• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.99-102
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• 2003

Reactions between 48Sn-52In solder and under bump metallurgies(UBM) such as 100nm $Ti/8{\mu}m$ Cu and 300nm Al/400nm Ni(V)/400nm Cu have been investigated, and the shear strength of 48Sn-52In solder bumps on each UBM has been evaluated. While intermetallic compounds with two different morphologies were continuously thickened on Ti/Cu with repeating the reflow process, the intermetallics on Al/Ni(V)/Cu spalled into the solder with increasing the number of reflow times. The solder bumps on Ti/Cu exhibited higher shear strength than those on Al/Ni(V)/Cu.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.133-137
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• 2003

The effect of Bi additions to the eutectic Sn-3.5Ag solder alloy on the growth kinetics of the intermetallic compound (IMC) layers during solid-state aging of Sn-Ag-Bi/Cu solder joints has been Investigated. The Bi additions enhanced the growth rate of the total IMC layer comprising of $Cu_6Sn_5$ and $Cu_3Sn$ sublayers. This enhanced IMC growth rate was primarily due to the rapid increase In the growth rate of $Cu_6Sn_5$ sublayer. The growth rate of $Cu_3Sn$ sublayers was little influenced and appeared to be retarded by the Bi additions. The observed growth behavior of $Cu_6Sn_5$ and $Cu_3Sn$ sublayers could be understood if the interfacial reaction barrier at the $Cu_6Sn_5/solder$ interface were reduced by the segregation of Bi at the interface.

• 마이크로전자및패키징학회지
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• 제17권3호
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• pp.59-63
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• 2010

Immersion Sn plating was produced on Cu foil by distributing nano-sized diamonds (ND). The ND distributed on the coating surface broke the continuity of Sn-oxide layer, therefore leading to penetrate the molten solder through the oxide and retarding the wettability degradation during a reflow process. Furthermore, the ND in the Sn coating played a role of diffusion barrier for Sn atoms and decreased the growth rate of intermetallic compound ($Cu_6Sn_5$) layer during the solid-state aging. The study confirmed the importance of ND to improve the wettability and reliability of the Sn plating. Complete dispersion of the ND within the immersion Sn plating needs to be further developed for the electronic packaging applications.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1996년도 하계학술대회 논문집 C
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• pp.1651-1653
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• 1996

As electrode materials like as Cu-Pb, Cu-Bi, WC-Ag, W-Ag for vacuum circuit breaker have high chopping current or bad insulation-recovery characteristics, it can affect induction machinery like as transformer and motor. To produce low surge electrode material, it have been suggested Co-Ag-Se electrode which were infiltrated with Ag-Se intermetallic compound into sintered Co matrix. In this study, we would like to represent that production method and microstructure of Co-Ag-Se electrode material. The microstructure and characteristics of Ag-Se intermetallic compound and Co-(Ag-Se) electrode were investigated by using SEM, XRD, EPMA.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.1337-1342
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• 2008

The whisker grows at the plating of a lead frame so that it causes the serious problem like the short. To prove this case, many people have studied the cause and influence of the tin whisker growth. This study explains the grain size affects the growth of the whisker in the lead frame. By these studies about the whisker, the whisker growth is discovered by stresses generated by the intermetallic compound and CTE mismatch in both plating and base metal. The stresses or lattice defect generated in the plating process changes grain structure of plating. Consequently, these various stresses are stabilized by forming unspecified whiskers through lots of grain boundaries. Because the grain boundary is the path of the whisker growth, the smaller grain size exists, the more whiskers grow.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1996년도 춘계학술대회 논문집
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• pp.123-128
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• 1996

As electrode materials like as Cu-Pb, Cu-Bi, WC-Ag, W-Ag for vacuum circuit breaker have high chopping current or bad insulation-recovery characteristics, it can affect induction machinery like as transformer and motor. To produce low surge electrode material, it have been suggested Co-Ag-Te electrode which were infiltrated with Ag-Te intermetallic compound into sintered Co matrix in vacuum. In this paper, we would like to represent that production method and microstructure of Co-Ag-Te electrode material in each condition. The microstructure and characteristics of Ag-Te intermetallic compound and Co-(Ag-Te) electrode were investigated by using optical microscope, SEM, XRD, EPMA.

• 한국표면공학회지
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• 제9권2호
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• pp.1-7
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• 1976

The dissolving and growth kinetics of intermetallic compounds for the reaction between solid iron and molten zinc were studied under nitorgen atmosphere over the temperature range between470$^{\circ}C$ and 680$^{\circ}C$. The rates of dissolution of solid iron into molten zinc were obtained under a static conditon, The amount of dissolution of sold iron and the growth of intermetalic compounds could be determined by means of microscopy. The thickness of intermetallic compound at a given temperature increases with increasing time, whereas for a given time decreases with increasing temperature . The rate of dissolution is controlled by the diffusion process of iron in the effective boundary layer of molten zinc over the temperature range 470$^{\circ}$-530$^{\circ}C$, 570$^{\circ}$-620$^{\circ}C$, and 650$^{\circ}$-665$^{\circ}C$, while by the surface reaction over the range 530$^{\circ}$-570$^{\circ}C$ and 620$^{\circ}$-650$^{\circ}C$.

• 한국생산제조학회지
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• 제20권2호
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• pp.145-150
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• 2011

There is problem to reduce the car body weight for improving fuel consumption and $CO_2$ generation. As one of the solution, the multi material car body concept using aluminum alloys and high strength steels is proposed recently. Therefore, new welding processes by which these dissimilar material can be joined in high reliability and productivity are demanded. Laser spot welding was developed for joining of dissimilar metals. In the present work, Laser spot welding of zinc coated steel and aluminum alloy was investigated, and the process parameters were studied. Otherwise, the influences of process parameters on the weldability, the formation of intermetallic compound layer and the mechanical properties have been investigated. When intermetallic compound layer thickness was more than 1mm, specimen was failure in the interface.

• Journal of Welding and Joining
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• 제16권4호
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• pp.117-124
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• 1998

During the reflow process in SMT, the molten solder has been observed to move upward and solidify along the gullwing lead, which is called the wicking phenomenon. In this paper, possible causes of the wicking are investigated, and its effects on the solder joint profile are quantitatively estimated by introducing the wicking constant. The free energy reduction by intermetallic formation between the copper and tin seems to be the major source of wicking action. The joint profiles of the gullwing lead are calculated using the previous finite element formulation incorporated with the wicking constant. The calculated results show reasonably good agreements with the experimental data when the wicking effects are considered.

• 한국자기학회:학술대회 개요집
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• 한국자기학회 2012년도 자성 및 자성재료 국제학술대회
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• pp.130-131
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• 2012

In this study, the thermodynamic and magnetic properties of alloying element substituted B2 FeAl systems have been investigated using the all-electron FLAPW method based on the GGA. It was shown that the important changes take place in the structural properties as well as in the magnetism when alloying element is substituted by Fe or Al site in B2 FeAl. Detailed discussion on the thermodynamic and magnetic properties and electronic structure of these intermetallic compounds will be given.