• Journal of the Ergonomics Society of Korea
• /
• v.30 no.5
• /
• pp.645-650
• /
• 2011

Objective: The aim of this study is to design a sampling inspection plan with human error which is changing according to inspection time. Background: Typical sampling inspection plans have been established typically based on an assumption of the perfect inspection without human error. However, most of all inspection tasks include human errors in the process of inspection. Therefore, a sampling inspection plan should be designed with consideration of imperfect inspection. Method: A model for single sampling inspection plans were proposed for the cases that visual inspection error rate is changing according to inspection time. Additionally, a sampling inspection plan for an optimal inspection time was proposed. In order to show an applied example of the proposed model, an experiment for visual inspection task was performed and the inspection error rates were measured according to the inspection time. Results: Inspection error rates changed according to inspection time. The inspection error rate could be reflected on the single sampling inspection plans for attribute. In particular, inspection error rate in an optimal inspection time may be used for a reasonable single sampling plan in a practical view. Conclusion: Human error rate in inspection tasks should be reflected on typical single sampling inspection plans. A sampling inspection plan with consideration of human error requires more sampling number than a typical sampling plan with perfect inspection. Application: The result of this research may help to determine more practical sampling inspection plan rather than typical one.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2004.10a
• /
• pp.993-997
• /
• 2004

A data error inspection algorithm for wireless digital data communication was developed. Original data converted By wireless digital data error inspection algorithm. Wireless digital data is high possibility to get distortion and lose by noise and barrier on wireless. If the data check damaged and lost at receiver, can't make it clear and can't judge whether this data is right or not. Therefore, by wireless transmission data need the data error inspection algorithm in order to decrease the data distortion and lose and to monitoring the transmission data as real time. This study consists of RF station for wireless transmission, Water Level Meter station for water level measurement and Error inspection algorithm for error check of transmission data. This study is also that investigation and search for error inspection algorithm in order to wireless digital data transmission in condition of the least data's damage and lose. Designed transmitter and receiver with one - chip micro process to protect to swell the volume of circuit. Had designed RF transmitter - receiver station simply by means of ATMEL one - chip micro processing the systems. Used 10mW of the best RF power and 448MHz-449MHz on frequency band which is open to public touse free within the limited power.

• Journal of Korean Society of Industrial and Systems Engineering
• /
• v.41 no.2
• /
• pp.117-132
• /
• 2018

There always exist nonzero inspection errors whether inspectors are humans or automatic inspection machines. Inspection errors can be categorized by two types, type I error and type II error, and they can be regarded as either a constant or a random variable. Under the assumption that two types of random inspection errors are distributed with the "uniform" distribution on a half-open interval starting from zero, it was proved that inspectors overestimate any given fraction defective with the probability more than 50%, if and only if the given fraction defective is smaller than a critical value, which depends upon only the ratio of a type II error over a type I error. In addition, it was also proved that the probability of overestimation approaches one hundred percent as a given fraction defective approaches zero. If these critical phenomena hold true for any error distribution, then it might have great economic impact on commercial inspection plans due to the unfair overestimation and the recent trend of decreasing fraction defectives in industry. In this paper, we deal with the same overestimation problem, but assume a "symmetrical triangular" distribution expecting better results since our triangular distribution is closer to a normal distribution than the uniform distribution. It turns out that the overestimation phenomenon still holds true even for the triangular error distribution.

• Proceedings of the KIEE Conference
• /
• 2008.10b
• /
• pp.145-146
• /
• 2008

The appearance inspection of various electronic products and parts has been executed by the eyesight of human. But inspection by eyesight cannot bring about uniform inspection result. Because the appearance inspection result by eyesight of human is changed by condition of physical and spirit of the checker. So machine vision inspection system is currently used to many appearance inspection fields instead of the checker. However the inspection result of machine vision is changed by the illumination of workplace. Therefore we proposed histogram specification in this paper for machine vision inspection accuracy. As a result of histogram specification algorithm, we could increase the exactness of visual inspection and prevent system error from physical and spirit condition of human. More specifically, average inspection error rate was 7.5[%] in existing inspection method but we could see 0.6[%] error rate after applying the algorithm which is presented in this paper.

