉽게 제거되었다. 질화물 코팅된 Ti 시편들의 마모저항도 크게 향상되었고, 그 마모특성은 코팅층의 화학적 조성에 따라 크게 차이가 났다. 코팅두께 3Um의 코팅시편들 중 TiCN 코팅된 티타늄이 가장 높은 내마모 특성을 보였으나 같은 하중조건 하에서 disk(Ti)-on-disk 마모실험에서 그 질화물 코팅면들의 마모 무게감 소비는 1만회 아래에서 모두 Ti의 마모비와 유사하게 전환되었다. 본 실험으로부터 얻어진 연구결과에 의하면, 100 KeV 질소이온주입 및 두께 3$\mu\textrm{m}$의 길화코팅된 표면층의 경우 표면 경화충의 깊이가 충분치 않아 높은 하중을 받는 임플란트의 마찰부위에 사용하기에는 한계가 있음을 보였다.

교정용 와이어의 표면특성에 미치는 TiN 및 ZrN 코팅영향 (Effects of TiN and ZrN Coating on Surface Characteristics of Orthodontic Wire)

  • 김원기;김도영;최한철
    • 한국표면공학회지
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    • 제41권4호
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    • pp.147-155
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    • 2008
  • The dental orthodontic wire provides a good combination of strength, corrosion resistance and moderate cost. The purpose of this study was to investigate the effects of TiN and ZrN coating on corrosion resistance and physical property of orthodontic wire using various instruments. Wires(round type and rectangular type) were used, respectively, for experiment. Ion plating was carried out for wire using Ti and Zr coating materials with nitrogen gas. Ion plated surface of each specimen was observed with field emission scanning electron microscopy(FE-SEM), energy dispersive X-ray spectroscopy(EDS), atomic force microscopy(AFM), vickers hardness tester, and electrochemical tester. The surface of TiN and ZrN coated wire was more smooth than that of other kinds of non-coated wire. TiN and ZrN coated surface showed higher hardness than that of non-coated surface. The corrosion potential of the TiN coated wire was comparatively high. The current density of TiN coated wire was smaller than that of non-coated wire in 0.9% NaCl solution. Pit nucleated at scratch of wire. The pitting corrosion resistance $|E_{pit}-E_{rep}|$ increased in the order of ZrN coated(300 mV), TiN coated(120 mV) and non-coated wire(0 mV).

공정 개선에 따른 사고저항성 CrAl 코팅 피복관의 내마모성 향상 (Improved Coating Process for Enhanced Wear Resistance of CrAl Coated Claddings for Accident Tolerant Fuel)

  • 김성은;이영호;김대호;김현길
    • Tribology and Lubricants
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    • 제38권4호
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    • pp.136-142
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    • 2022
  • This paper investigates the enhanced wear performance of a CrAl coated accident tolerant fuel (ATF) cladding. In the wake of the Fukushima accident, extensive research on ATF with respect to improving the oxidation resistance of cladding materials is ongoing. Since coated Zr claddings can be applied without major changes to the criteria for reactor core design, many researchers are studying coatings for claddings. To improve the quality of the CrAl coating layer, optimization of the manufacturing process is imperative. This study employs arc ion plating to obtain improved CrAl coated claddings using CrAl binary alloy targets through an improved coating method. Surface roughness and adhesion are improved, and droplets are reduced. Furthermore, the coated layer has a dense and fine microstructure. In scratch tests, all the tested CrAl coated claddings exhibit a superior resistance compared to the Zr cladding. In a fretting wear test, the wear volume of the CrAl coated claddings is smaller compared to the Zr cladding. Furthermore, the coated cladding manufactured through the improved process exhibits better wear resistance than other CrAl coated claddings. Based on these results, we suggest that fine microstructure is attributed to a mechanically and microstructurally robust CrAl coating layer, which enhances wear resistance.

Antibacterial Properties of TiAgN and ZrAgN Thin Film Coated by Physical Vapor Deposition for Medical Applications

  • Kang, Byeong-Mo;Lim, Yeong-Seog;Jeong, Woon-Jo;Kang, Byung-Woo;Ahn, Ho-Geun
    • Transactions on Electrical and Electronic Materials
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    • 제15권5호
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    • pp.275-278
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    • 2014
  • We deposited TiAgN and ZrAgN nanocomposite coatings on pure Titanium specimens, by using arc ion plating (AIP) with single alloy targets. TiAg ZrAg alloy targets of 5 wt.%, 10 wt.% silver content by vacuum arc remelting (VAR), followed by homogenization for 2 hours at $1,100^{\circ}C$ in non-active Ar gas atmosphere and characterized these samples for morphology and chemical composition. We investigated the biocompatibility of TiAg and ZrAg alloys by examining the proliferation of L929 fibroblast cells by MTT test assay, after culturing the cells ($4{\times}10^4cells/cm^2$) for 24 hours; and exploring the antibacterial properties of thin films by culturing Streptococus Mutans (KCTC3065), using paper disk techniques. Our results showed no cytotoxic effects in any of the specimens, but the antibacterial effects against Streptococus Mutans appeared only in the 10 wt.% silver content specimens.