• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.17 no.3
• /
• pp.267-271
• /
• 2004

The joint strength and fracture surface of Sn-Pb solder bump in photo diode packages after isothermal aging testing were studied experimentally. Cu/Sn-Pb solders were adopted, and aged for up to 900 hours at 12$0^{\circ}C$ and 17$0^{\circ}C$ to analyze the effect of intermetallic compound(IMC). In 900-hour aging experiments, the maximum shea strength of Sn-Pb solder decreased by 20％ and 9％. The diffraction patterns of Cu$_{6}$Sn$_{5}$, scallop-shape IMC, and planar-shape Cu$_3$Sn were observed by Transmission Electron Microscopy (TEM).EM).

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 1995.03a
• /
• pp.90-106
• /
• 1995

The "O"S' BONDING make metallic and non-metalic crystal structures and form localized superconducting orbitals , which induce electrical conduction , semi-conduction, and superconduction. The orbitals are proced by Ampere's law, Faraday's law , Meissner effect, highcritical temperature of thecopper oxide layers. abnomal trans-membrane signal in cancer cell and plastic deformations bytwins and dislocations, In the case of alloying metals, the most deterimentla cases of electrical conduction are those of solid solution and intermetalic compound . The highest case for the hardness are also those of solid solution and intermetallic compound. It explains the contributions of the "O"S' BONDING for conduction bands and plastic deformation by twins and dislocations.ns and dislocations.

• Journal of the Korean institute of surface engineering
• /
• v.9 no.2
• /
• pp.1-7
• /
• 1976

The dissolving and growth kinetics of intermetallic compounds for the reaction between solid iron and molten zinc were studied under nitorgen atmosphere over the temperature range between470$^{\circ}C$ and 680$^{\circ}C$. The rates of dissolution of solid iron into molten zinc were obtained under a static conditon, The amount of dissolution of sold iron and the growth of intermetalic compounds could be determined by means of microscopy. The thickness of intermetallic compound at a given temperature increases with increasing time, whereas for a given time decreases with increasing temperature . The rate of dissolution is controlled by the diffusion process of iron in the effective boundary layer of molten zinc over the temperature range 470$^{\circ}$-530$^{\circ}C$, 570$^{\circ}$-620$^{\circ}C$, and 650$^{\circ}$-665$^{\circ}C$, while by the surface reaction over the range 530$^{\circ}$-570$^{\circ}C$ and 620$^{\circ}$-650$^{\circ}C$.

• Laser Solutions
• /
• v.14 no.4
• /
• pp.9-13
• /
• 2011

The solar panel that consists of copper plate and copper tube was successfully welded by ultrasonic seam welding. However it was not only expensive the copper material but also ultrasonic welding has many problem such as high error rate, difficulty of dissimilar material welding, noise, etc. At this study, the laser welding of solar panel with aluminum plate instead of copper. The welding were carried out with the pulsed Nd:YAG laser and the weld bead geometry was measured with the variation of pulse energy. Consequently, there was no difference between the ultrasonic and the laser welding on the performance of heat transfer capacities. Also the formation of intermetalic compound such as CuAl2 was increased with the pulse energy.

• Korean Journal of Materials Research
• /
• v.17 no.8
• /
• pp.402-407
• /
• 2007

In electronics manufacturing processes, soldering process has generally been used in surface mounting technology. Because of environmental restriction, lead free solders as like a SnAgCu ternary system are being used widely. After soldering process, the formation and growth of intermetalic compounds(IMCs) are formed in the interface between solder and Cu substrate as follows isothermal temperature and time. In this studies, therefore, we investigated the effects of the Cu substrate thickness on the IMC formation and growth of Sn-40Pb/Cu and Sn-3.0Ag-0.5Cu/Cu solder joints, respectively. The effect of the Cu thickness in PCB Cu pad and pure Cu plate was analyzed as measuring of thickness of each IMC. After solder was soldered on PCB and Cu plate which have different Cu thickness, we measured the IMC thickness in solder joints respectively. Also we compared with the effectiveness of Cu thickness on the IMC growth. From these results, we calculated the activation energy.

• Korean Journal of Metals and Materials
• /
• v.47 no.12
• /
• pp.811-818
• /
• 2009

In order to meet increasingly complex and rigorous technical specifications, extensive effort has been devoted to fabricate clad materials with multi-layered metal plates. In this study, novel stainless steel/aluminum/copper (STS/Al/Cu) three-ply clad materials were fabricated by a hot rolling process for cookware applications. The effect of the testing temperature on the mechanical properties of the clad materials and on each component metal was investigated during the tensile tests. The interface properties of the clad materials were also examined by optical microscopy (OM) and an electron probe micro-analyzer (EPMA). The best mechanical and interfacial properties for a warm working process were found in a sample annealed at a temperature of $300^{\circ}C$. For the sample annealed at $400^{\circ}C$, the results of the tensile test indicated that interface delamination occurred only in the region of the Al/Cu interfaces. This was due to the formation of the thick and brittle intermetallic compound of $Al_2Cu$ in the Al/Cu interface. In contrast, no interface delamination was observed in the STS/Al interface, most likely due to its strong bond strength.

• Journal of the Korean Vacuum Society
• /
• v.17 no.5
• /
• pp.466-472
• /
• 2008

Purple Gold is the alloy consisting of 78wt%Au-22wt%Al, and is expressed as a chemical formula, $AuAl_2$. Lately it is being used for the material of accessories or the decorative ornaments, being one of the colored golds having the peculiar purple color, like White Gold and Pink Gold. Purple Gold has the weak point in shaping through casting process due to the bad malleability and castability, being the intermetalic compound of Au and Al. Therefore, it is possible to produce the final product only by the cutting and the grinding process or to use it as a decorative coat with the thin film evaporation. This study implemented two kinds of thin film experiments. One is the case that heat treatment was made after Au and Al deposition evaporated separately with a weight ratio 78:22 on the 200nm$SiO_2$/Si substrate. The other is the case that the surface deposition was made through the vacuum evaporation, keeping the glass substrate temperature remain room temperature, using the bulk $AuAl_2$ as a source. The final film property was measured, focusing on the Purple Gold's color and thickness through the bare eye inspection, the microstructure analysis, the surface resistance analysis, the color difference analysis, and XRD analysis. Purple Gold was not formed, as the excessive surface agglomeration occurred, in case of being produced and treated thermally with 12.5nmAu/40nmAl/200nm$SiO_2$/Si structure. Our results suggest that of Purple Gold films, showing the same purple color as the bulk's, were successfully deposited with the direct thermal evaporation from the $AuAl_2$ bulk source.