• 마이크로전자및패키징학회지
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• 제10권2호
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• pp.61-67
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• 2003

고집적 플립 칩 기술을 위한 $50{\mu}m$ 직경의 극미세 58Bi-42Sn 솔더 범프와 Au/Ni/Ti UBM의 계면 반응에 따른 금속간 화합물을 분석하였다. 증발증착법과 lift-off 방법으로 극미세 Bi-Sn 솔더 범프를 형성하고 급속열처리 장비를 이용하여 리플로 공정을 실시하였다. 리플로 공정에서의 냉각속도를 변화시키면서 제작한 솔더 범프의 표면과 단면을 주사전자현미경으로 관찰하였다 $Au(0.1{\mu}m)$/Ni/Ti UBM 위의 극미세 58Bi-42Sn 솔더 범프의 표면과 내부에서 facet 특성을 갖는 다각형의 금속간 화합물들이 다수 관찰되었다. 주사전자현미경의 EDS 분석과 X-선 회절분석으로 확인한 결과 이 금속간 화합물은 $(Au_xBi_yNi_{1-x-y})Sn_2$상임을 확인하였다.

• 한국재료학회지
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• 제25권6호
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• pp.269-273
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• 2015

The effect of adding Ca on the microstructural and mechanical properties of as-cast Mg-11Li-3Zn-1Sn(wt%) alloys were investigated. Mg-11Li-3Zn-1Sn-0.4Mn with different Ca additions (0.4, 0.8, 1.2 wt%) were cast under an $SF_6$ and $Co_2$ atmosphere at $720^{\circ}C$. The cast billets were homogenized at $400^{\circ}C$ for 12h and extruded at $200^{\circ}C$. The microstructural and mechanical properties were analyzed by OM, XRD, SEM, and tensile tests. The addition of Ca to the Mg-11Li-3Zn-1Sn-0.4Mn alloy resulted in the formation of $Ca_2Mg_6Zn_3$, MgSnCa intermetallic compound. By increasing Ca addition, the volume fraction and size of $Ca_2Mg_6Zn_3$ with needle shape were increased. This $Ca_2Mg_6Zn_3$ intermetallic compound was elongated to the extrusion direction and refined to fine particles due to severe deformation during hot extrusion. The elongation of the 0.8 wt% Ca containing alloy improved remarkably without reduction strength due to the formation of fine grain and $Ca_2Mg_6Zn_3$ intermetallic compounds by Ca addition. It is probable that fine and homogeneous $Ca_2Mg_6Zn_3$ intermetallic compounds played a significant role in the increase of mechanical properties.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2005년도 춘계학술발표대회 개요집
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• pp.54-56
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• 2005

Ultrasonic soldering using of Si-wafer to FR-4 PCB atroom temperature was investigated. Sn3.5Ag foil rolled $100{\mu}m$ was used for solder. The UBM of Si-die was Cu/ Ni/ Al from top to bottom and its thickness was $0.4{\mu}m$, $0.4{\mu}m$, $0.3{\mu}m$ respectively. Pad on FR-4 PCB comprised of Au/ Ni/ Cu from top to bottom and its thickness was $0.05{\mu}m$, $5{\mu}m$, $18{\mu}m$ respectively. The ultrasonic soldering time was changed from 0.5sec to 3.0sec and its power 1400W. As experimental result, reliable bond joint by ultrasonic at room temperature was obtained. The shear strength increased with soldering time up to 2.5 sec. That means at 2.5sec, the shear strength showed maximum rate of 65.23N. The strength decreased to 33.90N at 3.0 sec because the cracks generated along the intermetallic compound between Si-wafer and Sn-3.5mass%Ag solder. intermetallic compound produced by ultrasonic between the solder and the Si-die was $(Cu, Ni)_{6}Sn_{5}$ and the intermetallic compound between solder and pad on FR-4 was $(Ni, Cu)_{3}Sn_{4}$.

