• Journal of the Korean Ceramic Society
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• v.33 no.7
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• pp.823-831
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• 1996

Due to the intrinsic low surface activation of ${\gamma}$-alumina it has been used limitely in practice. Accordingly forward enhancing its utility ${\gamma}$-alumina surface was treated with slfuricf aicd nitric acid and chloric acid respec-tively. Subsequently the effects of surface activity on the surface electrical characteristics were investigated. The ${\gamma}$-alumina was prepared by the precipitation of aluminium nitrate [Al(NO3)3.9H2O] using ammonia water as a precipitator and it was chemically treated with such acids mentioned above. The surface and morphology of the acid-treated ${\gamma}$-alumina were analysed by XRD, BET and the surface activities were measured by the amine titration methods. The interfacial properties of the ${\gamma}$-alumina dispersed in electrolyte solution were esti-mated by the surface charge density measured using potentiometric tiration. Based on the relation between surface charge density and the acid amount the following results were drawn for the surface and interfacial electrical properties ; Acidic properties of surface-treated alumina increase with anion load on alumina surface. P. Z. C decreases with acid amount on alumina surface. The surface charge densities were apart from electrolyte ionic strength. The acidity of ${\gamma}$-alumina is linearly dependent on the P. Z,.C when the ${\gamma}$-alumina was dispersed in aqueous electrolyte solution.

• Polymer(Korea)
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• v.27 no.2
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• pp.91-97
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• 2003

The effect of fluorination of nanoscaled silicas on mechanical interfacial properties and thermal stabilities of the silica/polyurethane composites was investigated. The surface properties of the silica were studied in X-ray photoelectron spectroscopy and contact angle measurements. Their mechanical interfacial properties and thermal stabilities of the composites were characterized by tearing energy and decomposition activation energy, respectively. As experimental results, the London dispersive component of surface free energy and fluorine functional groups of silica surfaces were increased as a function of fluorination temperature resulting in improving the trearing energy ($G_{IIIC}$) of the composites. Also, the thermal stabilities of the composites were increased as the treatment temperature increases. These results could be explained that the fluorine functional groups on silica surfaces played an important role in improving the intermolecular interactions at interfaces between silicas and polyurethane matrix in a composite system.

• Journal of Adhesion and Interface
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• v.5 no.1
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• pp.3-11
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• 2004

In this work, the cure behaviors of the DGEBA/PMR-15 blends initiated by N-benzylpyrazinium hexafluoroantimonate (BPH) as a cationic latent catalyst were performed in DSC and DMA analyses. And, the thermal stabilities were carried out by TGA analysis and their mechanical interfacial properties of blends were measured in the context of critical stress intensity factor ($K_{IC}$). As a result, the curing activation energy ($E_a$) determined from Ozawa's equation in DSC and the relaxation activation energy ($E_r$) from DMA were increased with increasing PMA-15 content. Also, the thermal stabilities obtained from the integral procedural decomposition temperature (IPDT) and the glass transition temperature ($T_g$) were highly improved with increasing the PMR-15 content, which were probably due to the high heat resistance. And, the $K_{IC}$ showed a similar behavior with $E_a$, which was attributed to the improving of the interfacial adhesion or hydrogen bondings between intermolecular chains.

• Journal of Adhesion and Interface
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• v.19 no.1
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• pp.13-18
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• 2018

At ruthenium (Ru) catalyst was exposed from the atmosphere, the degree of catalyst activation decreased. The change of catalyst activity with the number of days of exposure to air for the Ru catalyst was confirmed using the surface tension method quantitatively. Mechanical properties and surfactant change after polymerization by DCPD using Ru catalyst for each air exposure day was evaluated. The Ru catalyst mixed with a dilution agent was exposed in the air and color was monitored for each day. Surface tension was measured using Wilhelmy and PTFE and associated with different catalyst activities. Heat was measured in real time during polymerizing DCPD with Ru catalyst. After polymerization, tensile strength was measured for p-DCPD and the change of material property was measured. Interfacial properties were also evaluated via microdroplet pull-out tests between glass fiber and p-DCPD. The surface tension was stable until the 4 days (33 dyne/cm) whereas the surface energy increased at the 10 days (34 dyne/cm), which could be correlated with oxidation of the catalyst. Tensile property and interfacial shear strength (IFSS) was also stable until the 4 days (tensile strength: 38 MPa and IFSS: 26 MPa) whereas the mechanical property decrease at 10 days (tensile strength: 15 MPa and IFSS: 3 MPa) dramatically.

