• Journal of Electrochemical Science and Technology
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• v.9 no.4
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• pp.330-338
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• 2018

The adhesion strength as well as the electrochemical properties of $LiNi_{0.4}Mn_{0.4}Co_{0.2}O_2$ electrodes containing various conductive carbons (CC) such as fiber-like carbon, vapor-grown carbon fiber, carbon nanotubes, particle-like carbon, Super P, and Ketjen black is compared. The morphological properties is investigated using scanning electron microscope to reveal the interaction between the different CC and the active material. The surface and interfacial cutting analysis system is also used to measure the adhesion strength between the aluminum current collector and the composite film, and the adhesion strength between the active material and the CC of the electrodes. The results obtained from the measured adhesion strength points to the fact that the structure and the particle size of CC additives have tremendous influence on the binding property of the composite electrodes, and this in turn affects the electrochemical property of the configured electrodes.

• Journal of the Korean Society of Clothing and Textiles
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• v.19 no.5
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• pp.765-773
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• 1995

Effect of interfacial electrical conditions such as, the f potential of PET fiber and u-Fe203 particles, the stability parameter and potential energy of interaction on adhesion of a-Fe903 particles to PET fabric and their removal from the fabric, were investigated as functions of pH, electrolyte and ionic strength. The stability parameter, potential energy of interaction between a-Fe2O3 particles and PET fabric were calculated by using the heterocoagulation theory for a sphere-plate model The adhesion of a-Fe2O3 particles to PET fabric and their removal from PET fabric were carried out by using water bath shaker and Terg-O-Tometer under various solution conditions. The adhesion of a-Fe2O3 particles to the PET fabric and the removal of a-Fe2O3 particles from the PET fabric were biphasic and were maximum and minimum at pH 7~8, respectively. With high pH and polyanion electrolytes in solution, the adhesion of a-Fe2O3 particles to the PET fabric was low but effects of electrolytes on the removal of a-Fe2O3 particles from the PET fabric was small. The adhesion of a-Fe2O3 particles to the PET fabric and the removal of a-Fe2O3 Particles from the PET fabric were biphasic, and were lowest and highest at the ionic strength 1$\times$10-3, respectively. The adhesion of a-Fe2O3 particles to PET fabric was well related with the interfacial electrical conditions; it was negatively correlated with the f potentials of a-Fe2O3 Particles of its absolute value, the stability parameter and the maximum of total potential energy, while, the adhesion was not related with the t potentials of PET fiber itself. Therefore, the primary factor determining the adhesion of a-Fe203 particles to PET fabric may be the stability of dispersed particles caused by the electrical repulsion of particles. The removal of a-Fe203 particles from PET fabric was not related to such interfacial electrical conditions as the t potentials of PET fiber, the stability parameter and the maximum of total potential energy but removal was related to t potential of a-Fe203 particles.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.2
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• pp.49-55
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• 2016

The effects of post-annealing and temperature/humidity conditions on the interfacial adhesion energies of atomic layer deposited RuAlO diffusion barrier layer for Cu interconnects were systematically investigated. The initial interfacial adhesion energy measured by four-point bending test was $7.60J/m^2$. The interfacial adhesion energy decreased to $5.65J/m^2$ after 500 hrs at $85^{\circ}C$/85% T/H condition, while it increased to $24.05J/m^2$ after annealing at $200^{\circ}C$ for 500 hrs. The X-ray photoemission spectroscopy (XPS) analysis showed that delaminated interface was RuAlO/$SiO_2$ for as-bonded and T/H conditions, while it was Cu/RuAlO for post-annealing condition. XPS O1s peak separation results revealed that the effective generation of strong Al-O-Si bonds between $AlO_x$ and $SiO_2$ interface at optimum post-annealing conditions is responsible for enhanced interfacial adhesion energies between RuAlO/$SiO_2$ interface, which would lead to good electrical and mechanical reliabilities of atomic layer deposited RuAlO diffusion barrier for advanced Cu interconnects.

• Journal of Adhesion and Interface
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• v.23 no.3
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• pp.59-69
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• 2022

In composite materials, the adhesion and interfacial properties were the most important factors to obtain high performance of mechanical properties. This review paper had been focused on the micromechanical evaluation methods for the interfacial property historically. The interfacial property of fiber-reinforced composites (FRC) could be evaluated using only a single fiber and matrix via various micromechanical testing methods. Self-sensing due to the fracture behavior of FRC could be determined and discussed more critically and clearly using electro-micromechanical evaluation. In this paper, the research trends for micro-mechanical evaluation of composites was summarized, and their practical applications would be suggested in the future.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2005.11a
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• pp.75-78
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• 2005

Using a low-energy Ar+ ion-beam with and without reactive gases, polymers such as chemically stable poly(ether ether ketone) (PTFE) and poly(ether ether ketone) (PEEK) films were modified to have special surface features. The adhesion strength between the polymers and the copper was significantly improved because of both changes in the surface topography and chemical interactions due to polymer surface functionalization (oxidation and amination). The surface modification altered the failure mode from adhesive failure for the unmodified polymer/Cu interface to cohesive failure for the surface-modified polymer/Cu layer interface..

