• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2012년도 춘계 학술논문 발표대회
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• pp.217-218
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• 2012

To prevent energy waste in buildings used heat insulator. Heat insulator materials can be classified inorganic and organic. The organic material is be toxic gas emission, when a fire occurs. And it has lower water resistance. The inorganic material is heavy and worse thermal performance than organic materials. This study focused on thermal conductivity and density of inorganic foam material for using industrial by-products materials.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2013년도 추계 학술논문 발표대회
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• pp.198-199
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• 2013

To prevent energy waste in buildings used heat insulator. Heat insulator materials can be classified inorganic and organic. The inorganic material has lower water resistance. The inorganic material is heavy and worse thermal performance than organic materials. Technologies on energy saving and materials used in curtain walls have progressed with increase of high-rise and large buildings. However, there is little study to explain water resistance performance of the curtain walls. This study focused on evaluation of insulation of inorganic materials and performance evaluation by thermal conductivity.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2012년도 추계 학술논문 발표대회
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• pp.211-212
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• 2012

To prevent energy waste in buildings used heat insulator. Heat insulator materials can be classified inorganic and organic. The organic material is due to toxic gas emission, when a fire occurs. And it has lower water resistance. The inorganic material is heavy and worse thermal performance than organic materials. Technologies on energy saving and materials used in curtain walls have progressed with increase of high-rise and large buildings. However, there is little study to explain fire resistance performance of the curtain walls. This study focused on evaluation of the physical properties of light-weight inorganic foam panel for using industrial by-products materials and performance evaluation by mock up test.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2011년도 추계 학술논문 발표대회
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• pp.79-81
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• 2011

To prevent energy waste in buildings used heat insulator. Heat insulator materials can be classified inorganic and organic. The organic material is due to toxic gas emission, when a fire occurs. And it has lower water resistance. The inorganic material is heavy and worse thermal performance than organic materials. This study focused on evaluation of the physical properties and fire-resistance of inorganic foam material for using industrial by-products materials for the applicability of Fire-resistance Light-weight material.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2015년도 춘계 학술논문 발표대회
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• pp.90-91
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• 2015

Heat insulator materials can be classified inorganic and organic. The organic material is due to toxic gas emission, when a fire occurs. And it has lower water resistance. The inorganic material is heavy and worse thermal performance than organic materials. In this study, cullet and fly ash were used as basic materials in order to secure a recycling technology of by-products which was mostly discarded and reclimed, and measure of physical properties of light-weight ceramic insulator.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2014년도 추계 학술논문 발표대회
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• pp.180-181
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• 2014

Heat insulator materials can be classified inorganic and organic. The organic material is due to toxic gas emission, when a fire occurs. And it has lower water resistance. The inorganic material is heavy and worse thermal performance than organic materials. In this study, cullet and fly ash were used as basic materials in order to secure a recycling technology of by-products which was mostly discarded and reclimed, and measure of physical properties of light-weight ceramic insulator.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2016년도 춘계 학술논문 발표대회
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• pp.124-125
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• 2016

This study is to development of inorganic insulation material using by-product materials. The organic material is due to toxic gas emission, when a fire occurs. And it has lower water resistance. The inorganic material is heavy and worse thermal performance than organic materials.In this study, cullet and fly ash were used as basic materials in order to secure a recycling technology of by-products which was mostly discarded and reclimed, and measure of physical properties of light-weight ceramic insulator.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2003년도 International Meeting on Information Display
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• pp.932-934
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• 2003

For the insulator of inorganic thin film electroluminescent (TFEL), devices AlON combined with TiON was used and it exhibits higher luminance than AlON as well as $Al_{2}O_{3}$ insulator. Furthermore, using AlON with TiON film show better stability and higher luminance than that with $TiO_{2}$ grown by conventional atomic layer deposition (ALD) for the application of the insulator of ZnS:Mn TFEL device.

• 전기의세계
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• 제18권2호
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• pp.15-20
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• 1969

The main focus of this paper is on the study of the .gamma. ray irradiation effect upon the electrical properties of a B-kind insulator which is one of the inorganic insulators. The mica is so typical of the B kind insulators as to be selected for a sample. DC, AC, and Impulse voltage is applied to the variable .gamma. ray irradiated dose samples with the constant time duration and the time variable samples with the .gamma. ray irradiated dose. The dielectric breakdown voltage and dielectric constant are measured from the samples and we get the experimental data that the dielectric breakown voltage variations are relatively large, but the dielectric constants are almost constant. The above conclusion is useful for the selection and application of the inorganic insulators under the irradiation effects, and we expect that the conclusion can apply to not only B-kind insulators but also the inorganic insulators.

• 한국세라믹학회지
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• 제39권4호
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• pp.377-385
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• 2002

Metal-Ferroelectric-Insulator-Semiconductor(MFIS) 구조의 적용하기 위해 R. F. 마그네트론 스퍼터를 이용하여 p-type Si(111) 기판 위에 $ZrO_2$와 $SrBi_2Ta_2O_9$ 박막을 증착하였다. SBT 박막은 $ZrO_2$ 완충층을 삽입함으로써 MFIS 구조의 전기적인 특성이 향상되었다. $ZrO_2$ 박막의 두께를 고정하고 SBT 박막의 두께를 160nm에서 220nm으로 변화시키면서 윈도우 메모리를 3-9V의 범위에서 측정하였다. Pt/SBT(160nm)/$ZrO_2$(20nm)/Si의 조건에서 최대 2.2V 메모리 윈도우 값을 얻을 수 있었으며 이 메모리 윈도우 값은 실제 적용되는 저전압 NDRO-FRAM 구동에 충분한 값이다.