• 전기전자학회논문지
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• 제25권2호
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• pp.261-266
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• 2021

이 논문에서는 환경 온도 변화를 고려한 열 적외선 데이터 보정 알고리즘을 설계하는 방법을 제시한다. 첫째, 열 적외선 측정 모델은 적외선 측정 데이터와 모델 환경 매개 변수 간의 관계를 사용하여 매개 변수 종속적인 1차 입력-출력 방정식으로 주어지고, 적외선 데이터에 대한 환경 온도의 영향을 보상하기 위해 보상 함수를 구한다. 실험을 통해 제안된 알고리즘이 적외선 데이터에 대한 환경 온도 변화의 영향을 효과적으로 보상할 수 있음을 보인다.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2004년도 학술대회지
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• pp.872-875
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• 2004

In this paper, thermal response analysis of a temperature controlled three-axis accelerometer for high temperature environments with integrated micro-heaters and temperature sensors is investigated with finite element method (FEM) program, ANSYS and infrared thermal measurement systems. And availability to application fields from a viewpoint about short thermal response time is discussed. In this paper, the time of three-axis accelerometer for high temperatures becoming $300^{\circ}C$ by integrated micro-heaters and temperature sensors to reduce thermal drift characteristics was analyzed as a thermal response time of this device. The simulated thermal response time (time until SOI piezoresistors actually becomes $300^{\circ}C$) of three-axis accelerometer for high temperatures with ANSYS is about 0.6s, and measured result with infrared temperature measurement systems is about 0.64s. Experimental results using infrared thermal measurement systems agreed well with these theoretical results.

• 한국산업융합학회 논문집
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• 제27권1호
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• pp.57-62
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• 2024

This study conducted a measurement method of high temeprature conditions using infrared termography. All objects emit infrared light, and this emissivity has a significant impact on the temperature measurements of infrared thermal imaging (IR) cameras. In order to measure the temperature more accurately with the IR camera, correction equations were derived by measuring the emissivity according to the temperature change of combustible metals in a high-temperature environment. Two combustible metals, Mg and Al, were used to measure emissivity with changing temperature. Each metal was heated, the emissivity was measured by comparing the temperature with IR camera and thermocouples so that the correlation between temperature and emissivity could be anslyzed. As a result of the experiment, the emissivity of the metals increases as the temperature increased. This can be interpreted as a result of increased radiation emission as the thermal movement of internal metal molecules increased.

• 센서학회지
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• 제27권5호
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• pp.300-305
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• 2018

The uncooled microbolometer thermal sensor for low cost and mass volume was designed to target the new infrared market that includes smart device, automotive, energy management, and so on. The microbolometer sensor features 80x60 pixels low-resolution format and enables the use of wafer-level vacuum packaging (WLVP) technology. Read-out IC (ROIC) implements infrared signal detection and offset correction for fixed pattern noise (FPN) using an internal digital to analog convertor (DAC) value control function. A reliable WLVP thermal sensor was obtained with the design of lid wafer, the formation of Au80%wtSn20% eutectic solder, outgassing control and wafer to wafer bonding condition. The measurement of thermal conductance enables us to inspect the internal atmosphere condition of WLVP microbolometer sensor. The difference between the measurement value and design one is $3.6{\times}10-9$ [W/K] which indicates that thermal loss is mainly on account of floating legs. The mean time to failure (MTTF) of a WLVP thermal sensor is estimated to be about 10.2 years with a confidence level of 95 %. Reliability tests such as high temperature/low temperature, bump, vibration, etc. were also conducted. Devices were found to work properly after accelerated stress tests. A thermal camera with visible camera was developed. The thermal camera is available for non-contact temperature measurement providing an image that merged the thermal image and the visible image.

• 비파괴검사학회지
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• 제36권2호
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• pp.130-137
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• 2016

Non-destructive testing methods for composite materials (e.g., carbon fiber-reinforced and glass fiber-reinforced plastic) have been widely used to detect damage in the overall industry. This study detects defects using optical infrared thermography. The transient heat transport in a solid body is characterized by two dynamic quantities, namely, thermal diffusivity and thermal effusivity. The first quantity describes the speed with thermal energy diffuses through a material, whereas the second one represents a type of thermal inertia. The defect detection rate is increased by utilizing a lock-in method and performing a comparison of the defect detection rates. The comparison is conducted by dividing the irradiation method into reflection and transmission methods and the irradiation time into 50 mHz and 100 mHz. The experimental results show that detecting defects at 50 mHz is easy using the transmission method. This result implies that low-frequency thermal waves penetrate a material deeper than the high-frequency waves.