• 마이크로전자및패키징학회지
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• 제9권1호
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• pp.35-41
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• 2002

솔더 범프를 이용한 플립 칩 접속 기술은 시스템의 고속화, 고집적화, 소형화 요구 덴 마이크로 일렉트로닉스의 성능은 향상시키기 위해 필요한 기술이다. 본연구 에서는 Cr/Cr-Cu/cu UBM 구조에서 고 용융점 솔더 범프와 저 용융점 솔더 범프를-시효처리 후 전단 강도를 평가하였다. 계면에서 관찰된 금속간 화합물의 성장과 접합상태를 SEM과 TEM으로 분석하였으며, 유한요소법을 통하여 전단하중을 적용하였을때 집중되는 응력을 해석하였다. 실험결과 Sn-97wt%Pb와 Sn-37wt%Pb에서 900시간 시효 처리된 시편의 전단강도는 최대 값에서 각각 25%, 20% 감소하였다. 시효처리를 통해 금속간화합물인 $Cu_6/Sn_5$와 $Cu_3Sn$의 성장을 확인하였으며, 파단 경로는 초기의 솔더 내부에서 IMC층의 계면으로 이동하는 경향을 알 수 있었다.

• 한국재료학회지
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• 제15권7호
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• pp.439-443
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• 2005

The oxidation behavior and the thermal stability of nanocrystalline Al-25Ti-8Mn intermetallic compound were investigated. $Al_3Ti$ intermetallic compound, which has a potential for high temperature structural material, was fabricated by mechanical alloying(MA) with $8at.\%$ Mn to enhance the thermal stability and ductility. And Al-25Ti-8Mn intermetallic compound was sintered by spark plasma sintering(SPS) at $700^{\circ}C$. After sintering process, cubic $Ll_2$ structure was maintained without phase transformation and the grain size was about 50nm. To investigate the oxidation behavior of the specimens, thermal gravimetric analysis(TGA) was performed at 700, 800, 900, and $1000^{\circ}C$ for 24 h in $O_2$. As the temperature increased from $700^{\circ}C\;to\;900^{\circ}C$ the weight gain of specimens increased. However at $1000^{\circ}C$, unlike the oxidation behavior of $700^{\circ}C\;to\;900^{\circ}C$, the weight gain of specimen decreased drastically and the transition from linear rate region to parabolic rate region occurred rapidly due to the dense $\alpha-Al_2O_3$.

• 한국재료학회지
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• 제18권1호
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• pp.38-44
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• 2008

The micro-structural changes, strength characteristics, and micro-fractural behaviors at the joint interface between a Sn-4.0wt%Ag-0.5wt%Cu solder ball and UBM treated by isothermal aging are reported. From the reflow process for the joint interface, a small amount of intermetallic compound was formed. With an increase in the isothermal aging time, the type and amount of the intermetallic compound changed. The interface without an isothermal treatment showed a ductile fracture. However, with an increase in the aging time, a brittle fracture occurred on the interface due mainly to the increase in the size of the intermetallic compounds and voids. As a result, a drastic degradation in the shear strength was observed. From a microshear test by a scanning electron microscope, the generation of micro-cracks was initiated from the voids at the joint interface. They propagated along the same interface, resulting in coalescence with neighboring cracks into larger cracks. With an increase in the aging time, the generation of the micro-structural cracks was enhanced and the degree of propagation also accelerated.

• 방사성폐기물학회지
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• 제19권2호
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• pp.161-176
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• 2021

In this study, the electrochemical behavior of Sm on the binary liquid Al-Ga cathode in the LiCl-KCl molten salt system is investigated. First, the co-reduction process of Sm(III)-Al(III), Sm(III)-Ga(III), and Sm(III)-Ga(III)-Al(III) on the W electrode (inert) were studied using cyclic voltammetry (CV), square-wave voltammetry (SWV) and open circuit potential (OCP) methods, respectively. It was identified that Sm(III) can be co-reduced with Al(III) or Ga(III) to form Al_zSm_y or Ga_xSm_y intermetallic compounds. Subsequently, the under-potential deposition of Sm(III) at the Al, Ga, and Al-Ga active cathode was performed to confirm the formation of Sm-based intermetallic compounds. The X-ray diffraction (XRD) and scanning electron microscopy-energy dispersive spectroscopy (SEM-EDS) analyses indicated that Ga₃Sm and Ga₆Sm intermetallic compounds were formed on the Mo grid electrode (inert) during the potentiostatic electrolysis in LiCl-KCl-SmCl₃-AlCl₃-GaCl₃ melt, while only Ga₆Sm intermetallic compound was generated on the Al-Ga alloy electrode during the galvanostatic electrolysis in LiCl-KCl-SmCl₃ melt. The electrolysis results revealed that the interaction between Sm and Ga was predominant in the Al-Ga alloy electrode, with Al only acting as an additive to lower the melting point.

