• 한국재료학회:학술대회논문집
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• 한국재료학회 2011년도 춘계학술발표대회
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• pp.41.2-41.2
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• 2011

Recently, scaling down of ULSI (Ultra Large Scale Integration) circuit of CMOS (Complementary Metal Oxide Semiconductor) based electronic devices become much faster speed and smaller size than ever before. However, very narrow interconnect line width causes some drawbacks. For example, deposition of conformal and thin barrier is not easy moreover metallization process needs deposition of diffusion barrier and glue layer. Therefore, there is not enough space for copper filling process. In order to overcome these negative effects, simple process of copper metallization is required. In this research, Cu-V thin alloy film was formed by using RF magnetron sputter deposition system. Cu-V alloy film was deposited on the plane $SiO_2$/Si bi-layer substrate with smooth and uniform surface. Cu-V film thickness was about 50 nm. Cu-V layer was deposited at RT, 100, 150, 200, and $250^{\circ}C$. XRD, AFM, Hall measurement system, and XPS were used to analyze Cu-V thin film. For the barrier formation, Cu-V film was annealed at 200, 300, 400, 500, and $600^{\circ}C$ (1 hour). As a result, V-based thin interlayer between Cu-V film and $SiO_2$ dielectric layer was formed by itself with annealing. Thin interlayer was confirmed by TEM (Transmission Electron Microscope) analysis. Barrier thermal stability was tested with I-V (for measuring leakage current) and XRD analysis after 300, 400, 500, 600, and $700^{\circ}C$ (12 hour) annealing. With this research, over $500^{\circ}C$ annealed barrier has large leakage current. However V-based diffusion barrier annealed at $400^{\circ}C$ has good thermal stability. Thus, thermal stability of vanadium-based thin interlayer as diffusion barrier is good for copper interconnection.

• Journal of Welding and Joining
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• 제13권3호
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• pp.106-115
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• 1995

To know the bonding phenomena of Ti/Cu brazed joint, a characteristic of microstructures in bonding interlayer of vacuum brazed pure Ti to Cu has been studied in the temperature range from 1088 to 1133K for various bonding times using Ag-28wt%Cu filler metal. Also intermediate phases formed in bonded interlayer and behavior of layer growth have been investigated. The obtained results in this study are as follows: 1) Liquid insert metal width at the each brazing temperature was proportional to the square root of brazing time, and it was considered that the liquid insert metal width was controlled by the diffusion rate process of primary .alpha.-Cu formed at the Ti side. 2) Intermediate phases formed near the Ti interface were .betha.-Ti and intermetallic compounds TiCu, Ti$_{2}$Cu, Ti$_{3}$Cu, and TiCu. 3) .betha.-Ti formed in Ti base metal durig brazing transformed to lamellar structure, .alpha.-Ti + Ti$_{2}$Cu. The structure came from the eutectoil decomposition reaction in cooling. And the width of .betha.-Ti layer was proportional to the square root of brazing time, and it was considered that the growth of .betha.-Ti layer was controlled by interdiffusion rate process in .betha.-Ti. 4) The layer growth of TiCu, Ti$_{3}$Cu$_{4}$ and TiCu, phases formed near the Ti interface was linerface was linearly proportional to the brazing time, and it was considered that the layer growth of these phases was controlled by the chemical reaction rate at the interface.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2017년도 춘계학술대회 논문집
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• pp.69-69
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• 2017

For several decades, industrial processes consume a huge amount of raw water for various objects that consequently results in the generation of large amounts of wastewater. There effluents are mainly treated by conventional technologies such are aerobic, anaerobic treatment and chemical coagulation. But, there processes are not suitable for eliminating all hazardous chemical compounds form wastewater and generate a large amount of toxic sludge. Therefore, other processes have been studied and applied together with these techniques to enhance purification results. These techniques include photocatalysis, absorption, advanced oxidation processes, and ozonation, but also have their own drawbacks. In recent years, electrochemical techniques have received attention as wastewater treatment process that show higher purification results and low toxic sludge. There are many kinds of electrode materials for electrochemical process, among them, boron doped diamond (BDD) attracts attention due to good chemical and electrochemical stability, long lifetime and wide potential window that necessary properties for anode electrode. So, there are many researches about high quality BDD, among them, researches are focused BDD on Si substrate. But, Si substrate is hard to apply electrode application due to the brittleness and low life time. And other substrates are also not suitable for wastewater treatment electrode due to high cost. To solve these problems, Ti has been candidate as substrate in consideration of cost and properties. But there are critical issues about adhesion that must be overcome to apply Ti as substrate. In this study, to overcome this problem, TiN interlayer is introduced between BDD and Ti substrate. TiN has higher electrical and thermal conductivity, melting point, and similar crystalline structure with diamond. The TiN interlayer was deposited by reactive DC magnetron sputtering (DCMS) with thickness of 50 nm, $1{\mu}m$. The microstructure of BDD films with TiN interlayer were estimated by FE-SEM and XRD. There are no significant differences in surface grain size despite of various interlayer. In wastewater treatment results, the BDD electrode with TiN (50nm) showed the highest electrolysis speed at livestock wastewater treatment experiments. It is thought to be that TiN with thickness of 50 nm successfully suppressed formation of TiC that harmful to adhesion. And TiN with thickness of $1{\mu}m$ cannot suppress TiC formation.

