• 제목/요약/키워드: interface charge

검색결과 470건 처리시간 0.028초

Improvement in the bias stability of zinc oxide thin-film transistors using an $O_2$ plasma-treated silicon nitride insulator

  • 김웅선;문연건;권태석;박종완
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2009년도 제38회 동계학술대회 초록집
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    • pp.180-180
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    • 2010
  • Thin film transistors (TFTs) based on oxide semiconductors have emerged as a promising technology, particularly for active-matrix TFT-based backplanes. Currently, an amorphous oxide semiconductor, such as InGaZnO, has been adopted as the channel layer due to its higher electron mobility. However, accurate and repeatable control of this complex material in mass production is not easy. Therefore, simpler polycrystalline materials, such as ZnO and $SnO_2$, remain possible candidates as the channel layer. Inparticular, ZnO-based TFTs have attracted considerable attention, because of their superior properties that include wide bandgap (3.37eV), transparency, and high field effect mobility when compared with conventional amorphous silicon and polycrystalline silicon TFTs. There are some technical challenges to overcome to achieve manufacturability of ZnO-based TFTs. One of the problems, the stability of ZnO-based TFTs, is as yet unsolved since ZnO-based TFTs usually contain defects in the ZnO channel layer and deep level defects in the channel/dielectric interface that cause problems in device operation. The quality of the interface between the channel and dielectric plays a crucial role in transistor performance, and several insulators have been reported that reduce the number of defects in the channel and the interfacial charge trap defects. Additionally, ZnO TFTs using a high quality interface fabricated by a two step atomic layer deposition (ALD) process showed improvement in device performance In this study, we report the fabrication of high performance ZnO TFTs with a $Si_3N_4$ gate insulator treated using plasma. The interface treatment using electron cyclotron resonance (ECR) $O_2$ plasma improves the interface quality by lowering the interface trap density. This process can be easily adapted for industrial applications because the device structure and fabrication process in this paper are compatible with those of a-Si TFTs.

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Suppression of Gate Oxide Degradation for MOS Devices Using Deuterium Ion Implantation Method

  • Lee, Jae-Sung
    • Transactions on Electrical and Electronic Materials
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    • 제13권4호
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    • pp.188-191
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    • 2012
  • This paper introduces a new method regarding deuterium incorporation in the gate dielectric including deuterium implantation and post-annealing at the back-end-of-the process line. The control device and the deuterium furnace-annealed device were also prepared for comparison with the implanted device. It was observed that deuterium implantation at a light dose of $1{\times}10^{12}-1{\times}10^{14}/cm^2$ at 30 keV reduced hot-carrier injection (HCI) degradation and negative bias temperature instability (NBTI) within our device structure due to the reduction in oxide charge and interface trap. Deuterium implantation provides a possible solution to enhance the bulk and interface reliabilities of the gate oxide under the electrical stress.

ONO ($SiO_2/Si_3N_4/SiO_2$), NON($Si_3N_4/SiO_2/Si_3N_4$)의 터널베리어를 갖는 비휘발성 메모리의 신뢰성 비교

  • 박군호;이영희;정홍배;조원주
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2009년도 추계학술대회 논문집
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    • pp.53-53
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    • 2009
  • Charge trap flash memory devices with modified tunneling barriers were fabricated using the tunneling barrier engineering technique. Variable oxide thickness (VARIOT) barrier and CRESTED barrier consisting of thin $SiO_2$ and $Si_3N_4$ dielectric layers were used as engineered tunneling barriers. The VARIOT type tunneling barrier composed of oxide-nitride-oxide (ONO) layers revealed reliable electrical characteristics; long retention time and superior endurance. On the other hand, the CRESTED tunneling barrier composed of nitride-oxide-nitride (NON) layers showed degraded retention and endurance characteristics. It is found that the degradation of NON barrier is associated with the increase of interface state density at tunneling barrier/silicon channel by programming and erasing (P/E) stress.

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An agent-based cockpit task management system: a task-oriented pilot-vehicle interface

  • Kim, J.N.
    • 대한인간공학회지
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    • 제15권2호
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    • pp.99-111
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    • 1996
  • In today's highly automated aircraft, the role of the pilot has changed from an airplane controller to a system manager. As a system manager in a cockpit, today's pilot is in charge of a management-level activity called cockpit task management( CTM). According to earlier studies, pilot errors in performing CTM activities were significant factors in a large number of aircraft accidents and incidents. The primary objective of this research was to reduce CTM-related pilot errors. A prototype pilot- vehicle interface called the cockpit task management system (CTMS) was developed and its effectiveness in improving CTM performance was evaluated. After the CTMS was implemented, it was integrated into a PC-based flight simulator to perform an experiment to evaluate its effectiveness. Eight volunteer subjects were used to collect performance data. The results of the experiment indicated that a statistically significant improvement was observed when the subjects flew with the assistance of the CTMS.

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납축전지에서 양극판의 Pb-Ca-Sn 그리드 합금에 관한 연구 (A Study on the Pb-Ca-Sn Grid Alloy of Positive Plate in Lead-Acid Battery)

  • 구본근;정순욱
    • 한국응용과학기술학회지
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    • 제25권4호
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    • pp.518-524
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    • 2008
  • In this study, positive plates of lead acid battery of Pb-Ca alloy and Pb-Ca-Sn alloy were fabricated and the mechanical characteristics of positive plates were measured. This study observed how the changes of content of Ca & Sn affect interface corrosion which is located in between grid & active materials and lead acid batteries as well. The mechanical characteristics of grid alloy is better when Ca is 0.05 wt.% then 0.1 wt.%. This study said that the corrosion rate between the active material based on the charge/discharge cycle of lead acid battery and grid interface is much faster than a grid which contains Sn. And furthermore, according to the study the rate 30 of Sn/Ca which is added to grid shows the best performance.

