• Journal of Electrochemical Science and Technology
• /
• v.14 no.3
• /
• pp.283-292
• /
• 2023

Currently, spray coating has attracted interest in the mass production of anode catalyst layers for proton exchange membrane water electrolysis (PEMWE). The solvent in the spray ink is a critical factor for the catalyst dispersion in ink, the microstructure of the catalyst layer, and the PEMWE performance. Herein, various pure organic solvents were examined as a substitute for conventional isopropanol-deionized water (IPA-DIW) mixture for ink solvent. Among the polar solvents that exhibited better IrO₂ dispersion over nonpolar solvents, 2-butanol (2-BuOH) was selected as a suitable candidate. The PEMWE single cells were fabricated using 2-BuOH at various ionomer contents, spray nozzle types, and drying temperatures, and their performance was compared to the cells fabricated using a conventional IPA-DIW mixture. The PEMWE single cells with 2-BuOH solvent showed good performances comparable to the conventional IPA-DIW mixture case and highly durable performances under accelerated degradation tests.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2011.08a
• /
• pp.376-376
• /
• 2011

I-III-VI2 chalcopyrite compounds, particularly copper, indium, gallium selenide(Cu(InxGa1-x)Se2, CIGS), are effective light-absorbing materials in thin-film solar application. They are direct band-gap semiconductors with correspondingly high optical absorption coefficients. Also they are stable under long-term excitation. CIS (CIGS) solar cell reached conversion efficiencies as high as 19.5%. Several methods to prepare CIS (CIGS) absorber films have been reported, such as co-evaporation, sputtering, selenization, and electrodeposition. Until now, co-evaporation is the most successful technique for the preparation of CIS (CIGS) in terms of solar efficiency, but it seems difficult to scale up. CIS solar cells have been hindered by high costs associated with a fabrication process. Therefore, inorganic colloidal ink suitable for a scalable coating process could be a key step in the development of low-cost solar cells. Here, we will present the preparation of CIS photo absorption layer by a solution process using novel metal precursors. Chalcopyrite copper indium diselenide (CuInSe2) nanocrystals ranging from 5 to 20nm in diameter were synthesized by arrested precipitation in solution. For the fabrication of CIS photo absorption layer, the CuInSe2 colloidal ink was prepared by dispersing in organic solvent and used to drop-casting on molybdenum substrate. We have characterized the nanoparticless and CIS layer by XRD, SEM, TEM, and ICP.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2004.08a
• /
• pp.141-144
• /
• 2004

A QVGA active-matrix backplane is produced on a 25${\mu}m$ thin plastic substrate. A 4-mask photolithographic process is used. The insulator layer and the semiconductor layer are organic material processed from solution. This backplane is combined with the electrophoretic display effect supplied by SiPix and E ink, resulting in an electronic paper display with a thickness of only 100${\mu}m$. This is world's thinnest active-matrix display ever made.

• Journal of the Microelectronics and Packaging Society
• /
• v.29 no.2
• /
• pp.99-105
• /
• 2022

As the chip size gets smaller, the width of the electrode line is also fine, and the density of interconnections is increasing. As a result, RC delay is becoming a problem due to the difference in resistance between the capacitor layer and the electrical conductivity layer. To solve this problem, the development of electrodes with high electrical conductivity and dielectric materials with low dielectric constant is required. In this study, we developed low dielectric ink by mixing commercial PSR which protect PCB's circuits from external factors and PI with excellent thermal property and low-k characteristics. As a result, the ink mixture of PSR and PI 10:3 showed the best results, with a dielectric constant of about 2.6 and 2.37 at 20 GHz and 28 GHz, respectively, and dielectric dissipation was measured at about 0.022 and 0.016. In order to verify the applicability of future applications, various line-width transmission lines produced on Teflon were evaluated, and as a result, the loss of transmission lines using low dielectric ink mixed with PI was 0.12 dB less on average in S21 than when only PSR was used.

