• Korean Journal of Materials Research
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• v.9 no.9
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• pp.926-931
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• 1999

The microstructure, wettability, shear strength and aging effect of Sn-3.5Ag/Cu and Alloy42 lead-frame solder joints were measured for comparison. In the case of Sn-3.5Ag/Cu, $Ag_3Sn and Cu_6Sn_5$ phases in the matrix Sn and $1~2\mu\textrm{m}$ thick $Cu_6Sn_5$ phase at the interface of solder/lead-frame were formed. In the case of Sn-3.5Agl Alloy42, only AgJSn phase of low density in the matrix Sn and $0.5~1.5\mu\textrm{m}$ thick $FeSn_2$, phase at the interface of solder/leadframe were formed. Comparing to Cu, Alloy42 showed wider area of spread and smaller contact angle, thus better wet­tability. But shear strength and ductility of Alloy 42 solder joints were only 33% and 75% of those of Cu, respectively After aging at $180^{\circ}C$ for 1 week, $\xi-Cu_3Sn$ layer on $\eta-Cu_6Sn_5$ layer was formed on Cu lead-frame, while coarsened cir­cular $Ag_3Sn$ phase in the matrix and thickened $FeSn_2$, at the interface were formed on Alloy42 lead- frame.

• Korean Journal of Materials Research
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• v.10 no.12
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• pp.853-863
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• 2000

In this study, a new UBM materials system for solder flip chip interconnection of Cu pads were investigated using electroless copper (E-Cu) and electroless nickel (E-Ni) plating method. The interfacial reaction between several UBM structures and Sn-36Pb-2Ag solder and its effect on solder bump joint mechanical reliability were investigated to optimife the UBM materials design for solder bump on Cu pads. Fer the E-Cu UBM, continuous coarse scallop-like $Cu_{6}$ $Sn_{5}$ , intermetallic compound (IMC) was formed at the solder/E-Cu interface, and bump fracture occurred this interface under relative small load. In contrast, Fer the E-Ni/E-Cu UBM, it was observed that E-Ni effectively limited the growth of IMC at the interface, and the Polygonal $Ni_3$$Sn_4$ IMC was formed because of crystallographic mismatch between monoclinic $Ni_3$$Sn_4$ and amorphous E-Ni phase. Consequently, relatively higher bump adhesion strength was observed at E-Ni/E-Cu UBM than E-Cu UBM. As a result, it was fecund that E-Ni/E-Cu UBM material system was a better choice for solder flip chip interconnection on CU PadS.

• Journal of the Korea Concrete Institute
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• v.23 no.3
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• pp.339-346
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• 2011

The effects of mineral admixtures on the bonding properties of cement mortar to polyolefin based synthetic fiber were evaluated. The mineral admixtures consisted of 0%, 5%, 10%, and 15% fly ash, blast furnace slag, and metakaolin in cement. Bond interactions between the cement mortar and the polyolefin based synthetic fiber were determined by Dog-bone bond tests. Bond tests of the polyolefin based synthetic fiber showed an increase in pullout load with the strength of the cement mortar. Also, the interface toughness of polyolefin based synthetic fiber in cement mortar increased as the fly ash, blast furnace slag, and metakaolin contents increased. The microstructure of polyolefin based synthetic fiber surface was examined after the pullout test to analyze the frictional resistant force according to the replacement ratio of fly ash, blast furnace slag, and metakaolin during the pullout process of polyolefin based synthetic fiber in cement mortar. The scratched of polyolefin based synthetic fibers increased with the replacement ratio of fly ash, blast furnace slag, and metakaolin. Also, the interface toughness was enhanced by adhesion forces induced by the fly ash, blast furnace slag, and metakaolin.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.640-644
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• 2000