• Progress in Superconductivity
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• 제1권1호
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• pp.1-8
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• 1999

The magnetization and/or resistivity of high $T_c$ superconductors ($YBa_2Cu_3O_{7-\delta}$(YBCO) single crystal, $Bi_2Sr_2CaCu_2O_8$ (Bi-2212) single crystal, $Tl_2Ba_2CaCu_2O_8$ (Tl-2212) film, $HgBa_2Ca_2Cu_3O_8$ (Hg-1223) film) have been measured as a function of magnetic field H and temperature T. The extracted fluctuation part of the magnetization and conductivity exhibits a critical behavior consistent with the three-dimensional XY model. The dynamic critical exponent z does not sensitively vary with a type of the superconductors. The value of z ranges from 1.5 to $1.8{\pm}0.1$. However, the static critical exponent ${\nu}$ is the most largely increased in Tl-2212 that has a weaker interlayer coupling strength than YBCO; the value of ${\nu}$ is 0.669, 0.909, 1.19, and 1.338 for YBCO, Bi-2212, Hg-1223, and Tl-2212 respectively. The results indicate that the weak interlayer coupling along the c-axis of high $T_c$ superconductors near $T_c$ does not influence the dynamic critical exponent z (the same value of superfluid $^4He$), but significantly increases the static critical exponent ${\nu}$.

• Journal of Electrochemical Science and Technology
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• 제2권1호
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• pp.45-50
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• 2011

A series of expanded graphites is prepared from graphite oxide by changing the heat-treatment temperature, and their lithiation/de-lithiation mechanism and rate performance are examined. A featureless sloping profile is observed in their charge-discharge voltage and dilatometry profiles, which is contrasted by the stepwise plateau-like profiles observed with the pristine graphite. With an increase in the heat-treatment temperature from $250^{\circ}C$ to $850^{\circ}C$, the interlayer distance becomes smaller whereas the electric conductivity becomes larger, both of which are resulted from a removal of foreign atoms (mainly oxygen) from the interlayer gaps. The expanded graphite that is prepared by a heat-treatment at $450^{\circ}C$ delivers the best rate performance, which seems to be a trade-off between the $Li^+$ ion diffusivity that is affected by the interlayer distance and electrical conductivity.

• 한국안전학회지
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• 제25권6호
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• pp.86-91
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• 2010

The purpose of this study is to analyze the damage patterns and metal structure of 3 phase mold transformers collected from places where accidents have occurred. Compared to an oil-immersed transformer, a mold transformer has the advantage of requiring a smaller installation area and can be kept clean, while its disadvantages include the fact that abnormal symptoms of an accident are difficult to discover and its repair is impossible. The capacity of the mold transformers collected from places where accidents have occurred was 200kVA with primary voltages being F23,900V, R22,900V, 21,900V, 20,900V, 19,900V, etc., as well as secondary voltages being 380V, 220V, etc. It was found from the analysis on the diffusion of combustion in the damaged mold transformers that fire occurred first inside the U-phase primary winding and that carbonization and heat were diffused to V-phase and W-phase in V-pattern. In addition, from the analysis on the cross-sectional structure of the metal of the melted high voltage winding using a metallurgical microscope, it was found that the boundary surface, voids, and columnar structure were formed when an interlayer short-circuit had occurred Therefore, even though it is not possible to find the cause for the occurrence of an interlayer short-circuit at the inner side of the primary winding, it is thought that, due to the thermal energy generated when the short-circuit occurred, the heat source was diffused to the upper side and outside, causing a secondary accident.

