• Title/Summary/Keyword: interdiffusion

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Characterization of Solid Phase Crystallization in Sputtered and LFCVD Amorphous Silicon Thin Film (스퍼터링 및 저압화학기상증착 비정질 실리곤 박막의 고상 결정화 특성)

  • 김형택
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1995.11a
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    • pp.89-93
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    • 1995
  • Effects of hydrogenation in amorphous silicon rile growths on Solid Phase Crystallization (SPC) was investigated using x-ray diffractometry, energy dispersive Spectroscopy, and Raman spectrum. Interdiffusion of barium(Ba) and aluminum(Al) compounds of corning substrate was observed in both of rf sputtering and LFCVD films under the low temperature(580$^{\circ}C$) annealing. Low degree of crystallinity resulted from the interdiffusion was obtained. Highly applicable degree of crystallinity was obtained through the mechanical damage induced surface activation on amorphous silicon films. X-ray diffraction intensity of (111) orientation was used to characterize the degree of crystallinity of SPC. Nucleation and growth rate in SPC could be controllable through the employed surface treatment. IIydrogenated LPCVD films showed the superior crystallinity to non-hydrogenated sputtering films. Insignificant effects of activation treatment in sputtered film was of activation treatment in sputtered film was observed on SPC.

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X-ray diffraction analysis of ZnS/ZnSe superlattices prepared by hot wall epitaxy (열벽적층성장에 의하여 제작된 ZnS/ZnSe 초격자의 X-선 회절분석)

  • Yong Dae Choi;A. Ishida;Fujiyasu, H.
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.6 no.3
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    • pp.377-385
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    • 1996
  • ZnS/ZnSe superlattices were prepared on GaAs (100) substrates by hot wall epitaxy, an the structures were analyzed using x-ray diffraction. It is shown that the x-ray diffraction of the strained superlattice gives very useful information about the thickness of each layer, strain, interdiffusion, and the fluctuation of the superlattice period. Interdiffusion length of the S and Se is estimated to be less than $2\;{\AA}$.

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Development of advanced laser processing for the fabrication of HTS metallic tapes for power applications (전력용 고온초전도 금속테이프 제작을 위한 첨단 레이저공정 개발)

  • Lee, Sang-Yeol
    • Proceedings of the KIEE Conference
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    • 1997.11a
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    • pp.688-691
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    • 1997
  • Good quality superconducting $YBa_2Cu_30_{7-{\delta}}$(YBCO) thin films were grown on Hastelloy (Ni-Cr-Mo alloys) with yttria-stabilized zirconia(YSZ) buffer layers by in situ pulsed laser deposition in a multi-target processing chamber. Generally, Hastelloy exhibits excellent resistance to corrosion, fatigue, thermal shock, impact, and erosion. However, it is difficult to make films on flexible metallic substrates due to interdiffusion problems between metallic substrates and superconducting overlayers. To overcome this difficulty, it is necessary to use YSZ buffer layer since it will not only limit the interdiffusion process but also minimize the surface microcrack formation due to smaller mismatch between the film and the substrate. In order to enhance the crystallinity of YBCO films on metallic substrates, YSZ buffer layers were grown at various temperatures different from the deposition temperature of YBCO films. On YSZ buffer layer grown at higher temperature than that for depositing YBCO film, the YBCO thin film was found to be textured with c-axis orientation by x-ray diffraction and had a zero-resistance critical temperature of about 85K.

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W-B-C-N 확산방지막에서 질소농도에 따른 Stress 에 대한 연구

  • So, Ji-Seop;Lee, Channg-U
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2005.11a
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    • pp.72-73
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    • 2005
  • Stress behavior was studied to investigate the internal behaviors of boron, carbon, and nitrogen in the 1000${\AA}$-thick tungsten boron carbon nitride (W-B-C-N) thin films. The impurities in the W-B-C-N thin films provide stuffing effects that were very effective for preventing the interdiffusion between interconnection metal and silicon substrate during the subsequent high temperature annealing process. The resistivity of W-B-C-N thin film decreases as an annealing temperature increase. The W-B-C-N thin films have compressive stress, and the stress value decreased up to $4.11\times10^{10}dyne/cm^2$ as an $N_2$ flow rate increases up to 3 sccm.