• Proceedings of the KIEE Conference
• /
• 2011.07a
• /
• pp.1714-1715
• /
• 2011

In this work, highly conductive organic solvent-based polyaniline(PANI) was used as an anode in organic photovoltaic cells (OPV) based on poly - (3-hexylthiophene) and [6,6] - phenyl - C60 - butyricacid methyl ester (P3HT : PCBM). The transmittance of the used PANI film were 87.67% and 86.57% at 550nm, and its sheet resistance were 454 ${\Omega}/{\Box}$ and 298 ${\Omega}/{\Box}$. We fabricated ITO-free OPV cells using PANI as an anode, which exhibited an external power conversion efficiency of 2.28% with a result of Jsc of 6.922mA/cm2, Voc of 0.6093V, and FF of 54.10% under an illumination of air mass(AM) 1.5G (100mW/$cm^2$). We used ink-jet printing to deposit buffer layer and active layer on a glass substrate.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
• /
• v.25 no.1
• /
• pp.1-10
• /
• 2019

Environmental evaluation of two different oxygen high barrier films were performed using life cycle assessment. One of the films (traditional film) was composed of aluminum oxide coated PET film, ink, LDPE and LLDPE. Another film (new film) was consists of PET, ink, protein based coating material, LDPE, LLDPE. Main layer to achieve the high oxygen barrier for traditional film was aluminum oxide coated PET film, whereas the protein based coating material act as oxygen barrier layer for new film. Functional unit of this study was 1000 pouches made of traditional and new film. System boundary was factory to gate. The results of this study revealed that the new film shows better environmental performance for most of impact indicator than traditional film, except marine eutrophication and fine particulate matter formation due to extra coating process in new film system.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.30 no.3
• /
• pp.170-174
• /
• 2017

In 3 electrode reflective displays using a plastic substrate, unstable packaging induces particle clumping and optical degradation due to external air inflow and electronic ink evaporation. In this work, we fabricate 3 electrode electronic paper using glass wafer, ITO/plastic film, and ITO/glass/gas barrier film as an upper substrate after injecting electronic ink onto the lower substrate. Then, we studied its properties. After operating under stress conditions for 336 hours at $85^{\circ}C$ and 75% humidity, the reflectivity of driven e-paper panels with white color was 25.5% for the panels using glass wafer, 22.5% for plastic film including a gas barrier layer, and 16% for plastic film only. From these optical properties, we conclude that gas barrier film improves upper film isolation as a desirable packaging method.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2010.05a
• /
• pp.19.1-19.1
• /
• 2010

The process of manufacturing printed electronics using printing technology is attracting attention because its process cost is lower than that of the conventional semiconductor process. This technology, which offers both a lower cost and higher productivity, can be applied in the production of organic TFT (thin film transistor), solar cell, RFID(radio frequency identification) tag, printed battery, E-paper, touch screen panel, black matrix for LCD(liquid crystal display), flexible display, and so forth. In general, in order to implement printed electronics, narrow width and gap printing, registration of multi-layer printing by several printing units, and printing accuracy of under $20\;{\mu}m$ are all required. These electronic products require high precision to the degree of tens of microns - in a large area with flexible material, and mass productivity at low cost. As such, the roll-to-roll printing process is attracting attention as a mass production system for these printed electronic devices. For the commercialization of this process, two basic electronic ink technologies, such as conductive ink and polymers, and printing equipment have to be developed. Therefore, this paper addressed basis design and test to develop fine patterning equipment employing the roll-to-roll printing equipment and electronic ink.

• Journal of Korea Technical Association of The Pulp and Paper Industry
• /
• v.43 no.3
• /
• pp.30-34
• /
• 2011

This study was carried out in order to evaluate the effect of coated weight and calender pressure on conductivity of printed RFID tags. The printed RFID tags have been manufactured with gravure printing and it has been well known that the efficiency of printed RFID tags is influenced by surface properties of substrate. In this study, coated paper was prepared with four different coated weight and three different calender pressure. After printing conductivity ink on coated paper, surface resistance was measured to evaluate the efficiency of the printed RFID tag. It was found that, with increasing of coated weight and calender pressure, the paper gloss, smoothness, brightness and gravure printability were improved while the surface resistance of the printed RFID tag was decreased.

• ETRI Journal
• /
• v.35 no.4
• /
• pp.571-577
• /
• 2013

The fabrication of a thin-film transistor backplane and a liquid-crystal display using printing processes can eliminate the need for photolithography and offers the potential to reduce the manufacturing costs. In this study, we prepare contact via structures through a poly(methyl methacrylate) polymer insulator layer using inkjet printing. When droplets of silver ink composed of a polymer solvent are placed onto the polymer insulator and annealed at high temperatures, the silver ink penetrates the interior of the polymer and generates conducting paths between the top and bottom metal lines through the partial dissolution and swelling of the polymer. The electrical property of various contact via-hole interconnections is investigated using a semiconductor characterization system.