The microstructure, wettability, shear strength and aging effect of Sn-3.5Ag/Cu and Alloy42 lead-frame solder joints were measured for comparison. In the case of Sn-3.5Ag/Cu, Ag$_3$Sn and Cu$\sub$6/Sn$\sub$5/ phases in the matrix Sn and 1∼2$\mu\textrm{m}$ thick Cu$\sub$6/Sn$\sub$5/ Phase at the interface of solder/lead-frame were formed. In the case of Sn-3.5AAg/A11oy42, only Ag$_3$Sn Phase of low density in the matrix Sn and 0.5∼1.5$\mu\textrm{m}$ thick FeSn$_2$phase at the interface of solder/lead-frame were formed. Comparing to Cu, Alloy42 shear strength of Alloy 42 solder joints was smaller than that of Cu and all declined after aging. After aging at 180$^{\circ}C$ for 1 week, η-Cu$\sub$6/Sn$\sub$5/ layer was formed on Cu lead-frame, while AgSn$_3$ phase in the matrix and thickened FeSn$_2$at the interface were formed on Alloy42 lead-frame.

• Journal of the Korean Recycled Construction Resources Institute
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• v.8 no.4
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• pp.498-505
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• 2020

Aggregate occupies about 70-85% of the concrete volume and is an important factor in reducing the drying shrinkage of concrete. However, when constructing high-rise buildings, it acts as a problem due to the high load of natural aggregates. If the load becomes large during the construction of a high-rise building, creep may occur and the ground may be eroded. Material costs increase and there are financial problems. In order to reduce the load on concrete, we are working to reduce the weight of aggregates. However, artificial lightweight aggregates affect the interface between the aggregate and the paste due to its higher absorption rate and lower adhesion strength than natural aggregates, affecting the overall strength of concrete. Therefore, in this study, in order to grasp the interface between natural aggregate and lightweight aggregate by type, we adopted a method of measuring electrical resistance using an EIS measuring device, which is a non-destructive test, and lightweight bone. The change in the state of the interface was tested on the outside of the material through a blast furnace slag coating. As a result of the experiment, it was confirmed that the electric resistance was about 90% lower than that in the air-dried state through the electrolyte immersion, and the electric resistance differs depending on the type of aggregate and the presence or absence of coating. As a result of the experiment, the difference in compressive strength depending on the type of aggregate and the presence or absence of coating was shown, and the difference in impedance value and phase angle for each type of lightweight aggregate was shown.

• Applied Chemistry for Engineering
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• v.10 no.6
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• pp.944-948
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• 1999

The morphological properties of four binary blends of polyethylene synthesized by metallocene catalyst(MCPE) and four polyolefins prepared by Ziegler-Natta catalyst have been investigated to interpret the effect of micro-molecular structure on the phase morphology and interfacial behavior; four binary blend systems studied are high density polyethylene(HDPE)-metallocene polyethylene (MCPE), polypropylene(PP)-MCPE, poly(propylene-co-ethylene) (CoPP)-MCPE, and poly(propylene-co-ethylene-co-1-butylene) (TerPP)-MCPE, and they are all phase separated. The HDPE-MCPE blend shows evenly growing homogeneous HDPE domain on the continuous MCPE phase, on the other hand, the rest of three blends show complex heterogeneous phase behavior. The PP-MCPE blend shows that PP and MCPE and completely phase separated and phase inversion takes place at 50% MCPE. The CoPP-MCPE and TerPP-MCPE show enhanced interface due to the same micro-molecular structure of ethylene, and phase inversion takes place at 40% MCPE. In particular, TerPP-MCPE blend shows improved phase morphology between interfaces, and this may be arisen from the comonomer contents in TerPP, which are 1-butene and ethylene having the same chemical structure as that of MCPE. The enhancement of the phase morphology in the TerPP-MCPE blend is correlated with the mechanical and morphological properties. Thus, although the four blend systems are phase separated, the phase morphology suggests that the order of interfacial adhesion strength be HDPE-MCPE > TerPP-MCPE > CoPP-MCPE > PP-MCPE and that micro-molecular structure between constituents be one of major factors giving enhanced interfacial adhesion.

