• Journal of Adhesion and Interface
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• v.7 no.2
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• pp.1-11
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• 2006

Interfacial evaluation of the untreated and treated Jute and Hemp fibers reinforced different matrix polypropylene-maleic anhydride polypropylene copolymer (PP-MAPP) composites were investigated by micromechanical technique and dynamic contact angle measurement. For the statistical tensile strength of Jute and Hemp fibers, bimodal Weibull distribution was fitted better than the unimodal distribution. The acid-base parameter on the interfacial shear strength (IFSS) of the natural fiber composites was characterized by calculating the work adhesion, $W_a$. The effect of alkaline, silane coupling agent on natural fibers were obtained with changing MAPP content in PP-MAPP matrices. Alkaline treated fibers made the surface energy to be higher due to removing the weak boundary layers and thus increasing surface area, whereas surface energy of silane treated Jute and Hemp fibers decreased due to blocked high energy sites. MAPP in the PP-MAPP matrix caused the surface energy to increase due to introduced acid-base sites. Microfailure modes of two natural fiber composites were observed clearly differently due to different tensile strength of natural fibers.

• Journal of Adhesion and Interface
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• v.8 no.3
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• pp.9-15
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• 2007

The interfacial evaluation of surface modified Jute fiber/polypropylene (PP) composites before and after hydration was investigated using micromechanical test and dynamic contact angle measurement. The IFSS of alkaline and silane-treated Jute fiber/PP composites increased, whereas after hydration, the IFSS of the untreated, alkaline- and silane-treated Jute fibers/PP composites decreased due to swelled fibrils by water infiltration. The interfacial adhesion of silane treated fiber/PP composites was higher than alkaline-treated or the untreated cases. The surface energies of Jute fiber treated under various conditions were obtained using dynamic contact angle measurement. Especially after hydration, the thermodynamic work of adhesion was calculated by considering water interlayer, which indicated the stability of IFSS between silane treated Jute fiber and PP matrix showing better than others.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.101-105
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• 2019

The adhesion reliability of the epoxy molding compound (EMC) and the printed circuit board (PCB) interface is critical to the quality and lifetime of the chip package since the EMC protects PCB from the external environment during the manufacturing, storage, and shipping processes. It is necessary to measure adhesion energy accurately to ensure product reliability by optimizing the manufacturing process during the development phase. This research deals with the measurement of EMC/PCB interfacial adhesion energy of chip package that has warpage induced by the coefficient of thermal expansion (CTE) mismatch. The double cantilever beam (DCB) test was conducted to measure adhesion energy, and the spring back force of specimens with warpage was compensated to calculate adhesion energy since the DCB test requires flat substrates. The result was verified by comparing the adhesion energy of flat chip packages come from the same manufacturing process.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.29-37
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• 2021

The effect of Ar/N₂ two-step plasma treatment on the quantitative interfacial adhesion energy of low temperature Cu-Cu bonding interface were systematically investigated. X-ray photoelectron spectroscopy analysis showed that Ar/N₂ 2-step plasma treatment has less copper oxide due to the formation of an effective Cu4N passivation layer. Quantitative measurements of interfacial adhesion energy of Cu-Cu bonding interface with Ar/N₂ 2-step plasma treatment were performed using a double cantilever beam (DCB) and 4-point bending (4-PB) test, where the measured values were 1.63±0.24 J/m² and 2.33±0.67 J/m², respectively. This can be explained by the increased interfacial adhesion energy according phase angle due to the effect of the higher interface roughness of 4-PB test than that of DCB test.

