• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.26 no.2
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• pp.71-76
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• 2020

CO₂ concentration in kimchi package has emerged recently as a potential index of product ripening to be monitored or sensed in intelligent packaging. Considering that addition of CO₂ absorber into the flexible kimchi package changes behavior of its CO₂ concentration, ripening of kimchi in total acidity, package CO₂ concentration in partial pressure (P_CO2) and package volume at 10℃ were estimated by mathematical model for two size packages included with different CO₂ absorbers. In small size package containing 0.5 kg of kimchi, relatively less gas permeable low density polyethylene (LDPE) sachet of the absorber was found to give rise of P_CO2 linearly correlated with acidity at acceptable conditions of absorber amount and size. The levels of P_CO2 at optimum ripening were different with absorber amount. However, highly gas permeable microporous spunbonded film (Tyvek) sachet did not show the linear relationship except a condition of 1.5 g of CO₂ absorbent. In large size package containing 2.0 kg, absorber sachets of LDPE and Tyvek could give the linear relationship between product acidity and package P_CO2 but at different levels (P_CO2 of package with LDPE sachet: 0.46~0.79 bar, P_CO2 of package with Tyvek sachet: 0.00~0.75 bar). The P_CO2 at optimal ripening was found to be less variable with LDPE sachets than with Tyvek ones. Use of package CO₂ concentration as an indicator of kimchi ripening was shown to be possible on the limited conditions where the linear relationship between them is established or confirmed.

• Journal of Intelligence and Information Systems
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• v.29 no.3
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• pp.79-101
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• 2023

The current status of local road pavement management in Jeollabuk-do only relies on the accomplishments of the site construction company's pavement repair and is only managed through Microsoft Excel and word documents. Furthermore, the budget is irregular each year. Accordingly, a systematic maintenance plan for local roads is necessary. In this paper, data related to road damage and road environment were collected and processed to derive possible areas which could suffer from road damage. The effectiveness of the methodology was reviewed through the on-site inspection of the area. According to the Ministry of Land, Infrastructure and Transport, in 2018, the number of damages on general national roads were about 47,000. In 2019, it reached around 38,000. Furthermore, the number of lawsuits regarding the road damages were about 93 in 2018 and it increased to 119 in 2019. In the case of national roads, the number of damages decreased compared to 2018 due to pavement repairs. To measure the priorities in maintenance of local roads at Jeollabuk-do, data on maintenance history, local port hole occurrence site, overlapping business section, and emergency maintenance section were transformed into data. Eventually, it led to improvements in maintenance of local roads. Furthermore, spatial data were constructed using various current status data related to roads, and finally the data was processed into a new form that could be utilized in machine learning and predictions. Using the spatial data, areas requiring maintenance on pavement were predicted and the results were used to establish new budgets and policies on road management.

• The Journal of The Korea Institute of Intelligent Transport Systems
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• v.7 no.1
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• pp.101-114
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• 2008

Ubiquitous City (u-City) and Intelligent Transport System (ITS) provide services, which are different from each other yet have close relation to each other partially. Thus, since a redundancy issue occurs or it is difficult to efficiently provide services depending on the relation degree, it is required to analyze the relation of services between the two systems and to elicit a priority. A table of relation among the services was created and the relation degree was analyzed by performing a survey for experts. As a result of calculating the total marks by accumulating and summing up the survey results, the incident management service and u-accident/calamity and disaster service of the ITS had the lowest value. The project priority was as follows: The basic principle of the project was that services with high relation degrees shall be worked on first. The services were categorized in each step and packaging the services could result in the synergy effect. This study is significant since it analyzed the relation degree between u-City and ITS and proposed schemes for efficiently working on the project by eliciting the priority of the services based on the analysis results.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.3-6
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• 2004

Power semiconductor devices are being compact, high performance and intelligent thanks to recent remarkable developments of silicon design, process and related packaging technologies. Developments of MOS-gate transistors such as MOSFET and IGBT are dominant thanks to their advantages on high speed operation. In conjunction with package technology, silicon technologies such as trench, charge balance and NPT will support future power semiconductors. In addition, wide band gap material such as SiC and GaN are being studies for next generation power semiconductor devices.

• Journal of Korea Multimedia Society
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• v.25 no.8
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• pp.1085-1096
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• 2022

The manufacturing industry is continuously pursuing advanced technology and smartization as it converges with innovative technology. Improvement of manufacturing productivity is achieved by monitoring, analyzing, and controlling the facilities and processes of the manufacturing site in real time through a network. In this paper, we proposed a new OPC-UA based digital twin model for smart factory facilities. A testbed system for USB flash drive packaging facility was implemented based on the proposed digital twin model and OPC-UA data communication scheme. Through OPC-UA based digital twin model, equipment and process status information is transmitted and received from PLC to monitoring and control 3D digital models and physical models in real time. The usefulness of the developed digital twin testbed system was evaluated through usability test.

