• The korean journal of orthodontics
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• v.25 no.1 s.48
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• pp.55-72
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• 1995

The purpose of this study is to evaluate the effects of mechanical and thermal fatigue on the shear bond strength(SBS) in orthodontic brackets bonded to human premolars with chemically cured adhesive(Mono-$Lok^2$, Rocky Mountain Orthodontics). Two types of metal brackets (Ormesh, Microloc) and three types of ceramic brackets (Fascination, Starfire, Transcend 2000) were used in this study. The $10^6$ loadcycles of $|7.4{\times}10{^2}sin2{\pi}ft|g{\cdot}cm$ and the 1,000 thermocycles of 15 second dwell time each in $5^{\circ}C\;and\;55^{\circ}C$ baths were acturated as mechanical and thermal fatigue stress, and SBS were measured after each fatigue test. The fracture sites were examined by stereoscope and scanning electron microscope. The results obtained were summarized as follows, 1. In static shear bond test, Fascination brackets showed the maximum SBS($20.78\pm3.45$ MPa) and Microloc brackets showed the minimum SBS($14.88\pm3.10$ MPa). Fascination and Starfire brackets showed significantly greater SBS than Microloc brackets(P<0.05). 2. In mechanical fatigue test, Fascination brackets showed the maximum SBS ($20.19\pm3.45$ MPa) and Starfire brackets showed the minimum SBS($9.10\pm8.33$ MPa). The SBS or Transcend 2000 brackets(P<0.01) and Starfire brackets(P<0.05) significantly decreased after $10^6$ loadcycles. 3. In thermocycling test, Ormesh brackets showed the maximum SBS ($19.36\pm2.76$ MPa) and Starfire brackets showed the minimum SBS($11.94\pm6.86$ MPa). The SBS of Transcend 2000(P<0.01), Microloc and Starfire brackets(P<0.05) significantly decreased after $10^3$ thermocycles. 4. Failure sites of thermocycling groups were similar to those of static groups but after mechanical fatigue test, Ormesh and Transcend 2000 brackets failed at the bracket/resin interface and Microloc brackets failed within adhesive. Facination brackets failed at the enamel/resin interface irrespective of experimental condition.

• The Journal of Korean Academy of Prosthodontics
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• v.50 no.4
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• pp.235-242
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• 2012

Purpose: The purpose of this study was to compare the fracture behavior of Zironia, glass infiltrated Alumina and PFM full crown system. Materials and methods: Fifteen crowns for each of 3 experimental groups (Zironia, glass infiltrated Alumina and PFM full crown) were made by the conventional method. The crowns mounted on the testing jig were inclined in 30 degrees to the long axis of the tooth and the universal testing machine was used to measure the fracture strength. Results: 1. The mean fracture strengths were $588.3{\pm}49.6MPa$ for zirconia system, $569.1{\pm}61.8MPa$ for PFM system and $551.0{\pm}76.5MPa$ for glass-infiltrated alumina system (P>.05). 2. The mean shear bond strengths were $25.5{\pm}5.6MPa$ for zirconia system, $38.9{\pm}5.0MPa$ for Ni-Cr alloy system and $39.4{\pm}5.1MPa$ for glass-infiltrated alumina system. 3. The chemical bonding was observed at interfaces between PFM or glass-infiltrated alumina and veneering porcelain, however, no chemical bonding was observed at interface between zirconia and veneering porcelain. Conclusion: With the study, the fracture strengths of PFM crown system had a higher fracture strength than conventional zirconia system crown and glass-infiltrated alumina crowns. and than the shear bond strengths glass-infiltrated alumina system had a higher shear bond strength than conventional PFM system and zirconia system.

• Korean Journal of Materials Research
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• v.9 no.10
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• pp.962-969
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• 1999

Elastic and elasto-plastic stress analyses of AlN/Cu and AlN/W pints produced by active-metal brazing method using Ag-Cu-Ti insert-metal were performed with use of Finite-Element-Method(FEM). The results of stress analyses were compared with those from the pint strength tests and the observations of fracture behaviors. It was shown that a remarkably larger maximum principal stress is built in the AlN/Cu pint compared to the A1N/ W joint. Especially, the stress concentration with tensile component was confirmed at the free surface close to the bonded interface of AlN/Cu. The elasto-plastic analysis under consideration of stress relaxation effect of Ag-Cu-Ti insert possessing a so-called 'soft-metal effect' showed that the insert leads to a lowering of maximum principal stress in AlNiCu pint, even though an increase of the insert thickness above 100$\mu\textrm{m}$ could not bring its further decrease. The maximum pint strengths measured by shear test were 52 and 108 MPa for AlNiCu and AlN/W pints. respectively. Typical fractures of AlN/Cu pints occurred in a form of 'dome' which initiated from the free surface of AlN close to the bonded interface and proceeded towards the AlN inside forming a large angle. AlN/W pints were usually fractured at AlN side along the interface of AlN/insert-metal.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.37-42
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• 2022

Recently, the semiconductor package structures are becoming thinner and more complex. As the thickness decrease, interfacial delamination due to material mismatch can be further maximized, so the reliability of interface is a critical issue in industry field. Especially, the polymers, which are widely used in semiconductor packaging, are significantly affected by the temperature and moisture. Therefore, in this study, the delamination prediction at the interface of package structure was performed through finite element analysis considering the moisture absorption and desorption under the various temperature conditions. The material properties such as diffusivity and saturated moisture content were obtained from moisture absorption test. The hygro-swelling coefficients of each material were analyzed through TMA and TGA after the moisture absorption. The micro-shear test was conducted to evaluate the adhesion strength of each interface at various temperatures considering the moisture effect. The finite element analysis of interfacial delamination was performed that considers both deformation due to temperature and moisture absorption. Consequently, the interfacial delamination was successfully predicted in consideration of the in-situ moisture desorption and temperature behavior during the reflow process.

