• Proceedings of the KSME Conference
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• 2008.11a
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• pp.40-44
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• 2008

The interfacial adhesion energy between resist and a substrate is very important due to resist pull-off problems during separation of mold from a substrate in nanoimprint process. And effect of substrate surface roughness on interfacial adhesion energy is very important. In this paper, we have treated glass wafer surface using $CF_4$ gas for increase surface roughness and it has tested interfacial adhesion properties of UV resin/glass substrate interfaces by 4 point bending test. The interfacial adhesion energies by bare, 30, 60 and 90 sec surface treatments are 0.62, 1.4, 1.36 and 2 $J/m^2$, respectively. The test results showed quantitative comparisons of interfacial fracture energy (G) effect of glass wafer surface roughness.

• Korean Journal of Materials Research
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• v.17 no.4
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• pp.215-221
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• 2007

The effect of $CF_4$ plasma treatment condition on the interfacial adhesion energy of inkjet printed Ag/polyimide system is evaluated from $180^{\circ}$ peel test by calculating the plastic deformation energy of peeled metal films. Interfacial fracture energy between Ag and as-received polyimide was 5.5 g/mm. $CF_4$ plasma treatment on the polyimide surface enhanced the interfacial fracture energy up to 17.6 g/mm. This is caused by the increase in the surface roughness as well as the change in functional group of the polyimide film due to $CF_4$ plasma treatment on the polyimide surface. Therefore, both the mechanical interlocking effect and the chemical bonding effect are responsible for interfacial adhesion improvement in ink jet printed Ag/polyimide systems.

• Composites Research
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• v.34 no.2
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• pp.82-87
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• 2021

The mechanical properties of carbon fiber-reinforced epoxy composites (CFRPs) are greatly dependent on the interfacial adhesion between the carbon fibers and the epoxy matrix. Introducing nanomaterial reinforcements into the interface is an effective approach to enhance the interfacial adhesion of CFRPs. The main purpose of this work was to introduce graphitic nanofiber (GNFs) between an epoxy matrix and carbon fibers to enhance interfacial properties. The composites were reinforced with various concentrations of GNFs. For all of the fabricated composites, the optimum GNF content was found to be 0.6 wt%, which enhanced the interlaminar shear strength (ILSS) and fracture toughness (KIC) by 101.9% and 33.2%, respectively, compared with those of neat composites. In particular, we observed a direct linear relationship between ILSS and KIC through surface free energy. The related reinforcing mechanisms were also analyzed and the enhancements in mechanical properties are mainly attributed to the interfacial interlocking effect. Such an effort could accelerate the conversion of composites into high performance materials and provide fundamental understanding toward realizing the theoretical limits of interfacial adhesion and mechanical properties.

• Korean Journal of Materials Research
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• v.20 no.6
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• pp.319-325
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• 2010

3-D IC integration enables the smallest form factor and highest performance due to the shortest and most plentiful interconnects between chips. Direct metal bonding has several advantages over the solder-based bonding, including lower electrical resistivity, better electromigration resistance and more reduced interconnect RC delay, while high process temperature is one of the major bottlenecks of metal direct bonding because it can negatively influence device reliability and manufacturing yield. We performed quantitative analyses of the interfacial properties of Al-Al bonds with varying process parameters, bonding temperature, bonding time, and bonding environment. A 4-point bending method was used to measure the interfacial adhesion energy. The quantitative interfacial adhesion energy measured by a 4-point bending test shows 1.33, 2.25, and $6.44\;J/m^2$ for 400, 450, and $500^{\circ}C$, respectively, in a $N_2$ atmosphere. Increasing the bonding time from 1 to 4 hrs enhanced the interfacial fracture toughness while the effects of forming gas were negligible, which were correlated to the bonding interface analysis results. XPS depth analysis results on the delaminated interfaces showed that the relative area fraction of aluminum oxide to the pure aluminum phase near the bonding surfaces match well the variations of interfacial adhesion energies with bonding process conditions.

• Composites Research
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• v.32 no.2
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• pp.96-101
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• 2019

Interfacial adhesion between fiber and resin are related to composites performance, so it is very important to evaluate them accurately. In this study, the interfacial properties of microdroplets under fatigue loading conditions were evaluated. The mechanical properties and interfacial adhesion of epoxy resin with dopamine were studied. Tensile specimens were prepared to evaluate mechanical properties and epoxy microdroplets specimens were used for the evaluation of interfacial adhesion. In addition, in the microdroplet fatigue test, the same diameter of the microdroplet was used and the experiment was performed under the same conditions. As a result, it was confirmed that mechanical and interfacial properties were improved when dopamine was applied to epoxy resin through tensile and microdroplet experiments. It is considered that dopamine improves the degree of curing of the epoxy resin and imparts hydroxyl groups to the epoxy resin to increase the mechanical properties and the interfacial adhesion between the glass fibers.