Solid-Electrolyte Interphase in the Spinel Cathode Exposed to Carbonate Electrolyte in Li-Ion Battery Application: An ab-initio Study

  • 최대현;강준희;한병찬
    • 한국표면공학회:학술대회논문집
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    • 한국표면공학회 2017년도 춘계학술대회 논문집
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    • pp.169-169
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    • 2017
  • Due to key roles for the electrochemical stability and charge capacity the solid-electrolyte interphase (SEI) has been extensively studied in anodes of a Li-ion battery cell. There is, however, few of investigation for cathodes. Using first-principles based calculations we describe atomic-level process of the SEI layer formation at the interface of a carbonate electrolyte and $LiMn_2O_4$ spinel cathode. Furthermore, using beyond the conventional density functional theory (DFT+U) calculations we examine the work function of the cathode and frontier orbitals of the electrolyte. Based on the results we propose that proton transfer at the interface is an essential mechanism initiating the SEI layer formation in the $LiMn_2O_4$. Our results can guide a design concept for stable and high capacity Li-ion battery cell through screening an optimum electrolyte fine-tuned energy band alignment for a given cathode.

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계면에서의 단백질 흡착에 끼치는 영향인자 (Factors Affecting Protein Adsorption at the Air-Water Interface)

  • 송경빈
    • 한국식품과학회지
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    • 제25권5호
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    • pp.521-525
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    • 1993
  • 계면에서의 단백질 흡착 기작을 연구하기 위하여 여러 단백질의 A/W 계면에서의 흡착이 조사되었다. BSA intermediates들의 흡착결과는 단백질 2차, 3차 구조가 계면에서의 흡착기작에 영향끼친 것을 나타냈으며, succinylated ${\beta}-lactoglobulin$의 흡착에서는 순 음전하의 증가가 정전기적 상호작용에 영향끼침을 보여 주었다. 또한 ${\beta}-casein$의 흡착은 물 구조를 파괴하는 chaotropic 염 존재하에서 흡착속도가 떨어지는 것을 시사했다.

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증착시 도핑된 비정질 Si 게이트를 갖는 MOS 캐패시터와 트랜지스터의 전기적 특성 (Electrical Properties of MOS Capacitors and Transistors with in-situ doped Amorphous Si Gate)

  • 이상돈;이현창;김재성;김봉렬
    • 전자공학회논문지A
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    • 제31A권6호
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    • pp.107-116
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    • 1994
  • In this paper, The electrical properties of MOS capacitors and transistoras with gate of in-situ doped amorphous Si and poly Si doped by POCI$_3$. Under constant current F-N stress, MOS capacitors with in-situ doped amorphous Si gate have shown the best resistance to degradation in reliabilty properties such as increase of leakage current, shift of gate voltage (V$_{g}$). shift of flat band voltage (V$_{fb}$) and charge to breakdown(Q$_{bd}$). Also, MOSFETs with in-situ doped amorphous Si gate have shown to have less degradation in transistor properties such as threshold voltage, transconductance and drain current. These improvements observed in MOS devices with in-situ doped amorphous Si gate is attributed to less local thinning spots at the gate/SiO$_2$ interface, caused by the large grain size and the smoothness of the surface at the gate/SiO$_2$ interface.

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Effects of Electrolytes in a Liquid Thin Layer System

  • Chung, Taek-Dong
    • 전기화학회지
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    • 제5권4호
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    • pp.216-220
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    • 2002
  • The effects of electrolytes on electrochemical behavior from an oil thin layer interposed between a graphite electrode and an aqueous solution phase were examined. A hydrophobic electroactive species, tetrachloro-1,4-benzoquinone (TCQ), in a benzonitrile (EN) layer was employed to study ion transfer properties across the BN-water interface. Experimental results showed that hydrophobic cations as well as anions could be successfully used as ionic charge carriers. The addition of various salts into either the oil layers or the aqueous solutions offers deeper insight for the electrochemistry of the liquid thin layer system. When aqueous perchloric acid is interfaced with the BN films, the perchlorate ion of tetrahexylammonium perchlorate (THAP) substantially suppresses the dissociated proton concentration in the layer by the common ion effect while there is only a little change in the total acid concentration. Further approach by theoretical calculation makes it possible to quantitatively understand the effect of the electrolytes to the electrochemical responses of TCQ, which were previously reported (Anal. Chem. 73, 337 (2001)).

게이트 산화막 어닐링을 이용한 서브 마이크론 PMOS 트랜지스터의 NBTI 향상 (Impact of Post Gate Oxidation Anneal on Negative Bias Temperature Instability of Deep Submicron PMOSFETs)

  • 김영민
    • 한국전기전자재료학회논문지
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    • 제16권3호
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    • pp.181-185
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    • 2003
  • Influence of post gate oxidation anneal on Negative Bias Temperature Instability (NBTI) of PMOSFE has been investigated. At oxidation anneal temperature raised above 950$^{\circ}$C, a significant improvement of NBTI was observed which enables to reduce PMO V$\_$th/ shift occurred during a Bias Temperature (BT) stress. The high temperature anneal appears to suppress charge generations inside the gate oxide and near the silicon oxide interface during the BT stress. By measuring band-to-band tunneling currents and subthreshold slopes, reduction of oxide trapped charges and interface states at the high temperature oxidation anneal was confirmed.