• Journal of Surface Science and Engineering
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• v.39 no.2
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• pp.57-63
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• 2006

In this study, In-base solder was applied to the interface between $Bi_2Sr_2Ca_1Cu_2O_x(Bi_{2212})$ superconductor and Cu-Ni shunt metal at the temperature lower than $150^{\circ}C$. Most of the cases, $Bi_{2212}$ superconductor was precoated with Ag by electroplating in order to improve the contact properties of the solder layer. When the superconductor was directly soldered on to the superconductor, the solder was easily separated without external force. The shear strength of the contact between superconductor and shunt metal increased from 69.2 kgf to 74.4 kgf and 80.1 kgf, as the current density of the Ag electroplating was changed from 63 mA to 96 mA and 126 mA, respectively. The contact strength also increased to 49.9 kgf and 69.2 kgf when thickness of the electroplated Ag layer increased to $5{\mu}m$ and $10{\mu}m$, reapectively.

• Journal of the Korea institute for structural maintenance and inspection
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• v.25 no.4
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• pp.20-27
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• 2021

The present study presents a nonlinear finite element analysis (FEA) approach using the general program of Abaqus to evaluate the seismic response of unreinforced masonry walls strengthened with the steel bar truss system developed in the previous investigation. For finite element models of masonry walls, the concrete damaged plasticity (CDP) and meso-scale methods were considered on the basis of the stress-strain relationships under compression and tension and shear friction-slip relationship of masonry prisms proposed by Yang et al. in order to formulate the interface characteristics between brick elements and mortars. The predictions obtained from the FEA approach were compared with test results under different design parameters; as a result, a good agreement could be observed with respect to the crack propagation, failure mode, rocking strength, peak strength, and lateral load-displacement relationship of masonry walls. Thus, it can be stated that the proposed FEA approach shows a good potential for designing the seismic strengthening of masonry walls.

• Journal of Korean Tunnelling and Underground Space Association
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• v.22 no.1
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• pp.23-46
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• 2020

In the current work, a series of three-dimensional finite element analyses have been carried out to understand the behaviour of pre-existing single piles to adjacent tunnelling by considering the tunnel face pressures and the relative location of pile tips with respect to the tunnel. The numerical modelling has analysed the effect of the face pressures on the pile behaviour. The analyses concentrate on the ground settlements, the pile head settlements, the axial pile forces and the shear stress transfer mechanism at the pile-soil interface. The head settlements of the pile (the vertical distance between the pile and the tunnel: 0.25D, where D is the tunnel diameter) directly above the tunnel crown with the face pressure 50% of the in-situ horizontal soil stress at the tunnel springline decreased by about 38% compared to corresponding settlements with a face pressure 25% of the in-situ horizontal soil stress at the tunnel springline. Furthermore, it was found that the smaller the face pressure, the larger the tunnelling-induced ground movements and the axial pile forces were and the higher the degree of the shear strength mobilisation at the pile-soil interface. When the piles were outside the tunnel influence zone, compressive pile forces were developed due to tunnelling. It has been found that the ground settlements and the pile settlements are heavily affected by the face pressures and the position of the pile tip relative to the tunnel. In addition, the computed results have been compared with relevant studies previously reported in literature. The behaviour of the piles has been extensively examined and analysed by considering the key features in great detail.

• Journal of Adhesion and Interface
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• v.11 no.2
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• pp.41-49
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• 2010

Furan-containing epoxide monomers (8, 9) were designed and synthesized as carbon-neutral, environment-friendly adhesion material. Bicyclic skeleton were constructed using the Diels-Alder reaction of furan and methyl acrylate, both readily accessible starting material from a biomass via bio-refinery process. After reduction of ester functionality, resulting hydroxyl moieties were coupled to epichlorohydrin to provide the epoxy-functionalized furanic monomers (8, 9). The structure of new furanic monomers was confirmed by $^1H$ and $^{13}C$ NMR spectroscopy. As UV-curable monomers, basic properties such as UV curing time and the extent of UV curing were evaluated by photo DSC. Photo-curing shrinkages were measured by linear variable differential transformer transducer (LVDT) and the effect of molecular structure on shrinkage was considered. In addition, new synthetic compounds showed the shear strength over 3 MPa when they were photo-cured between polycarbonate plates, which indicates these compounds are feasible to use as photo-curable adhesive materials.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.1
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• pp.55-62
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• 2023