• Journal of the Korea Institute of Military Science and Technology
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• v.7 no.2 s.17
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• pp.100-108
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• 2004

Nitramine-polymer composites suffer from a problem known as dewetting. Dewetting adversely affects the performance and the sensitivity characteristics of an explosive composition. Voids, which are generated between explosive particles and binder on dewetting, act as initiation sites. For a PBXs as well as propellants, where good adhesion and mechanical properties are of great importance, dewetting therefore must be prevented by strong adhesion between the filler and the binder. The surface energy of materials is measured by Wilhelmy plate and wicking method. The interfacial energy between the filler and the binder is calculated from the disperse phase and the polar phase of surface energy. Time dependent compressive properties of composite explosives have been determined by stress-strain curves obtained at different strain rates and temperatures. The interfacial state of the PBX was observed through SEM. It was found from the result that the interface between the explosive and the binder becomes better adhesion with decreasing interfacial tension and increasing work of adhesion. The result clearly shows that the castable PBX has good adhesion more than the pressable PBX.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.2
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• pp.41-48
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• 2018

The quantitative interfacial adhesion energy measurement method of copper redistribution layer and WPR dielectric interface were investigated using $90^{\circ}$ peel test, 4-point bending test, double cantilever beam (DCB) measurement for FOWLP Applications. Measured interfacial adhesion energy values of all three methods were higher than $5J/m^2$, which is considered as a minimum criterion for reliable Cu/low-k integration with CMP processes without delamination. Measured energy values increase with increasing phase angle, that is, in order of DCB, 4-point bending test, and $90^{\circ}$ peel test due to increasing roughness-related shielding and plastic energy dissipation effects, which match well interfacial fracture mechanics theory. Considering adhesion specimen preparation process, phase angle, measurement accuracy and bonding energy levels, both DCB and 4-point bending test methods are recommended for quantitative adhesion energy measurement of RDL interface depending on the real application situations.

• Korean Journal of Materials Research
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• v.18 no.9
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• pp.486-491
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• 2008

The effect of annealing treatment conditions on the interfacial adhesion energy between electrolessplated Ni film and polyimide substrate was evaluated using a $180^{\circ}$ peel test. Measured peel strength values are $26.9{\pm}0.8,\;22.4{\pm}0.8,\;21.9{\pm}1.5,\;23.1{\pm}1.3,\;16.1{\pm}2.0\;and\;14.3{\pm}1.3g/mm$ for annealing treatment times during 0, 1, 3, 5, 10, and 20 hours, respectively, at $200^{\circ}C$ in ambient environment. XPS and AES analysis results on peeled surfaces clearly reveal that the peeling occurs cohesively inside polyimide. This implies a degradation of polyimide structure due to oxygen diffusion through interface between Ni and polyimide, which is also closely related to the decrease in the interfacial adhesion energy due to thermal treatment in ambient conditions.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.3
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• pp.7-12
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• 2018

The effects of Ru deposition temperature and post-annealing conditions on the interfacial adhesion energies of atomic layer deposited (ALD) Ru diffusion barrier layer and Cu thin films for the advanced Cu interconnects applications were systematically investigated. The initial interfacial adhesion energies were 8.55, 9.37, $8.96J/m^2$ for the sample deposited at 225, 270, and $310^{\circ}C$, respectively, which are closely related to the similar microstructures and resistivities of Ru films for ALD Ru deposition temperature variations. And the interfacial adhesion energies showed the relatively stable high values over $7.59J/m^2$ until 250h during post-annealing at $200^{\circ}C$, while dramatically decreased to $1.40J/m^2$ after 500 h. The X-ray photoelectron spectroscopy Cu 2p peak separation analysis showed that there exists good correlation between the interfacial adhesion energy and the interfacial CuO formation. Therefore, ALD Ru seems to be a promising diffusion barrier candidate with reliable interfacial reliability for advanced Cu interconnects.

• Polymer(Korea)
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• v.37 no.3
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• pp.373-378
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• 2013

The interfacial adhesion strength is very important in $SiO_x$ deposited PC film for the barrier enhanced polycarbonate (PC) flexible substrate. In this study, PC films were treated by undercoating, UV/$O_3$ and low temperature plasma and then the effect of physical and chemical surface modifications on the interfacial adhesion strength between PC film and $SiO_x$ barrier layer were studied. It was found that untreated PC film shows significantly low interfacial adhesion strength due to the smooth surface and low surface free energy of PC. Low temperature plasma treatments resulted in the increase of both surface roughness and surface free energy due to etching and the appearance of polar molecules on the PC surface. However, UV/$O_3$ treatment only shows the increase of surface free energy by developed polar molecules on the surface. These surface modifications caused the enhancement of surface interfacial strength between PC film and $SiO_x$ barrier. In the case of undercoating, it was found that the increase of surface interfacial strength was achieved by adhesion between various acrylic acid on acrylate coated surface and $SiO_x$ without increase of polar surface energy. In addition, the barrier property is also improved by organic-inorganic hybrid multilayer structure.