• 한국표면공학회지
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• 제51권4호
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• pp.243-248
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• 2018

All solid state thin film batteries with two types of cell structure, Pt / $LiCoO_2$ / LiPON / Cu and Pt / $LiCoO_2$ / LiPON / $LiCoO_2$ / Cu, are prepared and their electrochemical performances are investigated to evaluate the effect of $LiCoO_2$ interlayer at the interface of LiPON / Cu. The crystallinity of the deposited $LiCoO_2$ thin films is confirmed by XRD and Raman analysis. The crystalline $LiCoO_2$ cathode thin film is obtained and $LiCoO_2$ as the interlayer appears to be amorphous. The surface morphology of Cu current collector after cycling of the batteries is observed by AFM. The presence of a 10 nm-thick layer of $LiCoO_2$ at the interface of LiPON / Cu enhances the interfacial adhesion and reduces the interfacial resistance. As a result, Li plating / stripping at the interface of LiPON / Cu during charge/discharge reaction takes place more uniformly on Cu current collector, while without the interlayer of $LiCoO_2$ at the interface of LiPON / Cu, the Li plating / stripping is localized on current collector. The thin film batteries with the interlayer of $LiCoO_2$ at the interface of LiPON / Cu exhibits enhanced initial coulombic efficiency, reversible capacity and cycling stability. The thickness of the anode current collector Cu also appears to be crucial for electrochemical performances of all solid state thin film batteries.

• 한국표면공학회지
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• 제54권3호
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• pp.119-123
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• 2021

SnO₂ single layer and SnO₂/Ag/SnO₂ (SAS) tri-layered films were deposited on the glass substrate by RF and DC magnetron sputtering at room temperature and then the effect of Ag interlayer on the opto-electrical performance of the films were considered. As deposited SnO₂ films show a visible transmittance of 85.5 % and a sheet resistance of 1.2×10⁴ Ω/□, the SAS films with a 15 nm thick Ag interlayer show a lower resistance of 18.8 Ω/□ and a visible transmittance of 70.6 %, respectively. The figure of merit based on the optical transmittance and sheet resistance revealed that the Ag interlayer in the SnO₂ films enhances the opto-electrical performance without substrate heating or annealing process.

• 한국건설관리학회논문집
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• 제23권5호
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• pp.23-33
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• 2022

공동주택의 하자소송 금액에서 가장 많은 비율을 차지하고 있는 균열하자는 하자판정 기준이 명확하지 않아 판결에 따라 하자에 관한 판단이 엇갈리고 있다. 균열하자 판결금액 대부분을 차지하는 층간균열은 균열의 폭이나 상태와 관계없이 모두 하자로 판정되는 추세이며, 보수공법 또한 대부분 일률적으로 정해지고 있다. 이는 균열하자 판정의 기준이 되는 국토교통부의 하자판정기준과 법원에서 기준을 삼는 건설감정실무의 기준이 일치하는 않는 문제에서 출발한다. 법령의 개정과 법원감정실무지침서의 개정 등을 통해 모든 이해관계자가 적용할 수 있는 하자판정 기준의 수립이 필요하다. 또한, 층간균열 보수공법 기준은 층간균열의 폭과 상태에 따라 공법을 적용할 필요성이 있다. 균열에 대한 하자판정과 보수공법적용을 합리화한다면 소송에만 의존하는 현재의 하자분쟁 추세를 바꿀 수 있는 계기가 될 수 있을 것이다.

• Geomechanics and Engineering
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• 재33권6호
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• pp.583-596
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• 2023

The interlayers, either softer or stiffer than the surrounding layers, are usually overlooked during field investigation due to the small thickness. They may be neglected through the analysis process for simplicity. However, they may significantly affect the dynamic behavior of the soil-foundation system. In this study, a series of 3D finite-element Direct-solution steady-state harmonic analyses were carried out using ABAQUS/CAE software to investigate the impacts of interlayers on the dynamic response of a cast in place pile group subjected to horizontal harmonic load. The experimental data of a 3×2 pile group testing was used to verify the numerical modeling. The effects of thickness, depth, and shear modulus of the interlayers on the dynamic response of the pile group are investigated. The simulations were conducted on both stiff and soft soils. It was found that the soft interlayers affect the frequency-amplitude curve of the system only in frequencies higher than 70% of the resonant frequency of the base soil. While, the effect of stiff interlayer in soft base soil started at frequency of 35% of the resonant frequency of the base soil. Also, it was observed that a shallow stiff interlayer increased the resonant amplitude by 11%, while a deep one only increased the resonant frequency by 7%. Moreover, a shallow soft interlayer increased the resonant frequency by 20% in soft base soils, whereas, it had an effect as low as 6% on resonant amplitude. Also, the results showed that deep soft interlayers increased the resonant amplitude by 17 to 20% in both soft and stiff base soils due to a reduction in lateral support of the piles. In the cases of deep thick, soft interlayers, the resonant frequency reduced significantly, i.e., 16 to 20%. It was found that the stiff interlayers were most effective on the amplitude and frequency of the pile group.