• Journal of the Korean Institute of Intelligent Systems
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• v.23 no.3
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• pp.226-231
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• 2013

In The matching algorithm for automatic packaging of drugs is essential to determine whether the canister can exactly refill the suitable medicine. In this paper, we propose a hierarchical neural network with the upper and lower layers which can perform real-time processing and classification of many types of medicine bottles to prevent accidental medicine disaster. A few number of low-dimensional feature vector are extracted from the label images presenting medicine-bottle information. By using the extracted feature vectors, the lower layer of MLP(Multi-layer Perceptron) neural networks is learned. Then, the output of the learned middle layer of the MLP is used as the input to the upper layer of the MLP learning. The proposed hierarchical neural network shows good classification performance and real- time operation in the test of up to 30 degrees rotated to the left and right images of 100 different medicine bottles.

• Proceedings of the IEEK Conference
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• 2000.06b
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• pp.96-99
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• 2000

We presents a BGA(Ball Grid Array) package for RF circuit modules and extracted its electrical parameters. We constructed a BGA package of ITS(Intelligent Transportation System) RF module and examined electrical parameters with a HP5475A TDR(Time Domain Reflectometry) equipment and compared its electrical parasitic parameters with PCB RF circuits. With a BGA substrate of 3 $\times$ 3 input and output terminals, we have found that self capacitance of BGA solder ball is 68.6fF, self inductance 146pH, mutual capacitance 10.9fF and mutual inductance 16.9pH. S parameter measurement with a HP4396B Network Analyzer showed the resonance frequency of 1.55㎓ and the loss of 0.26dB. Thus, we may improve electrical performance when we use BGA package structures in the design of RF circuit modules.

• 전자공학회논문지 IE
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• v.48 no.4
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• pp.30-39
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• 2011

This paper proposed a new concept of information space called Smart Floor. Smart Floor is an intelligent space where a mobile robot can read and write specific information through Radio Frequency IDentification (RFID) tags which are mounted on Smart Floor to drive its goal position. RFID tag packaging technology is described for building Smart Floor. Also a mobile robot equipped passive RFID System with ultra high frequency (UHF) bandwidth has developed. The information that consists of an absolute position in the Smart Floor and desired direction saved on RFID tags is a simulated Q-value based on Q-learning algorithm. Proposed Smart Floor will be a proper method to communicate between space and robot.

• Smart Structures and Systems
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• v.6 no.3
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• pp.309-333
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• 2010

Civil infrastructure, in both its construction and maintenance, represents the largest societal investment in this country, outside of the health care industry. Despite being the lifeline of US commerce, civil infrastructure has scarcely benefited from the latest sensor technological advances. Our future should focus on harnessing these technologies to enhance the robustness, longevity and economic viability of this vast, societal investment, in light of inherent uncertainties and their exposure to service and even extreme loadings. One of the principal means of insuring the robustness and longevity of infrastructure is to strategically deploy smart sensors in them. Therefore, the objective is to develop novel, durable, smart sensors that are especially applicable to major infrastructure and the facilities to validate their reliability and long-term functionality. In some cases, this implies the development of new sensing elements themselves, while in other cases involves innovative packaging and use of existing sensor technologies. In either case, a parallel focus will be the integration and networking of these smart sensing elements for reliable data acquisition, transmission, and fusion, within a decision-making framework targeting efficient management and maintenance of infrastructure systems. In this paper, prudent and viable sensor and health monitoring technologies have been developed and used in several large structural systems. Discussion will also include several practical bridge health monitoring applications including their design, construction, and operation of the systems.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.3
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• pp.40-50
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• 2023

Recently, the number of components of smartphones increases rapidly, while the PCB size continuously decreases. Therefore, 3D technology with a stacked PCB has been developed to improve component density in smartphone. For the s tacked PCB, it i s very important to obtain solder bonding quality between PCBs. We investigated the effects of the properties, thickness, and number of layers of interposer PCB and sub PCB on warpage of PCB through experimental and numerical analysis to improve the reliability of the stacked PCB. The warpage of the interposer PCB decreased as the thermal expansion coefficient (CTE) of the prepreg decreased, and decreased as the glass transition temperature (Tg) increased. However, if temperature is 240℃ or higher, the reduction of warpage is not large. As FR-5 was applied, the warpage decreased more compared to FR-4, and the higher the number and thickness of the prepreg, the lower the warpage. For sub PCB, the CTE was more important for warpage than Tg of the prepreg, and increase in prepreg thickness was more effective in reducing the warpage. The shear tests indicated that the dummy pad design increased bonding strength. The tumble tests indicated that crack occurrence rate was greatly reduced with the dummy pad.