• Composites Research
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• v.29 no.2
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• pp.79-84
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• 2016

An adhesive can be used to connect two different materials in structures. In comparing with other connecting methods, such as bolt, rivet, and hot melting, the adhesive does not need to use them. It leads to reduce the weight and decrease the stress concentration along the connecting line. This work studied the comparison of mechanical and interfacial properties of commonly-used two adhesives, acrylic type and bisphenol-A epoxy type. Tensile and flexural strength of neat adhesives were also compared. Lap shear test of two adhesives was deduced from the measurement of tensile and fatigue tests. After testing, the failure patterns of adhesive surfaces were observed by a microscope. Tensile strength and mechanical fatigue resistance at using bisphenol-A epoxy adhesive were better than acrylic adhesive. Also adding CNT reinforcement in epoxy adhesive can anticipate mechanical improvement.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.1 s.38
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• pp.23-29
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• 2006

Ultrasonic soldering of Si-wafer to FR-4 PCB at ambient temperature was investigated. The UBM of Si-substrate was Cu/ Ni/ Al from top to bottom with thickness of $0.4{\mu}m,\;0.4{\mu}m$, and $0.3{\mu}m$ respectively. The pad on FR-4 PCB comprised of Au/ Ni/ Cu from top to bottom with thickness of $0.05{\mu}m,\;5{\mu}m$, and $18{\mu}m$ respectively. Sn-3.5wt%Ag foil rolled to $100{\mu}m$ was used for solder. The ultrasonic soldering time was varied from 0.5 s to 3.0 s and the ultrasonic power was 1,400 W. The experimental results show that a reliable bond by ultrasonic soldering at ambient temperature was obtained. The shear strength increased with soldering time up to a maximum of 65 N at 2.5 s. The strength decreased to 34 N at 3.0 s because cracks were generated along the intermetallic compound between Si-wafer and Sn-3.5wt%Ag solder. The Intermetallic compound produced by ultrasonic soldering between the Si-wafer and the solder was $(Cu,Ni)_{6}Sn_{5}$.

• Journal of the Korean GEO-environmental Society
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• v.8 no.3
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• pp.59-65
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• 2007

Excess pore pressures in low permeability soils may not dissipate quickly enough and decrease the effective stresses inside the soil, which in turn may cause a reduction of the shear strength at the interface between the soil and the reinforcement in MSE walls. For this condition the dissipation rate of pore pressures is most important and it varies depending on wall size, permeability of the backfill, and reinforcement length. In this paper, a series of numerical analysis has been performed to investigate the effect of those factors. The results show that for soils with a permeability lower than $10^{-3}cm/sec$, the consolidation time gradually increases. The increase in consolidation time indicates the decrease in effective stress thus it will result in decrease in pullout capacity of the reinforcement as verified by the numerical analyses. It is also observed that larger consolidation time is required for longer reinforcement length (longer drainage path).

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.1
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• pp.55-60
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• 2010

The honeycomb composite joint structure designed for application to a tilting KTX railroad car body is subjected to bending loads of a cantilever type. Honeycomb sandwich composite panel-joint attached in the real tilting car body was fabricated and sectioned as several beam-joint specimens for the bending test. The fracture behaviors of these specimens under static loads were different from those under cyclic loads. Static bending loads caused shear deformation and fracture in the honeycomb core region, while fatigue cyclic bend loading caused delamination along the interface between the composite skin and the honeycomb core, and/or caused a fracture in the welded part jointed with the steel under-frame. These fracture behaviors could occur in other industrial honeycomb composite joints with similar sub-structures, and be used for improving design parameters of a honeycomb composite joint structure.

• Clinics in Shoulder and Elbow
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• v.11 no.2
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• pp.77-81
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• 2008

The goal of rotator cuff repairs is to achieve high initial fixation strength, minimize gap formation, maintain mechanical stability under cyclic loading and optimize the biology of the tendon-bone interface until the cuff heals biologically to the bone. Single row repairs are least successful in restoring the footprint of the rotator cuff and are most susceptible to gap formation. Double row repairs have an improved load to failure and minimal gap formation. Transosseous equivalent repairs (suture bridge technique) have the highest ultimate load and resistance to shear and rotational forces and the lowest gap formation. Even though the superior advantages of double row and transosseous equivalent repairs, those techniques take longer surgical time and are more expensive than single row repairs. Therefore single row repairs can be useful in bursal side partial thickness or small size full thickess rotator cuff tear.

• Journal of Welding and Joining
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• v.33 no.2
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• pp.47-55
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• 2015

With using adaptive control of the resistance spot welding machine, the advantage on electrode life time for galvanized steels has been addressed. This study was aimed to evaluate the electrode life time of galvanized steels with applying the constant current control and the adaptive control resistance spot welding process for a comparison purpose. The growth in diameter of electrode face was similar for both the constant current and the adaptive control up to 2000 welds. The button diameter was decreased with weld numbers, however, sudden increase in button diameter with use of the adaptive control after 1500 welds was observed. The peak load was continuously decreased with increasing number of welds for both the constant current and the adaptive control. The current compensation during a weld was observed with using the adaptive control after 1800 welds since the ${\beta}$-peak on dynamic resistance curve was detected at later weld time. The current compensation with adaptive control during resistance spot welding enhanced the nugget diameter at the faying interface of steel sheets and improved the penetration to thinner steel sheet.