• Proceedings of the KIEE Conference
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• 1993.07b
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• pp.1268-1270
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• 1993

In this study, the characteristics of Si-$SiO_2$ interface and its degradation in short channel SONOSFET nonvolatile memory devices, fabricated by 1Mbit CMOS process($1.2{\mu}m$ design rule), with $65{\AA}$ blocking oxide layer, $205{\AA}$ nitride layer, and $30{\AA}$ tunneling oxide layer on the silicon wafer were investigated using the charge pumping method. For investigating the Si-$SiO_2$ interface characteristics before and after write/erase cycling, charge pumping current characteristics with frequencies, write/erase cycles, as a parameters, were measured. As a result, average Si-$SiO_2$ interface trap density and mean value of capture cross section were determined to be $1.203{\times}10^{11}cm^{-2}eV^{-1}\;and\;2.091{\times}10^{16}cm^2$ before write/erase cycling, respectively. After cycling, when the write/erase cycles are $10^4$, average $Si-SiO_2$ interface trap density was $1.901{\times}10^{11}cm^{-2}eV^{-1}$. Incresing write/erase cycles beyond about $10^4$, Si-$SiO_2$ interface characteristics with write/erase cycles was increased logarithmically.

• Transactions of the Korean Society of Mechanical Engineers
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• v.17 no.5
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• pp.1084-1094
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• 1993

An efficient method for determining forced responses of a general linear structural system in time domain using subtructure modes and Lagrange multipliers is presented. Compared with the conventional mode synthesis methods, the suggested method does not construct the equations of motion of the combined whole structure and thus the modal parameters of the whole structure are not required. Only modal parameters of each substructure and geometric compatibility conditions are needed. Both the loaded interface free-free modes and free interface modes can be employed as the modal bases of each substructure. Recurrence discrete-time state equations based upon state transition matrix are formulated for the transient analysis of a parameter-changing system. It is shown form numerical examples that the suggested method is very accurate and efficient to calculate transient responses compares with the direct numerical integration method.

• Transactions of Materials Processing
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• v.16 no.7
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• pp.521-529
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• 2007

This paper is concerned with the analysis on the surface expansion of AA 2024 and AA 1100 aluminum alloys in backward extrusion process. Due to heavy surface expansion appeared usually in the backward can extrusion process, the tribological conditions along the interface between the material and the punch land are very severe. In the present study, the surface expansion is analyzed especially under various process conditions. The main goal of this study is to investigate the influence of degree of reduction in height, geometries of punch nose, friction and hardening characteristics of different aluminum alloys on the material flow and thus on the surface expansion on the working material. Two different materials are selected for investigation as model materials and they are AA 2024 and AA 1100 aluminum alloys. The geometrical parameters employed in analysis include punch corner radius and punch nose angle. The geometry of punch follows basically the recommendation of ICFG and some variations of punch geometry are adopted to obtain quantitative information on the effect of geometrical parameters on material flow. Extensive simulation has been conducted by applying the rigid-plastic finite element method to the backward can extrusion process under different geometrical, material, and interface conditions. The simulation results are summarized in terms of surface expansion at different reduction in height, deformation patterns including pressure distributions along the interface between workpiece and punch, comparison of surface expansion between two model materials, geometrical and interfacial parametric effects on surface expansion, and load-stroke relationships.

• Journal of Korea Foundry Society
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• v.33 no.4
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• pp.157-161
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• 2013

A ribbon-type polycrystalline silicon wafer was directly fabricated from liquid silicon via a novel technique for both a fast growth rate and large grain size by exploiting gas pressure. Effects of processing parameters such as moving speed of a dummy bar and the length of the solidification zone on continuous casting of the silicon wafer were investigated. Silicon melt extruded from the growth region in the case of a solidification zone with a length of 1cm due to incomplete solidification. In case of a solidification zone wieh a length of 2 cm, on the other hand, continuous casting of the wafer was impossible due to the volume expansion of silicon derived from the liquid-solid transformation in solidification zone. Consequently, the optimal length of the solidification zone was 1.5 cm for maintaining the position of the solid-liquid interface in the solidification zone. The silicon wafer could be continuously casted when the moving speed of the dummy bar was 6 cm/min, but liquid silicon extruded from the growth region without solidification when the moving speed of the dummy bar was ${\geq}$ 9 cm/min. This was due to a shift of the position of the solid-liquid interface from the solidification zone to the moving area. The present study reports experimental findings on a new direct growth system for obtaining silicon wafers with both high quality and productivity, as a candidate for an alternate route for the fabrication of ribbon-type silicon wafers.

