• The korean journal of orthodontics
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• v.30 no.4 s.81
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• pp.483-490
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• 2000

The dental gold alloy shows a lower bond strength than the natural teeth in bracket bonding, and this can be a possible source of subsequent bond failure. This study aims to evaluate the effect of various gold alloy surface treatment techniques on shear bond strength between the orthodontic adhesives and the gold alloy and to find ways of increasing the bond strength. Two hundred and forty specimens made of the dental fold alloy were divided into twelve groups based on the combination of surface treatment methods(non-surface treatment, sandblasted, sandblasted plus tin-plated, and sandblasted plus intermediate adhesive) and adhesive systems (Ortho-one, Panavia 21, Superbond C&B). The specimens with bonded brackets were placed in distilled water at $37^{\circ}C$ for 24 hours and shear bond strength was measured by a universal testing machine. The results were as follows: 1. All surface-treated groups showed a significantly higher shear bond strength than non-surface-treated groups. 2. The sandblasted plus tin-plated group showed a significantly higher shear bond strength than the sandblasted group only when Panavia 21 was involved. 3. The sandblasted plus intermediate adhesive group showed a significantly higher shear bond strength than sandblasted group regardless of the type of adhesive used. 4. Of the three resin adhesive types, the Superbond C&B showed the highest bond strength, followed by Panavia 21 and Ortho-one. These findings suggest that a combination of sandblasting and intermediate resin treatment is desirable in order to enhance bracket bond strength regardless of adhesive types.

• Korean Journal of Materials Research
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• v.21 no.5
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• pp.283-287
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• 2011

As the performance of microelectronic devices is improved, the use of copper as a heat dissipation member is increasing due to its good thermal conductivity. The high thermal conductivity of copper, however, leads to difficulties in the joining process. Satisfactory bonding with copper is known to be difficult, especially if high shear and peel strengths are desired. The primary reason is that a copper oxide layer develops rapidly and is weakly attached to the base metal under typical conditions. Thus, when a clean copper substrate is bonded, the initial strength of the joint is high, but upon environmental exposure, an oxide layer may develop, which will reduce the durability of the joint. In this study, an epoxy adhesive formulation was investigated to improve the strength and reliability of a copper to copper joint. Epoxy hardeners such as anhydride, dihydrazide, and dicyandiamide and catalysts such as triphenylphosphine and imidazole were added to an epoxy resin mixture of DGEBA and DGEBF. Differential scanning calorimetry (DSC) analyses revealed that the curing temperatures were dependent on the type of hardener rather than on the catalyst, and higher heat of curing resulted in a higher Tg. The reliability of the copper joint against a high temperature and high humidity environment was found to be the lowest in the case of dihydrazide addition. This is attributed to its high water permeability, which led to the formation of a weak boundary layer of copper oxide. It was also found that dicyandiamide provided the highest initial joint strength and reliability while anhydride yielded intermediate performance between dicyandiamide and dihydrazide.