• 한국정밀공학회지
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• 제10권2호
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• pp.66-75
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• 1993

This paper proposes a monitoring method for nondestructive and in-process measurement of the case depth in LASER surface heat treatment process. The method is essentially an eddy-current method, and measures sensing coil's electrical impedance which varies with the changes of the material microstructure due to hardening. To investigate te validity of the proposed method a series of experiments were performed for various hardning depths. The results show that the relationship between the eddy- current sensor output and the changes in case depth is almost linear. This indicates that the eddy-current measuring method can be used as one of the possible monitoring method for mesauring the hardened depth in LASER heat treatment processes.

• 품질경영학회지
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• 제34권2호
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• pp.12-21
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• 2006

This paper considers the problem of selecting the most profitable process mean for production processes where measurement errors exist in inspection systems. For such situations, a sequential inspection procedure is proposed to reduce measurement errors. The decision to accept, reject, or take an additional inspection of an item is made at every measurement point until the number of repeated measurements reaches its upper bound. An expected profit model is constructed and the optimal process mean, the cut-off values, and the upper bound of the number of repeated measurements are obtained when accepted(rejected) items are sold at regular(reduced) price. A numerical study is performed to investigate the performance of the proposed procedure.

• 자원환경지질
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• 제37권1호
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• pp.49-59
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• 2004

The concectration and distribution of contaminants obtained from a contaminated land investigation or an environmental geochemistry survey constitutes the basis of a decision-making process on environmental policies or of scientific researches. As the quality of data determines the reliability of the result, the investigation plan should be adjusted according to the purpose of the investigation. In general, the effort to improve the data quality had been focused mainly on the QA/QC procedures in laboratories. The rapid progress of analytical instrument has also contributed toward improving the analytical precision to a sacrificable degree. Nevertheless, in many cases, it is not the analytical precision that needs improvement for the better precision of overall measurement process: it is rather during the sampling process in the field that is responsible for the poor precision. To assess the data quality on a measured value, ISO recommends to provide information on "measurement uncertainty" along with the measured value. The measurement uncertainty in an environmental measurement context can be explained as the statistical number that expresses the degree of the uncertainty stemming from the sampling and analytical procedures. There is a cost involved in order to improve the precision of sampling and analytical methods so as to decrease the degree of measurement uncertainty. The economical point of compromise in an investigation planning can be achieved when the allowable degree of uncertainty has been set before-hand. The investigation can then be planned accordingly not to exceed the uncertainty limit. Furthermore, if the measurement uncertainty estimated from the preliminary investigation can be separated into sampling and analytical uncertainties, it can be used as a criterion where the resources for the investigation should be allotted cost-effectively to reinforce the weakest link of the whole investigation process. This paper aims to present a method of estimating the level of measurement uncertainty of a measured contamination concentration at a site used as an example and to show how the estimated uncertainty can be applied to serve the particular purpose of an investigation.

• 한국기계가공학회지
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• 제6권2호
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• pp.22-27
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• 2007

In this study, the two methods of stiffness measurement(Spring constant) of cantilever were proposed for quantitative measurement in Atomic Force Microscopy(AFM). As the 1st method for the measurement of stiffness, the probe method, which is used in the measurement of the semiconductor mechanical and electrical properties, was applied to the measurement of the cantilever. Experiments by the probe method were performed finding the resistance value of cantilever. As the results, the resistance was measured differently along with the dimension and the thickness of cantilever that determined the stiffness(spring constant) of the lever. As the 2nd method, the vibration characteristics(Dunkerley expression) is used to obtain the stiffness of the complex structure which is combined by AFM cantilever and the standard cantilever. We measured the resonant frequency from the complex structure using the micro stages and stereo microscope. As the results, we confirmed that the vibration characteristics(Dunkerley expression) is effected the micro complex structure of AFM cantilever.

• 전기학회논문지
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• 제66권2호
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• pp.468-473
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• 2017

This paper presents an in-process measurement system for shaft radius measurement during grinding process. This system does not require to stop the grinding process, which can enhance productivity and quality. In order to measure the radius, the system employs an eddy current sensor that can measure without any contact with the shaft. This type of sensor is very appropriate because it is insensitive to interference such as cutting fluid, coolant, contact pressure, and wear. For data analysis, the measurement system is modeled as a linearized discrete form where the states with noise are estimated by an extended Kalman filter. This system has been validated through simulations and experiments.