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Product Phase Control During Interdiffusion Reactions (상호 확산 반응 중의 생성상 제어)

  • Park, Joon-Sik;Kim, Ji-Hoon;Perepezko, John R.
    • Journal of Korea Foundry Society
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    • v.26 no.1
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    • pp.27-33
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    • 2006
  • Phase evolutions involving nucleation stages together with diffusional growth have been examined in order to provide a guideline for determining rate limiting stages during phase evolutions. In multiphase materials systems in coatings, composites or multilayered structures, diffusion treatments often result in the development of metastable/intermediate phases at the reaction interfaces. The development of metastable phases during solid state interdiffusion demonstrates that the nucleation reaction can be one controlling factor. Also, the concentration gradient and the relative magnitudes of the component diffusivities provide a basis for a phase selection and the application of a kinetic bias strategy in the phase selection. For multicomponent alloy systems, the identification of the operative diffusion pathway is central to control phase formation. Experimental access to the nucleation and growth stage is discussed in thin film multi layers and bulk samples.

Cross-sectional radiation type micromixer to mixed interface using PZT (PZT를 이용한 계면 교차 방향 방사형 마이크로믹서)

  • Heo, Pil-Woo;Kim, Deok-Jong;Kim, Jae-Yun;Park, Sang-Jin;Yun, Eui-Soo;Koh, Kwang-Sik
    • 유체기계공업학회:학술대회논문집
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    • 2003.12a
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    • pp.121-125
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    • 2003
  • Micromixer plays an important role in Bio-MEMS or ${\mu}-TAS$. Mixing is generally generated by turbulence and interdiffusion of two fluids. Because of low Reynolds number(Re << 2000) in ${\mu}-channel$, it is difficult to generate turbulence, so mixing mainly depends on interdiffusion. Thus long channel distance is required to mix two different fluids. To reduce the channel length required for mixing, we propose the a new active ${\mu}-mixer$ that two fluids are effectively mixed in ${\mu}-channel$ by the ultrasonic wave which is generated by PZT. The ultrasonic wave is radiated into a chamber in the cross-section directional direction to interface with the two fluids. The two fluids are positioned one on top of the other. Mixing state is measured by the changing of color due to the reaction of NaOH and phenolphtalein.

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Property of Carbon Layer for C/W Multilayer Mirror (C/W 다층박막 거울의 탄소층 특성 Property of Carbon Layer for C/W Multilayer Mirror)

  • Park, Byoung-Hun;Choi, Hyung-Wouk;Oh, Sun-Ju;Yoon, Kwon-Ha;Chon, Kwon-Su
    • Journal of the Korean Society of Radiology
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    • v.4 no.4
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    • pp.33-36
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    • 2010
  • Multilayer mirrors are very useful for applications of high energy X-ray. X-rays of high energy require very small thickness, a few nanometers, in the d-spacing of a multilayer mirror. Each layer is composed of a multilayr mirror influences to interfacial roughness or interdiffusion which gives rise to degrade specular reflection. Carbon layer of 1 nm thick in a C/W multilayer mirror of 3.25 nm d-spacing was examined. Carbon as well as tungsten layers were very uniform, and there was no micro-structure in carbon layers. However, interdiffusion between carbon and tungste layers was observed by a transmission electron microscope.

Pt/Al Reaction Mechanism in the FeRAM Device Integration (FeRAM 소자 제작 중에 발생하는 Pt/Al 반응 기구)

  • Cho Kyoung-Won;Hong Tae-Whan;Kweon Soon-Yong;Choi Si-Kyong
    • Korean Journal of Materials Research
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    • v.14 no.10
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    • pp.688-695
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    • 2004
  • The capacitor contact barrier(CCB) layers have been introduced in the FeRAM integration to prevent the Pt/Al reaction during the back-end processes. Therefore, the interdiffusion and intermetallic formation in $Pt(1500{\AA})/Al(3000{\AA})$ film stacks were investigated over the annealing temperature range of $100\sim500^{\circ}C$. The interdiffusion in Pt/Al interface started at $300^{\circ}C$ and the stack was completlely intermixed after annealing over $400^{\circ}C$ in nitrogen ambient for 1 hour. Both XRD and SBM analyses revealed that the Pt/Al interdiffusion formed a single phase of $RtAl_2$ intermetallic compound. On the other hand, in the presence of TiN($1000{\AA}$) barrier layer at the Pt/Al interface, the intermetallic formation was completely suppressed even after the annealing at $500^{\circ}C$. These were in good agreement with the predicted effect of the TiN diffusion barrier layer. But the conventional TiN CCB layer could not perfectly block the Pt/Al reaction during the back-end processes of the FeRAM integration with the maximum annealing temperature of $420^{\circ}C$. The difference in the TiN barrier properties could be explained by the voids generated on the Pt electrode surface during the integration. The voids were acted as the starting point of the Pt/Al reaction in real FeRAM structure.