• Journal of Internet Computing and Services
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• v.15 no.5
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• pp.123-132
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• 2014

Internet is composed of many independent networks referred to as Internet Service Providers (ISPs) and each provider is generally interconnected based on a commercial agreement. Though many countries are engaged in deregulation in internet interconnection, there is still debate whether the large ISPs are unwilling to peer with small providers, have incentives to lower the quality of data transmission of transit operators or set the interconnection charge regarding the actual costs incurred by the interconnection. Korean government introduced regulations in internet interconnection after observing noticeable anti-competitive behaviors from 2005. This paper analyzes whether there is margin squeeze problem/market concentration, and suggests political proposals in Korean regulation status.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.15 no.5
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• pp.1007-1017
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• 2011

It is important to set the new interconnection system under NGN. The traditional interconnection system is based on traffic, but this is not suitable for IP based service. Therefore, it is needed to ensure the universal access to network without trouble about the network topology. This paper prepares the evaluation criteria and evaluates the alternatives. Specifically, we deduce the alternatives and evaluates the alternatives of interconnection settlement system based on the condition of efficient interconnection, the retail price and access charging model, and the previous studies evaluating and examining the various alternatives. Finally, we evaluate each alternatives by the criteria.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.73-73
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• 2009

In this sutdy, a new class ACA(Anisotropic Conductive Adhesive) with low-melting-point alloy(LMPA) and self-organized interconnection method were developed. This developed self-organized interconnection method are achieved by the flow, melting, coalescence and wetting characteristics of the LMPA fillers in ACA. In order to observe self-interconnection characteristic, the QFP($14{\times}14{\times}2.7mm$ size and 1mm lead pitch) was used. Thermal characteristic of the ACA and temperature-dependant viscosity characteristics of the polymer were observed by differential scanning calorimetry(DSC) and torsional parallel rheometer, respectively. A electrical and mechanical characteristics of QFP bonding were measured using multimeter and pull tester, respectively. Wetting and coalescence characteristics of LMPA filler particles and morphology of conduction path were observed by microfocus X-ray inspection systems and cross-sectional optical microscope. As a result, the developed self-organized interconnection method has a good electrical characteristic($2.41m{\Omega}$) and bonding strength(17.19N) by metallurgical interconnection of molten solder particles in ACA.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.3
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• pp.63-69
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• 2019

Soldering technology has been used in electronic industry for a long time. However, due to solder fatigue characteristics, automotive electronics are searching the semi-permanent interconnection technology such as press-fit method. Press fit interconnection is a joining technology that mechanically inserts a press fit metal terminal into a through hole in a board, and induces a strong bonding by closely contacting the inner surface joining of the through hole by plastic deformation of press-fit terminal. In this paper, the bonding properties of press-fit interconnection are investigated with PCB hole size and surface finishes. In order to compare interconnection reliability between the press fit and soldering, the change in resistance of the press-fit and soldering joints was observed during thermal shock test. After thermal cycling, the failure modes are investigated to reveal the degradation mechanism both press-fit and soldering technology.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.21 no.6
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• pp.91-97
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• 2021

A microserver is a type of a computing server, in which two or more CPU nodes are implemented on a separate computing board, and a plurality of computing boards are integrated on a main board. In building a cluster system, the microserver has advantages in several points such as energy efficiency, area occupied, and ease of management compared to the existing method of mounting legacy servers in multiple racks. In addition, since the microserver uses a fast interconnection network between CPU nodes, performance improvement for data transfers is expected. The proposed microserver can mount a total of 16 computing boards with 4 CPU nodes on the main board, and uses Serial-RapidIO (SRIO) as an interconnection network. In order to analyze the performance of the proposed microserver in terms of the interconnection network which is a core performance issue of the microserver, we compare and quantify the performance of commercial microservers. As a result of the test, it showed up to about 7 times higher bandwidth improvement when transmitting data using the interconnection network. In addition, with CloudSuite benchmark programs used in actual cloud computing, maximum 60% reduction in execution time was obtained compared to commercial microservers with similar CPU performance specification.

• Journal of KIISE:Software and Applications
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• v.29 no.7
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• pp.436-449
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• 2002

This paper describes on our experience of developing the Database Connector as an interconnection method between multimedia database, and the streaming framework. It is possible to support diverse and mature multimedia database services such as retrieval and join operation during the streaming if an interconnection method is provided in between streaming system and multimedia databases. The currently available interconnection schemes, however have mainly used the file systems or the relational databases that are Implemented with separated form of meta data, which deafs with information of multimedia contents, and streaming data which deals with multimedia data itself. Consequently, existing interconnection mechanisms could not come up with many virtues of multimedia database services during the streaming operation. In order to resolve these drawbacks, we propose a novel scheme for an interconnection between streaming framework and multimedia database, called the Inter-Process Communication (IPC) based Database connector, under the assumption that two systems are located in a same host. We define four transaction primitives; Read, Write, Find, Play, as well as define the interface for transactions that are implemented based on the plug-in, which in consequence can extend to other multimedia databases that will come for some later years. Our simulation study show that performance of the proposed IPC based interconnection scheme is not much far behind compared with that of file systems.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.09a
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• pp.87-119
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• 2001

Fine Pitch Technology will be accelerated among next decade. Buildup Technology is Key Technology for High Density Interconnection. Novel Base Material is critical for High Speed, Area Array Flip Chip Application. Japanese PWB Technology Roadmap will be Published soon.

• 제어로봇시스템학회:학술대회논문집
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• 1987.10b
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• pp.389-393
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• 1987

This paper describes the configuration of serial interconnection BUS, BitBUS, for Energy Management Systems, and it provides low cost, high performance approach in distributed data acquisition and control applications.

• Journal of the Korean Chemical Society
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• v.47 no.6
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• pp.659-662
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• 2003

• Environmental and Resource Economics Review
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• v.17 no.3
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• pp.167-199
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• 2008

There are many successful cases in power interconnection among European and South American countries. However, that is not the case in Northeast Asian countries. Even though there will be a considerable benefit in power interconnection in Northeast Asian countries, there will be some difficulties due to various interest relationship and constraints among countries in Northeast Asia. GTMax(Generation and Transmission Maximization) Program is a very useful tool to analyze competitive electricity market and power interconnection developed by Argonne National Laboratory under the Department of Energy in the USA. This study tried to verify applicability and usefulness by GTMax model to domestic electric power system and power transfer from Russia Far East by power interconnection. When the power by importing from Russia is 2,000MW(around 2% of domestic installed capacity in 2017), there is no impact on domestic electricity market because of small power transfer. The power by importing should be large enough for achieving greater cost reduction by power interconnection. Besides, it would be better to supply power to Kyung-In region directly in reducing overall cost when the power by importing from Russia are sold at low price. In the case of interconnecting Young-Dong region, if it is not possible to upgrade transmission line with power transfer capabilities between Young-Dong and Kyung-In region, then the power by importing from Russia can replace the power produced in Jung-Bu region and the relative benefit of importing power can be reduced.