• 제어로봇시스템학회:학술대회논문집
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• 1996.10a
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• pp.334-337
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• 1996

This is a paper intended for initial stage of vehicle modeling and design. The needs to determine a variety of vehicle suspension parameters required for initial design has been difficult and time-consuming task. In order to facilitate a concise and efficient presentation of initial vehicle design procedure, this paper uses a mathematical model and physical geometry. Vehicle model consists of dimensions, inertias and mechanical constants. These vehicle model parameters divided into several categories : basic parameters, coefficients and constants, design specification, spring and damper, bush stiffness, stabilizer bar, suspension geometry, tire, and vehicle weights of various design condition. This paper uses a vehicle design fundamental (VDF) program running under Windows 95 graphical interface. The features of VDF will be briefly outlined in this paper.

• Proceedings of the IEEK Conference
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• 2005.11a
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• pp.415-418
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• 2005

DSP chip parameters of a digital hearing aid (HA) should be optimally selected or fitted for hearing impaired persons. The more precise parameter fitting guarantees the better compensation of the hearing loss (HL). Digital HAs adopt DSP chips for more precise fitting of various HL threshold curve patterns. A specific DSP chip such as Gennum GB3211 was designed and manufactured in order to match up to about 4.7 billion different possible HL cases with combination of 7 limited parameters. This paper deals with a digital HA fitting program which is developed for optimal fitting of GB3211 DSP chip parameters. The fitting program has completed feature from audiogram input to DSP chip interface. The compensation effects of the microphone and the receiver are also included. The paper shows some application examples.

• Structural Engineering and Mechanics
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• v.30 no.1
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• pp.99-117
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• 2008

This paper presents a comprehensive approach to the evaluation of macroscopic material parameters for natural stone and quarry masonry. To that end, a reliable non-linear material model on a meso-scale is developed to cover the random arrangement of stone blocks and quasi-brittle behaviour of both basic components, as well as the impaired cohesion and tensile strength on the interface between the blocks and mortar joints. The paper thus interrelates the following three problems: (i) definition of a suitable periodic unit cell (PUC) representing a particular masonry structure; (ii) derivation of material parameters of individual constituents either experimentally or running a mixed numerical-experimental problem; (iii) assessment of the macroscopic material parameters including the tensile and compressive strengths and fracture energy.

• 제어로봇시스템학회:학술대회논문집
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• 2005.06a
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• pp.1820-1825
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• 2005

DSP chip parameters of a digital hearing aid (HA) should be optimally selected or fitted for hearing impaired persons. The more precise parameter fitting guarantees the better compensation of the hearing loss (HL). Digital HAs adopt DSP chips for more precise fitting of various HL threshold curve patterns. A specific DSP chip such as Gennum GB3211 was designed and manufactured in order to match up to about 4.7 billion different possible HL cases with combination of 7 limited parameters. This paper deals with a digital HA fitting program which is developed for optimal fitting of GB3211 DSP chip parameters. The fitting program has completed features from audiogram input to DSP chip interface. The compensation effects of the microphone and the receiver are also included. The paper shows some application examples.

• Journal of the Korean Society of Industry Convergence
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• v.2 no.2
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• pp.131-137
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• 1999

Package crack caused by the soldering process in the surface mounting plastic package is evaluated by applying the energy release rate criterion. The package crack formation depend on various parameters such as chip set, chip size, package thickness, package width, material properties and the moisture content etc. The effects of chip set and the other parameters were estimated during the analysis of package cracks which were located in the edge of the upper interface of the chip and the lower interlace of the die pad. From the results, it could be obtained that the more significant parameters to effect the chip set are chip width.

• Magazine of the Korean Society of Agricultural Engineers
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• v.45 no.1
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• pp.102-114
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• 2003

The objectives of the paper are to evaluate cell based pollutant loadings for different storm events, to monitor the hydrology and water quality of the Baran HP#6 watershed, and to validate AGNPS with the field data. Simplification was made to AGNPS in estimating storm erosivity factors from a triangular rainfall distribution. GIS-AGNPS interface model consists of three subsystems; the input data processor based on a geographic information system. the models. and the post processor Land use patten at the tested watershed was classified from the Landsat TM data using the artificial neural network model that adopts an error back propagation algorithm. AGNPS model parameters were obtained from the GIS databases, and additional parameters calibrated with field data. It was then tested with ungauged conditions. The simulated runoff was reasonably in good agreement as compared with the observed data. And simulated water quality parameters appear to be reasonably comparable to the field data.