• Journal of the Korean Ceramic Society
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• v.32 no.11
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• pp.1262-1268
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• 1995

Photoelectrochemical properties of p-GaAs electrode have been investigated. I-V characteristic shows that the cathodic photocurrent is observed at -0.7 V vs. SCE. The photoresponse at near 870~880nm wavelength indicates that the photogenerated carriers contibuted to the observed current. The maximum converson efficiency of 35% is obtained for a Xe lamp light source at 400nm. In C-V relation, capacitance peaks appeared at the frequencies of 100Hz and 300Hz due to the activation of the interfacial states which exist at the energy level corresponding to the one-third of the GaAs band gap. The difference of about 1.1V between flatband potential (Vfb) from the Mott-Schottky method and onset voltage from I-V curve is observed due to the trap of carriers at the interfacial states in the boundary between GaAs and electrolyte. In case of WO3 deposited p-GaAs electrode, higher positive onset current and photocurent density are obtained. This can be explained by the fact that carriers are generated by light penetrated into the WO3 thin flm as well as p-GaAs substrate and then move into the electrolyte effectively.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.73-79
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• 2022

In this study, a reaction study between Ga, which has recently been spotlighted as a low-temperature bonding material, and Cu, a representative electrode material, was conducted to investigate information necessary for low-temperature soldering applications. Interfacial reaction and intermetallic compound (IMC) growth were observed and analyzed by reacting Ga and Cu/Au substrates in the temperature range of 80-200℃. The main IMC growing at the reaction interface was CuGa₂ phase, and AuGa₂ IMC with small particle sizes was formed on the upper part and Cu₉Ga₄ IMC with a thin band shape on the lower part of the CuGa₂ layer. CuGa₂ particles showed a scallop shape, and the particle size increased without significant shape change as the reaction time increased, similar to the case of Cu₆Sn₅ growth. As a result of analyzing the CuGa₂ growth mechanism, the time exponent was calculated to be ~3.0 in the temperature range of 120-200℃, and the activation energy was measured to be 17.7 kJ/mol.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.85-91
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• 2002

Even though electroless Hi and Sn-Ag-Cu solder are widely used materials in electronic packaging applications, interfacial reactions of the ternary Ni-Cu~Sn system have not been known well because of their complexity. Because the growth of intermetallics at the interface affects reliability of solder joint, the intermetallics in Ni-Cu-Sn system should be identified, and their growth should be investigated. Therefore, in present study, interfacial reactions between electroless Ni UB7f and 95.5Sn-4.0Ag-0.5Cu alloy were investigated focusing on morphology of the IMCs, thermodynamics, and growth kinetics. The IMCs that appear during a reflow and an aging are different each other. In early stage of a reflow, ternary IMC whose composition is Ni$_{22}$Cu$_{29}$Sn$_{49}$ forms firstly. Due to the lack of Cu diffusion, Ni$_{34}$Cu$_{6}$Sn$_{60}$ phase begins growing in a further reflow. Finally, the Ni$_{22}$Cu$_{29}$Sn$_{49}$ IMC grows abnormally and spalls into the molten solder. The transition of the IMCs from Ni$_{22}$Cu$_{29}$Sn$_{49}$ to Ni$_{34}$Cu$_{6}$Sn$_{60}$ was observed at a specific temperature. From the measurement of activation energy of each IMC, growth kinetics was discussed. In contrast to the reflow, three kinds of IMCs (Ni$_{22}$Cu$_{29}$Sn$_{49}$, Ni$_{20}$Cu$_{28}$Au$_{5}$, and Ni$_{34}$Cu$_{6}$Sn$_{60}$) were observed in order during an aging. All of the IMCs were well attached on UBM. Au in the quaternary IMC, which originates from immersion Au plating, prevents abnormal growth and separation of the IMC. Growth of each IMC is very dependent to the aging temperature because of its high activation energy. Besides the IMCs at the interface, plate-like Ag3Sn IMC grows as solder bump size inside solder bump. The abnormally grown Ni$_{22}$Cu$_{29}$Sn$_{49}$ and Ag$_3$Sn IMCs can be origins of brittle failure.failure.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.487-492
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• 2002