• 한국분말재료학회지
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• 제30권2호
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• pp.101-106
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• 2023

Liquid metal extraction (LME), a pyrometallurgical recycling method, is popular owing to its negligible environmental impact. LME mainly targets rare-earth permanent magnets having several rare-earth elements. Mg is used as a solvent metal for LME because of its selective and eminent reactivity with rare-earth elements in magnets. Several studies concerning the formation of Dy-Fe intermetallic compounds and their effects on LME using Mg exist. However, methods for reducing these compounds are unavailable. Fe reacts more strongly with B than with Dy; B addition can be a reducing method for Dy-Fe intermetallic compounds owing to the formation of Fe₂B, which takes Fe from Dy-Fe intermetallic compounds. The FeB alloy is an adequate additive for the decomposition of Fe₂B. To accomplish the former process, Mg must convey B to a permanent magnet during the decomposition of the FeB alloy. Here, the effect of Mg on the transfer of B from FeB to permanent magnet is observed through microstructural and phase analyses. Through microstructural and phase analysis, it is confirmed that FeB is converted to Fe₂B upon B transfer, owing to Mg. Finally, the transfer effect of Mg is confirmed, and the possibility of reducing Dy-Fe intermetallic compounds during LME is suggested.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2009년도 제40회 하계학술대회
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• pp.2067_2068
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• 2009

Resistivity changes and intermetallic growth after thermal aging of Matter tin-plated copper sheet for current collector in fuel cell were investigated to survey the diffusion of Cu into Sn in interface and surface. The results show that the intermetallic growth and resistivity depended on thermal aging temperature and dwell time. In Sn plate on a Cu substrate, $Cu_6Sn_5({\mu})$ and $Cu_3Sn({\varepsilon})$ intermetallics layer were formed at plate/substrate interface. $Cu_6Sn_5({\mu})$ intermetallics layer gradually changed $Cu_3Sn({\varepsilon})$. Moreover Cu get through Sn layer and it was diffused in the surface at $200^{\circ}C$. On the other hand, only $Cu_3Sn({\varepsilon})$ intermetallics layer were formed at plate/substrate interface at $300^{\circ}C$. Consequently, the intermetallics formation, thermal condition and oxidation of surface, causes increase in the resistivity of Tin-plated copper sheet.

• Journal of Advanced Marine Engineering and Technology
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• 제37권7호
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• pp.711-717
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• 2013

Titanium (Ti) metal and its alloys are desirable materials for ship hulls and other structures because of their high strength, light weight and corrosion-resistance. And light weight and corrosion-resistant aluminum (Al) is the ideal metal for shipbuilding. The joining of Ti and Al dissimilar metals is one of the effective measures to reduce weight of the structures or to save rare metals. Ti and Al have great differences in materials properties, and intermetallic compounds such as Ti3Al, TiAl, TiAl3 are easily formed at the contacting surface between Ti and Al. Thus, welding or joining of Ti and Al is considered to be extremely difficult. However, it was clarified that ultra-high speed welding could suppress the formation of intermetallic compounds in the previous study. Results of tensile shear strength increases with an increase in the welding speed, and therefore extremely high welding speed (50m/min in this study) is good to dissimilar weldability for Ti and Al. In this study, therefore, full penetration dissimilar lap welding of Ti (upper) - Al (lower) and Al (upper) - Ti (lower) with single-mode fiber laser was tried at ultra-high welding speed, and the microstructure of the interface zones in the dissimilar Al and Ti weld beads was investigated.