In this study, Sn-3.0Ag-0.5Cu (wt.%, SAC305) solder dipping process was performed between Ni-foam skeleton with different pore per inch (PPI) to fabricate Ni-foam/SAC305 composite solder, and then applied to the transient liquid phase (TLP) bonding process to evaluate the microstructure and mechanical properties of the bonded joint. The Ni-foam/SAC305 composite solder preform consisted of Ni-foam and SAC305, and an intermetallic compound (IMC) having a (Ni,Cu)₃Sn₄ composition was formed at the Ni-foam interface. During TLP bonding process, the IMC at the Ni-foam interface was converted to (Ni,Cu)₃Sn₄+Au, and as the bonding time increased, the Ni-foam and SAC305 continuously reacted, and the bonded joint was converted into an IMC. And it was confirmed that the 130 PPI Ni-foam/SAC305 composite solder joint was converted into an IMC at the fastest rate. As a result of performing a shear test to confirm the effect of Ni-foam on mechanical properties, solder joints under all conditions exhibited excellent mechanical properties of 50 MPa or more in the early stages of the TLP bonding process, and the shear strength tends to increase as the bonding time increases.

• Journal of the Korea Concrete Institute
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• v.28 no.5
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• pp.535-544
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• 2016

This paper aims at examining the effects of sustained load and elevated temperature on the time-dependent deformation of a carbon fiber reinforced polymer (CFRP) sheets bonded to concrete as well as the pull-off strength of single-lap shear specimens after the sustained loading period using digital images. Elevated temperature during the sustained loading period resulted in increased slip of the CFRP composites, whereas increased curing time of the polymer resin prior to the sustained loading period resulted in reduced slip. Pull-off tests conducted after sustained loading period showed that the presence of sustained load resulted in increased pull-off strength and interfacial fracture energy. This beneficial effect decreased with increased creep duration. Based on analysis of digital images, results on strain distributions and fracture surfaces indicated that stress relaxation of the epoxy occurred in the 30 mm closest to the loaded end of the CFRP composites during sustained loading, which increased the pull-off strength provided the failure locus remained mostly in the concrete. For longer sustained loading duration, the failure mode of concrete-CFRP bond region can change from a cohesive failure in the concrete to an interfacial failure along the concrete/epoxy interface, which diminished part of the strength increase due to the stress relaxation of the adhesive.

• The korean journal of orthodontics
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• v.26 no.2 s.55
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• pp.175-186
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• 1996

The purpose of this study was to examine the effects of mechanical and thermal fatigue on the shear bond strength(SBS) of stainless steel mesh brackets bonded to human premolar teeth with 3 no-mix adhesives. The stainless steel mesh bracket was Ormesh(Ormco, .022 slot) and three types of no-mix adhesives were Ortho-one(Bisco), $Monolok^2$(RMO), $System\;1^+$(Ormco). The $10^6$ loadcycles of $17.4{\times}10^2sin2{\pi}ftlg{\cdot}cm$ and the 1,000 thermocycles of 15 second dwell time in each bath of $5^{\circ}C\;and\;55^{\circ}C$ were acturated as mechanical and thermal fatigue stress, and SBS were measured after each fatigue test. The fracture sites were analyzed by stereoscope and scanning electron microscope. The results obtained were summarized as follows; 1. Before thermocycles, $Monolok^2$ showed the highest Knoop hardness number(KHN, $64.03kg/mm^2$) and $System\;1^+$ showed the lowest value($31.60kg/mm^2$). After thermocycling, $Monolok^2$ also showed the highest KHN($38.03kg/mm^2$) and $system\;1^+$ showed the minimum($20.87kg/mm^2$). The KHN of Ortho-one, $Monolok^2,\;System\;1^+$ significantly decreased after thermocycling (P<0.01). 2. In static shear bond test, three adhesives had no significant differences in the SBS(P>0.01). 3. After thermocycling test, $Monolok^2$ showed the maximum SBS($19.34{\pm}2.75MPa$) and Ortho-one showed the minimum SBS($13.66{\pm}2.23MPa$). The SBS of Ortho-one(P<0.01) and $System\;1^+$(P<0.05) significantly decreased after $10^3$ thermocycles. 4. The SBS of three adhesives after $10^6$ loadcycles were similar and were not significantly decreased compared with static group(P>0.01). 5. The failure sites were usually bracket/resin interface in all groups irrespective of experimental conditions.