• Journal of the korean academy of Pediatric Dentistry
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• v.25 no.1
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• pp.103-115
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• 1998

Adhesion of composite resin to tooth structure has been of tremendous signgicance in clinical dentistry. Due to the lack of adhesion between composite restorative resins and enamel and dentin, microleakage occurs at the tooth/restoration interface. This may lead to discoloration, secondary caries, marginal breakdown, postoperative sensitivity, and even pulpal pathology. According to extensive use of composite resin, every effort on improving bonding strength and reducing microleakage between a tooth and composite resin has been continued. This study was conducted to determine the difference in microleakage in enamel and dentin treated with air-abrasion, acid etching and combination when restored with composite resin. Class V cavities were prepared on 30 premolars. The specimens were divided into following groups. group 1:air-abrasion+Scotchbond Multi-purpose group 4 :air-abrasion+All-Bond 2 group 2:acid etching+Scotchbond Multi-purpose group 5 :acid etching+All-Bond 2 group 3:combination+Scotchbond Multi-purpose group 6 :combination+All-Bond 2 #combination:air-abrasion + acid etching The specimens were filled with Z-100 after application of Scotchbond Multi-purpose and All-Bond 2. Thermocycling was conducted by alternately dipping the specimens in $5^{\circ}C$ and $55^{\circ}C$ water for 30 seconds 500 times. 1% methylene blue was applied and the specimens were left for 24 hours at $37^{\circ}C$. After washing out the dye, the tooth was sectioned buccolingually along the axis. The sectioned surface was observed with stereoscope for dye penetration. The author has measured the microleakage in teeth prepared with air-abrasion, acid ethching and combination to study the difference in microleakage following different methods of tooth surface treatment and has come to following results. 1. In comparing microleakage between groups, group 1 and 4 showed statistically significant difference from group 2, 3, 5 and 6(p<0.05). There was no significant difference among group 2, 3, 5, 6(p>0.05) nor between group 1 and 4(p>0.05). 2. In comparing microleakage among tooth surface treatment methods, Air-abrasion group showed significantly more microleakage than acid etching group and combination(airabrasion + acid etching) group(p<0.05). Combination(acid etching+air-abrasion)group tended to show lesser microleakage than acid etching group, but this was not statistically significant(p>0.05). 3. In comparing microleakage between bonding agents, there was no statistically significant difference between Scotch bond Multi-purpose and All-Bond 2(p>0.05).

• Journal of Dental Rehabilitation and Applied Science
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• v.37 no.4
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• pp.232-243
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• 2021

Purpose: The purpose of this study was to evaluate the shear bond strength of various 3D printed denture base resins and the conventional denture base resin to various denture relining materials. Materials and Methods: For denture base materials, a heatcured (Vertex RS) and two types of 3D printed DENTCA Denture base II, NextDent^TM Base) were used. And 4 types denture relining materials (Tokuyama Rebase II fast, Kooliner, Denture Liner, Denture Liner, Lang Jet Denture Repair Kit) with different components were used. It was classified into 12 groups. Adhesion was performed between the resin base and the relining materials in accordance with ISO/TS 11405 standard. The shear bonding strength was measured, and then the adhesion interface was observed with a stereoscopic microscope and a scanning electron microscope. The fracture pattern was investigated through the analysis of the fragment. Results: In the 3D printed denture resin group, the shear bonding strength with relining materials was significantly lower than that of the heat-cured resin group (P < 0.05). The group of polymethyl methacrylate -based relining materials, high shear bonding strength was shown regardless of the type of denture. As for the fracture pattern, adhesive fracture appeared in most groups, and cohesive, mixed fracture appeared in some groups. Conclusion: The polymethyl methacrylate -based denture relining materials showed high shear bonding strength values compared to other denture relining materials. But, for direct methods, it is considered advantageous in terms of shear bonding strength to use a isobutyl methacrylate-based denture relining materials.