• Journal of Electrical Engineering and Technology
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• v.7 no.1
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• pp.91-96
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• 2012

We introduce an understanding of silver (Ag) inkjet overlap-printing characteristics from the viewpoints of cohesion between ink droplets and adhesion between an ink droplet and a surface. The printing characteristics were closely monitored by changing the surface energy to elucidate the effect of adhesion and cohesion on printing instability, such as droplet merging and line bulging. The surface energy of the substrate was changed through the hydrophilization of a hydrophobic fluorocarbon-coated surface. The surface energy and ink wettability of the prepared surfaces were characterized using sessile drop contact angle analysis, and printing instability was observed using an optical microscope after drop-on-demand inkjet printing with a 50% overlap in diameter of deposited singlet patterns. We found that the surface energy is not an appropriate indicator based on the experimental results of Ag ink printing on a hydrofluoric-treated silicon surface. The analytical approach using adhesion and cohesion was helpful in understanding the instability of the inkjet overlap-printing, as adhesion and cohesion represent the direct interfacial relationship between the Ag inks used and the substrate.

• Korean Journal of Materials Research
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• v.18 no.4
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• pp.204-210
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• 2008

$1.5\;{\mu}m$-thick copper films deposited on silicon wafers were successfully bonded at $415^{\circ}C$/25 kN for 40 minutes in a thermo-compression bonding method that did not involve a pre-cleaning or pre-annealing process. The original copper bonding interface disappeared and showed a homogeneous microstructure with few voids at the original bonding interface. Quantitative interfacial adhesion energies were greater than $10.4\;J/m^2$ as measured via a four-point bending test. Post-bonding annealing at a temperature that was less than $300^{\circ}C$ had only a slight effect on the bonding energy, whereas an oxygen environment significantly deteriorated the bonding energy over $400^{\circ}C$. This was most likely due to the fast growth of brittle interfacial oxides. Therefore, the annealing environment and temperature conditions greatly affect the interfacial bonding energy and reliability in Cu-Cu bonded wafer stacks.

• Proceedings of the KSME Conference
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• 2001.11a
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• pp.38-43
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• 2001

The interfacial adhesive joining characteristics of the foams are very important for the structural integrity of sandwich structures. Peel strength is one of the best criteria for the interfacial characteristics of the sandwich structures and peel energy is most commonly used for the interfacial characteristics. The peel strength is the first peak force per unit width of bond line required to produce progressive separation by the wedge or other crack opening type action of two adherends where one or both undergo significant bending and the peel energy is the surface active energy per unit width of bond line. In this work, to investigate the strengthening effect of resin treatment on the interfacial surface of foam material, peel strength and peel energy of epoxy resin treated polyurethane foam core sandwich structures were obtained by the cleavage peel tests and compared with those of non surface treated polyurethane foam core sandwich structures.

• Journal of Adhesion and Interface
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• v.23 no.3
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• pp.87-93
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• 2022

To analyze the interfacial property between the fiber and the matrix, work of adhesion was used generally that was calculated by surface energies. In this paper, it was determined what types of contact angle measurement methods were more accurate between static and dynamic contact angle measurements. 4 types of glass fiber and epoxy resin were used each other to measure the contact angle. The contact angle was measured using two types, static and dynamic contact angle methods, and work of adhesion, W_a was calculated to compare interfacial properties. The interfacial property was evaluated using microdroplet pull-out test. Generally, the interfacial property was proportional to work of adhesion. In the case of static contact angle, however, work of adhesion was not consistent with interfacial property. It is because that dynamic contact angle measurement comparing to static contact angle could delete the error due to microdroplet size to minimize the surface area as well as the meniscus measuring error.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.2
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• pp.52-59
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• 2023

The effects of dielectric curing temperature and temperature/humidity treatment conditions on the interfacial adhesion energies between Ti diffusion barrier/polybenzoxazole (PBO) dielectric layers were systematically investigated for Cu redistribution layer applications of fan-out wafer level package. The initial interfacial adhesion energies were 16.63, 25.95, 16.58 J/m² for PBO curing temperatures at 175, 200, and 225 ℃, respectively. X-ray photoelectron spectroscopy analysis showed that there exists a good correlation between the interfacial adhesion energy and the C-O peak area fractions at PBO delaminated surfaces. And the interfacial adhesion energies of samples cured at 200 ℃ decreased to 3.99 J/m² after 500 h at 85 ℃/85 % relative humidity, possibly due to the weak boundary layer formation inside PBO near Ti/PBO interface.