• Journal of Dental Rehabilitation and Applied Science
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• v.24 no.1
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• pp.41-56
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• 2008

The methods of surface modification of commercial implants were various according to the manufacturer. Surface modification of implant may produce diverse physical and chemical surface characteristics resulted from the treatment method and treatment condition. As a result, the bone response might be different. Even though surface modified implants have been used clinically, most researches are focusing on the bone response of surface modified implants comparing to machined implants rather than surface modified commercial implants. This study compare and analyze bone responses of 4 surface modified commercial implants with different shapes and surfaces. Eighty surface modified commercial implants with 4 different surface characteristics were installed in the tibia of white Newzealand rabbits. Biomechanical stability tests and histomorphometric evaluation were done. The results were as follows: 1. Surface modified commercial implants showed stable osseointegration at 6 weeks after installation. 2. Histomorphometric evaluation showed that there was no significant differences in bone to implant contact among 4 different commercial titanium implants. In comparing the implants with different shape the measurement of bone growth in subcortical area would be more reliable than entire bone to implant contact length. 3. Resonance Frequency Analysis showed that there was no significant differences among 4 types of implants, even though they were significantly different in installation. 4. There was significant differences in interfacial shear strength among 4 type of implants. 5. It is difficult to observe accurate bone to implant interface using Micro-CT. However, it is possible to measure the entire contact length of the implant to the bone.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.3
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• pp.55-61
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• 2000

Sn-37Pb and Sn-3.5Ag-0.7Cu solder balls of 0.3 mm diameter were reflow soldered with the variation of soldering peak temperature and conveyer speed of reflow machine. The peak temperatures far soldering were changed in the range of 220~$240^{\circ}C$ for Sn-37Pb and 230~$260^{\circ}C$ for Sn-3.5Ag-0.7Cu. As the results of experiments, optimum soldering condition for Sn-37Pb was $230^{\circ}C$ of soldering temp., 0.7~0.8 m/min of conveyer speed. The optimum condition for the Sn-3.5Ag-0.7Cu was $250^{\circ}C$ and 0.6 m/min. The maximum shear strength for the soldered joints of Sn-37Pb was 555 gf and of Sn-3.5Ag-0.7Cu was 617 gf. Thickness of the intermetallic compound Cu6Sn5 on the soldered interface was 1.13~1.45 $\mu\textrm{m}$ for Sn-37Pb and 2.5~4.3 $\mu\textrm{m}$ for Sn-3.5Ag-0.7Cu.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.2 s.35
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• pp.95-103
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• 2005

The interfacial reaction between 42Sn-58Bi solder (in wt.$\%$ unless specified otherwise) and electroless Ni-P/immersion Au has been investigated before and after thermal aging, with a focus on formation and growth of an intermetallic compound (IMC) layer, consumption of under bump metallurgy (UBM), and bump shear strength. The immersion Au layer with thicknesses of 0 (bare Ni), 0.1, and $1{\mu}m$ was plated on the $5{\mu}m$ thick electroless Ni-P ($14{\~}15 at.\%$P) layer. Then, the 42Sn-58Bi solder balls were fabricated on three different UBM structures by screen-printing and pre-reflow. The $Ni_3Sn_4$ layer (IMC1) was formed at the joint interface after pre-reflow for all the three UBM structures. On aging at $125^{\circ}C$, a quaternary phase (IMC2) was observed above the $Ni_3Sn_4$ layer in the Au-containing UBM structures, which was identified as $Sn_{77}Ni{15}Bi_6Au_2$ (in at.$\%$). The thick $Sn_{77}Ni{15}Bi_6Au_2$ layer deteriorated the integrity of the solder joint and the shear strength of the solder bump was decreased by about $40\%$ compared with non-aged joints.