• 제어로봇시스템학회논문지
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• 제9권3호
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• pp.227-235
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• 2003

We propose an algorithm for the automatic measurement of concentricity and roundness using image processing technique. The proposed measuring method consists of the preprocessing process and the measuring process. In the measuring process, two types of concentricity measurement algorithm and one type of roundness measurement algorithm are proposed. We could measure the concentricity and roundness using input image from CCD camera, without using special measurement equipment. From the experimental results, we could find that the required measurement accuracy specification is sufficiently satisfied using our proposed method.

• Design & Manufacturing
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• 제15권1호
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• pp.14-20
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• 2021

The objective of this study is to introduce the new possibility of sensing technology based on inductive displacement sensors to monitor the status of wheel position in the hot forging process. In order to validate effectiveness of proposed sensing technology, the indirect forging force measurement with displacement sensor was applied into a typical closed hot forging die-set used for the manufacturing of flange bolts. The locations to implement the displacement sensor were selected carefully by simulating forming process and static structural. From the measurement results of the forging force change during one hot forging cycle, it was found that the proposed monitoring system can provide useful information to understand the detailed behaviors of die-set in the closed hot forging process.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집 Vol.14 No.1
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• pp.176-180
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• 2001

There are several factors causing re-work in CMP process such as improper polish time calculation by operator. removal rate decline of the polisher, unstable in-suit pad conditioning, slurry supply module problem and wafer carrier rotation inconsistancy. And conclusively those fundimental reason for the re-work rate increasement is mainly from the cycle time delay between wafer polish and post measurement. Therefore, Wafer thickness measurement in wet condition could be able to remove those improper process conditions which may happen during the process in comparison with the conventional dried wafer measurement system and it can be able to reduce the CMP process cycle time. CMP scrap reduction by overpolish, re-work rate reduction, thickness control efficiency also can be easily achieved. CMP Equipment manufacturer also trying to develop integrated system which has multi-head & platen, cleaner, pre & post thickness measure and even control the polish time from the calculated removal rate of each polishing head by software. CMP re-work problem such as over & under polish by target thickness may result in the cycle time delay. By reducing those inefficient factors during the process and establish of the automatic process control, CLC system need to be adopted to maximize the process performance. Wafer to Wafer Polish Time Feed Back Control by measuring the wafer right after the polish shorten the polish time calculation for the next wafer and it lead to the perfact Post CMP target thickness control capability. By Monitoring all of the processed the wafer, CMP process will also be stabilize itself.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집
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• pp.176-180
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• 2001

There are several factors causing re-work in CMP process such as improper polish time calculation by operator, removal rate decline of the polisher, unstable in-suit pad conditioning, slurry supply module problem and wafer carrier rotation inconsistency. And conclusively those fundimental reason for the re-work rate increasement is mainly from the cycle time delay between wafer polish and post measurement. Therefore, Wafer thickness measurement in wet condition could be able to remove those improper process conditions which may happen during the process in comparison with the conventional dried wafer measurement system and it can be able to reduce the CMP process cycle time. CMP scrap reduction by overpolish, re-work rate reduction, thickness control efficiency also can be easily achieved. CMP Equipment manufacturer also trying to develop integrated system which has multi-head & platen, cleaner, pre & post thickness measure and even control the polish time from the calculated removal rate of each polishing head by software. CMP re-work problem such as over & under polish by target thickness may result in the cycle time delay. By reducing those inefficient factors during the process and establish of the automatic process control, CLC system need to be adopted to maximize the process performance. Wafer to Wafer Polish Time Feed Back Control by measuring the wafer right after the polish shorten the polish time calculation for the next wafer and it lead to the perfect Post CMP target thickness control capability. By Monitoring all of the processed the wafer, CMP process will also be stabilize itself.

• 산업공학
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• 제25권2호
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• pp.196-203
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• 2012

In the postal delivery service, both the standardization of business process and the workload measurement is very important part of saving the cost and improving the efficiency. However, these are not easy to apply to real situation because of the labor-intensive and diversification of delivery environment. In this study, we develop the methodology for the standardization of business process and workload measurement model of the postal delivery service. Firstly, we introduce the work factor analysis on the postal delivery process. Then, we propose the methodology workload measurement model based on diversification of delivery environment.