• Structural Engineering and Mechanics
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• v.63 no.3
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• pp.361-370
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• 2017

Through the use of finite element analysis and acoustic emission techniques we have evaluated the interfacial failure of a carbon fiber reinforced polymer (CFRP) repair patch on a notched aluminum substrate. The repair of cracks is a very common and widely used practice in the aeronautics field to extend the life of cracked sheet metal panels. The process consists of adhesively bonding a patch that encompasses the notched site to provide additional strength, thereby increasing life and avoiding costly replacements. The mechanical strength of the bonded joint relies mainly on the bonding of the adhesive to the plate and patch stiffness. Stress concentrations at crack tips promote disbonding of the composite patch from the substrate, consequently reducing the bonded area, which makes this a critical aspect of repair effectiveness. In this paper we examine patch disbonding by calculating the influence of notch tip stress on disbond area and verify computational results with acoustic emission (AE) measurements obtained from specimens subjected to uniaxial tension. The FE results showed that disbonding first occurs between the patch and the substrate close to free edge of the patch followed by failure around the tip of the notch, both highest stress regions. Experimental results revealed that cement adhesion at the aluminum interface was the limiting factor in patch performance. The patch did not appear to strengthen the aluminum substrate when measured by stress-strain due to early stage disbonding. Analysis of the AE signals provided insight to the disbond locations and progression at the metal-adhesive interface. Crack growth from the notch in the aluminum was not observed until the stress reached a critical level, an instant before final fracture, which was unaffected by the patch due to early stage disbonding. The FE model was further utilized to study the effects of patch fiber orientation and increased adhesive strength. The model revealed that the effectiveness of patch repairs is strongly dependent upon the combined interactions of adhesive bond strength and fiber orientation.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2016.11a
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• pp.195-195
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• 2016

Titanium and its alloys are widely used as implants in orthopedics, dentistry and cardiology due to their outstanding properties, such as high strength, high level of hemocompatibility and enhanced biocompatibility. Hence, recent works showed that the synthesis of new Ti-based alloys for implant application involves more biocompatible metallic alloying element, such as, Nb, Hf, Zr and Mo. In particular, Nb and Hf are one of the most effective Ti ${\beta}-stabilizer$ and reducing the elastic modulus. Plasma electrolyte oxidation (PEO) is known as excellent method in the biocompatibility of biomaterial due to quickly coating time and controlled coating condition. The anodized oxide layer and diameter modulation of Ti alloys can be obtained function of improvement of cell adhesion. Silicon (Si) and magnesium (Mg) has a beneficial effect on bone. Si in particular has been found to be essential for normal bone and cartilage growth and development. In vitro studies have shown that Mg plays very important roles in essential for normal growth and metabolism of skeletal tissue in vertebrates and can be detected as minor constituents in teeth and bone. The aim of this study is to research Si and Mg doped hydroxyapatite film formation by plasma electrolytic oxidation. Ti-29Nb-xHf (x= 0, 3, 7 and 15wt%, mass fraction) alloys were prepared Ti-29Nb-xHf alloys of containing Hf up from 0 wt% to 15 wt% were melted by using a vacuum furnace. Ti-29Nb-xHf alloys were homogenized for 2 hr at $1050^{\circ}C$. Each alloy was anodized in solution containing typically 0.15 M calcium acetate monohydrate + 0.02 M calcium glycerophosphate at room temperature. A direct current power source was used for the process of anodization. Anodized alloys was prepared using 270V~300V anodization voltage at room. A Si and Mg coating was produced by RF-magnetron sputtering system. RF power of 100W was applied to the target for 1h at room temperature. The microstructure, phase and composition of Si and Mg coated oxide surface of Ti-29Nb-xHf alloys were examined by FE-SEM, EDS, and XRD.