• 한국원자력학회:학술대회논문집
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• 한국원자력학회 1999년도 춘계학술발표회요약집
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• pp.107-107
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• 1999

Direct-contact condensation experiments of atmospheric steam and steam/air mixture on subcooled water flowing co-currently in a rectangular channel are carried out uszng an infrared thermal camera system to develop a temperature measurement method. The inframetrics Model 760 Infrared Thermal Imaging Radiometer is used for the measurement of the temperature field of the water film for various flow conditions. The local heat transfer coefficient is calculated using the bulk temperature gradient along the (low direction. It is also found that the temperature profiles can be used to understand the interfacial condensation heat transfer characteristics according to the flow conditions such as noncondensable gas effects, inclination effect, and flow rates.

• 한국터널지하공간학회 논문집
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• 제14권3호
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• pp.197-213
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• 2012

디스크커터는 암석의 절삭을 위해 TBM에 사용되는 핵심 굴착도구이다. 본 연구에서는 디스크커터에 의한 암석의 절삭 시에 커터 링에 발생하는 변형특성을 파악하기 위하여, 경암에 대한 선형절삭실험 시에 커터 링에 부착한 일련의 변형률게이지와 적외선 열화상 카메라에 의한 계측을 실시하였다. 실험결과, 커터 링은 매우 뚜렷한 선형탄성 거동을 보였으며, 암석 절삭에 의한 커터 링의 온도 상승은 $14.4^{\circ}C$ 이내로 나타났다. 따라서 본 연구에서 수행한 선형절삭실험 조건에서는 절삭으로 인한 커터 링의 변형과 온도상승이 크지 않았음을 알 수 있었다.

• Current Optics and Photonics
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• 제1권5호
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• pp.500-504
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• 2017

In this paper, we developed a temperature measurement system based on an infrared temperature imaging module for thermal safety verification of a plasma skin treatment device (PSTD). We tested a pilot product of the low-temperature PSTD using the system, and the temperature increase of each plasma torch was well-monitored in real-time. Additionally, through the approximation of the temperature increase of the plasma torches, a certain limitation of the plasma treatment time on skin was established with the International Electrotechnical Commission (IEC) guideline. We determined an appropriate plasma treatment time ($T_{Safe}$ < 24 minutes) using the configured temperature measurement system. We believe that the temperature measurement system has a potential to be employed for testing thermal safety and suitability of various medical devices and industrial instruments.

• Journal of Electrical Engineering and Technology
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• 제12권2호
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• pp.904-910
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• 2017

This paper presents temperature measurement of solar photovoltaic modules using the custom-made system composed of an infrared temperature sensor and a microcontroller. The obtained measurement results are processed, displayed and stored on a PC using the custom-made virtual instrument. The proposed system overcomes some of the problems related to the contact sensor application, and at the same time offers accurate readings and better flexibility. The proposed system is especially suitable for applications where the cost is a limiting factor in the choice of measuring system. The conducted analysis and the obtained results have shown an excellent accuracy of the proposed system in comparison to a high quality thermal imaging camera used as the reference instrument.

• 비파괴검사학회지
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• 제34권4호
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• pp.299-304
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• 2014

본 연구에서는 적외선 열화상 카메라와 열원 사이에 유리를 설치하여 측정기기의 보호 및 온도 보정을 통하여 고온의 용접부 온도를 실시간으로 측정하고자 하였다. 먼저 할로겐램프의 열에 대한 온도 차이를 실시간으로 촬영하고 온도를 측정한 결과, 카메라와 열원 사이의 거리별 온도는 거의 동일하게 측정되었음을 확인할 수 있었고, 유리 두께와 측정 거리의 상관관계를 통하여 온도 범위를 예측할 수 있다는 것을 알 수 있었다. 이를 바탕으로 용접열원에 대한 실험을 수행하여 열화상 카메라를 이용한 용접부의 온도 측정의 타당성을 제시하였다.