• Journal of the Semiconductor & Display Technology
• /
• v.10 no.2
• /
• pp.97-102
• /
• 2011

Lots of 2D vision algorithms have been applied for inspection. However, these 2D vision algorithms have limitation in inspection applications which require 3D information data such as the height of semiconductor chips. Stereo vision is a well known method to measure the distance from the camera to the object to be measured. But it is difficult to apply for inspection directly because of its measurement error. In this paper, we propose two adjustment methods to reduce the error of the measured height data for stereo vision. The weight value based model is used to minimize the mean squared error. The average value based model is used with simple concept to reduce the measured error. The effect of these algorithms has been proved through the experiments which measure the height of semiconductor chips.

• Journal of Korean Society for Quality Management
• /
• v.29 no.3
• /
• pp.66-78
• /
• 2001

This paper deals with problem of determining process target value under automated visual inspection(AVI) system. Three independent error sources - digitizing error, illumination error, and positional error - which have a close relationship with the performance of the AVI system, are considered. Assuming that digitizing error is uniformly or normally distributed and illumination and positional errors are normally distributed, respectively, the distribution function for the error of measured lengths is derived when the length of a product is measured by the AVI system. Then, Optimal target values under two error models of AVI system are obtained by minimizing the total expected cost function which consists of give away, rework and penalty cost. To validate two process setting models, AVI system for drinks filling process is made up and test results are discussed.

• Journal of Industrial Technology
• /
• v.3
• /
• pp.27-32
• /
• 1983

This paper develops and provides formulas for calculating the Average Outgoing Quality and the Average Total Inspection for nine different sample/rest-of-lot disposition policies in which rectifying multiple sampling inspection by attribute can be carried out. The formulas are considered for perfect inspection as well as error-prone inspection.

• Journal of Korean Society for Quality Management
• /
• v.24 no.2
• /
• pp.54-64
• /
• 1996

The inspection policy and inspection error are very critical factors which influence the outgoing quality. In other words, such factors influence the acceptance rate of the incoming matarials. Hence, the outgoing lot size is varied. This paper presents a method to compute the break-even point(pb1, pb2) under these two factors, which canbe used to determine the economic acceptance inspection type.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2004.10a
• /
• pp.323-326
• /
• 2004

In this study, the inspection path which is considered to free collision is generated by offset surface. When the inspection is executed, the consideration of machine dynamic error increases a precision. Dynamic error is measured on CNC machine bed changing of weight work price. Offset surface is safety space about collision. Because the danger of probe-collision is excluded in Offset surface, it is possible to rapid feed of probe and reduced inspection time. The Program which is possible to simulate using CAIP and is confirmed through actual experiment.

• Journal of Institute of Control, Robotics and Systems
• /
• v.15 no.9
• /
• pp.916-921
• /
• 2009

The technology to inspect and measure an inner structure of micro parts has become an important tool in the semi-conductor industrial field with the development of automation and precision manufacturing. Especially, the inspection skill on the inside of highly integrated electronic device becomes a key role in detecting defects of a completely assembled product. X-ray inspection technology has been focused as a main method to inspect the inside structure. However, there has been insufficient research done on the customized inspection technology for the flip-chip assembly due to the interior connecting part of flip chip which connects the die and PCB electrically through balls positioned on the die. In this study, therefore, it is implemented to detect shape error of flip chip bonding without damaging chips using an x-ray inspection system. At this time, it is able to monitor the solder bump shape by introducing an edge-extracting algorithm (exponential approximation function) according to the attenuating characteristic and detect shape error compared with CAD data. Additionally, the bonding error of solder bumps is automatically detectable by acquiring numerical size information at the extracted solder bump edges.