The growth kinetics of intermetallic compound layers formed between eutectic Sn-58Bi solder and (Cu, electroless Ni-P/Cu) substrate were investigated at temperature between 70 and 120 C for 1 to 60 days. The layer growth of intermetallic compound in the couple of the Sn-58Bi/Cu and Sn-58Bi/electroless Ni-P system satisfied the parabolic law at given temperature range. As a whole, because the values of time exponent (n) have approximately 0.5, the layer growth of the intermetallic compound was mainly controlled by volume diffusion over the temperature range studied. The apparent activation energies of Cu$_{6}$Sn$_{5}$ and Ni$_3$Sn$_4$ intermetallic compound in the couple of the Sn-58Bi/Cu and Sn-58Bi/electroless Ni-P were 127.9 and 81.6 kJ/mol, respectively.ely.

• Journal of the Korean Ceramic Society
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• v.26 no.2
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• pp.195-200
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• 1989

The Silica-Carbon mixture was made with addition of carbon black in the composition which monodispersed spherical fine silica was formed by the hydrolysis of ethylsilicate, mole ratio of Carbon/Alkoxide was 3.1 and $\beta$-SiC powder was synthesized by reacting this mixture at 1,350~1,50$0^{\circ}C$ in Ar atmosphere. The results of this study are as follow : (1) The purity of synthesized $\beta$-SiC powder was above 99.98% and it was in cubic modification with lattice constant of 4.3476$\AA$. (2) The rate-controlling steps varied with the reaction temperature for the syntehsis of $\beta$-SiC in this study ; nucleation and growth of $\beta$-SiC at 1,350~1,40$0^{\circ}C$, interfacial reaction at 1,45$0^{\circ}C$ and diffusion described by Jander Equation at 1,50$0^{\circ}C$. (3) When the rate-determining step was nucleation and growth, the activation energy was about 87.8kcal/mol.

• Journal of Welding and Joining
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• v.20 no.1
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• pp.97-102
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• 2002

The growth kinetics of intermetallic compound layers formed between the eutectic Sn-3.5Ag solder and the Cu and Ni/Cu pad by solid stateisothermal aging were examined. The interfacial reaction between the eutectic Sn-3.5Ag solder and the Cu and Ni/Cu pad was investigated at 70, 120, 150, $170^{\circ}C$ for various times. The intermetallic compound layer was composed of two phase: $Cu_6Sn_5$(${\varepsilon}-phase$) adjacent to the solder and $Cu_6Sn_5$(${\varepsilon}-phase$) adjacent to the copper and on solder/Ni pad the intermetallic compound layer was $Ni_3Sn_4$. Because the values of time exponent(n) have approximately 0.5, the layer growth of the intermetallic compound was mainly controlled by volume diffusion over the temperature range studied. The apparent activation energy for layer growth of total Cu-Sn($Cu_6Sn_5 + Cu_6Sn$), $Cu_6Sn_5$, $Cu_3Sn$ and $Ni_3Sn_4$ intermetallic compound were 64.82kJ/mol, 48.53kJ/mol, 89.06kJ/mol and 71.08kJ/mol, respectively.