• Textile Coloration and Finishing
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• v.27 no.1
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• pp.18-26
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• 2015

para-aramid fibers were treated by atmosphere air plasma to improve the interfacial adhesion. The wettability of plasma-treated aramid fiber was observed by means of dynamic contact angle surface free energy measurement. Surface roughness were investigated with the help of scanning electron microscopy and atomic force microscopy. The tensile test of aramid fiber roving was carried out to determine the effect of plasma surface treatments on the mechanical properties of the fibers. A pull-out force test was carried out to observe the interfacial adhesion effect with matrix material. It was found that surface modification and a chemical component ratio of the aramid fibers improved wettability and adhesion characterization. After oxygen plasma, it was indicated that modified the surface roughness of aramid fiber increased mechanical interlocking between the fiber surface and vinylester resin. Consequently the oxygen plasma treatment is able to improve fiber-matrix adhesion through excited functional group and etching effect on fiber surface.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1622-1624
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• 2006

We introduce a modified UV-imprint lithography, a resin transfer from the template to the substrate. We analyzed this method by considering the surface and interfacial free energies of the template-resinsubstrate system. This technique is purely fast and applicable to large area patterning.

• Composites Research
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• v.36 no.5
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• pp.377-382
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• 2023

To enhance the performance of graphene-based devices, it is of great importance to better understand the interfacial interaction of graphene with its underlying substrates. In this study, the adhesion energy of monolayer graphene placed on dielectric substrates was characterized using mode I fracture tests. Large-area monolayer graphene was synthesized on copper foil using chemical vapor deposition (CVD) with methane and hydrogen. The synthesized graphene was placed on target dielectric substrates using polymer-assisted wet transfer technique. The monolayer graphene placed on a substrate was mechanically delaminated from the dielectric substrate by mode I fracture tests using double cantilever beam configuration. The obtained force-displacement curves were analyzed to estimate the adhesion energies, showing 1.13 ± 0.12 J/m² for silicon dioxide and 2.90 ± 0.08 J/m² for silicon nitride. This work provides the quantitative measurement of the interfacial interactions of CVD-grown graphene with dielectric substrates.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.3
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• pp.31-37
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• 2009

Cu-Cu thermo-compression bonding process was successfully developed as functions of the $N_2+H_2$ forming gas annealing conditions before and after bonding step in order to find the low temperature bonding conditions of 3-D integrated technology where the quantitative interfacial adhesion energy was measured by 4-point bending test. While the pre-annealing with $N_2+H_2$ gas below $200^{\circ}C$ is not effective to improve the interfacial adhesion energy at bonding temperature of $300^{\circ}C$, the interfacial adhesion energy increased over 3 times due to post-annealing over $250^{\circ}C$ after bonding at $300^{\circ}C$, which is ascribed to the effective removal of native surface oxide after post-annealing treatment.

• Journal of Adhesion and Interface
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• v.22 no.4
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• pp.113-117
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• 2021

Among the next-generation solar cells, organic solar cells using organic materials are a key energy production device for the future energy generation devices, and have recently been receiving a lot of attention with rapid growth. To improve the efficiency of organic solar cells, interfacial engineering technology has been widely applied. In particular, it is widely used to improve device efficiency through energy level control by using interface engineering on the anode and cathode, which are positive electrodes, and to ultimately utilize interface engineering for tandem organic solar cells to derive excellent electrical and optical performance to produce high-performance devices. In this article, we will summarize and introduce recent research trends on interfacial engineering used in organic solar cells, and discuss the method of manufacturing high-performance organic solar cells.

• Composites Research
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• v.31 no.2
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• pp.57-62
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• 2018

Interfacial and mechanical properties of neat and two sizing agents coated glass fiber (GF)/polydicyclopentadiene (p-DCPD) composites were evaluated at room and low temperatures, $25^{\circ}C$ and $-20^{\circ}C$. Sizing agents of GFs were extracted using acetone and compared via FT-IR. Surface energy and work of adhesion between GFs and p-DCPD were calculated by dynamic contact angle measurement. Mechanical properties of different GFs were determined using single fiber tensile test and interfacial properties of single GF reinforced DCPD strip were determined using cyclic loading tensile test. Mechanical properties of GFs/p-DCPD composites at room and low temperatures were determined using tensile, compressive, and Izod impact tests. Interfacial and mechanical properties were different with sizing agents of GFs and the optimized condition of sizing agent was found.