• Proceedings of the KWS Conference
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• 2010.05a
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• pp.81-81
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• 2010

전자 패키징은 미세화, 경량화, 저가화를 지향하고 신뢰성의 향상을 위해 발전해 왔다. 이러한 경향은 전자부품 자체의 성능 향상 뿐 아니라 전자부품을 장착, 고정할 수 있게 하는 인쇄회로 기판(PCB : Printed Circuit Board)의 성능에 많은 관심을 가지게 되었다. 전기적 신호의 손실을 줄이기 위해 전기, 전자 산업체에서는 가볍고 굴곡성이 우수한 연성인쇄회로기판(FPCB : Flexible PCB)과 가격이 싸고 신뢰성이 입증된 경성인쇄회로기판(RPCB : Rigid PCB)이 그 대상이다. 본 논문에서는 이 PCB중에서도 RPCB와 FPCB간의 열압착 방식으로 접합 시 전극간의 접합 양상을 보았다. 이 열압착 방식은 기존에 PCB를 접합하는데 사용하고 있는 connector를 이용한 체결법을 대체하는 기술로써 솔더를 중간층(interlayer)로 이용하여 열과 압력으로 접합하는 방식이다. 이 방식을 connector를 사용하는 방식에 비해 그 부피가 작고 I/O개수에 크게 영향 받지 않으며 자동화 공정이 쉬운 장점을 가지고 있다. 접합의 대상 중 RPCB의 경우는 무전해 니켈 금도금(ENIG : Electroless Nickle Immersion Gold)로 제작하였으며 FPCB의 경우는 ENIG와 유기보호피막(OSP : Organic solderability preservation) 처리하였다. 실험에 사용한 PCB는 $300\;{\mu}m$ pitch의 미세피치이며 솔더의 조성은 Sn-3.0Ag-0.5Cu (in wt%)과 Sn-3.0Ag (in wt%)를 사용하였다. 접합 온도와 접합 시간 그리고 접합 압력에 따라 최적의 접합 조건을 도출하였다. 접합 강도는 $90^{\circ}$ Peel Test를 통해서 측정하였으며 접합면 및 파괴면은 SEM과 EDS를 통하여 분석하였다.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.3
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• pp.51-56
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• 2014

The reliability of solder joint is significantly affected by the property of surface finish. This paper reports on a study of high speed shear energy and failure mode for Sn-4.0wt%Ag-0.5wt%Cu (SAC405) solder joints with the time of Pd activation. The nodule size of electroless Ni-P deposit increased with increasing the time of Pd activation. The roughness (Ra) of electroless Ni-P deposit decreased with increasing the time of Pd activation. Then, with $HNO_3$ vapor, the quasi-brittle and brittle mode of SAC405 solder joint decreased with increasing the time of Pd activation. This results indicate that the increase in the Pd activation time for Electroless Ni/ Electroless Pd/ Immersion Au (ENEPIG) surface finish play a critical role for improving the robustness of SAC405 solder joint.

• Korean Journal Plant Pathology
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• v.10 no.2
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• pp.112-118
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• 1994

Forth microbial isolates out of 167 isolates from the soil of controlled cultivation areas inhibited mycelial growth of Rhizoctonia solani AG2-1 causing the strawberry bud rot in vitro. Among the isolates, Kr013 and Kr020 showed suppressive effect to R. solani AG2-1 on seedlings of chinese cabbage treated by root immersion, charcoal carrier granule and drenching on 1.0% infested soil in pot. Furthemore, the corresponding effect was also revealed when the charcoal carrier granule of the isolates were treated on the seedling of strawberry that were planted on the planting hole in pot. To examine the effects of biological control in green house, it had been tested the infection rates by using two different treatments. First, the strawberry runner were planted on the nursery soil mixed with 20% charcoal carrier granule of Kr013 and Kr020 isolate respectively, and grown for 20 days before transplanting. Then the young plants form the mother plant were separated and transplanted on the 1.0% infested soil. Another method was that the charcoal carrier of Kr013 and Kr020 isolates applied to planting hole of 1.0% infested soil just before transplanting. Then the young plants were grown for 20 days on the sterilized nursery soil before transplanting. From the results, the effects of biological control was significantly higher on former treatment (e.g. the infection rates were 7.3 and 5.7%, respectively) than on the latter treatment (e.g. the corresponding value were 16.7 and 15.7%, respectively). The antagonistic isolates of Kr013 and Kr020 were respectively identified as Pseudomonas cepacia with the similarity of 55.0% and 60.0% by using the Biolog GN Microplate system.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.24-24
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• 2009

ENIG(Electroless Nickel Immersion Gold) is the surface treatment method that is used most widely at fine pitch's SMT and BGA packaging process. In this paper, we have studied the effect of P content variation during ENIG process on those phenomena related to the solder joint. The effect of P content was discussed using the results obtained from FE-SEM, EPMA, EDS and FIB. Finally, it was concluded that the more P-content in Ni layer, the thicker P-rich layer.

• Restorative Dentistry and Endodontics
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• v.14 no.1
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• pp.199-204
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• 1989

The purpose of this study was to observe the anodic polarization curve from 4 kinds of low copper amalgam (Fine cut alloy, Spheralloy, Aristalloy and Amalcap) and 4 kinds of high copper amalgam (Dispersalloy, Sybraloy Orosphere and Tytin) obtained by using the potentiostat. The specimen made as the direction of manufacturer was stored at room temperature for about 7 days. The standard surface preparation was routinely carried out. The 0.9% saline solution was used as electrolyte in pH 6.8-7.0 at $37^{\circ}C$. The open circuit potential was determined after 30 minutes' immersion of specimen. The scan rate was 1mV/sec and the surface area of amalgam exposed to the solution was 0.785$cm^2$ for each specimen. All potentials reported are with respect to Ag/AgCl eelctrode. The following results were obtained. 1. The corrosion potential of high copper amalgams was higher than one of low copper amalgams, and the current density of high copper amalgam was lower than one of low copper amalgams. 2. The low copper amalgams had the similar pattern of polarization curve, but the high copper amalgams had the different pattern one another. 3. The polarization curve of Orosphere amalgam which is the admixed type was similar to one of low copper amalgam.

• Corrosion Science and Technology
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• v.7 no.3
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• pp.152-157
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• 2008

New wrought magnesium alloys have increasingly been developed in recent years for the automotive industry due to their high potential as structural materials for low density and high strength/weight ratio demands. However, their poor mechanical properties and low corrosion resistance have led to a search for new kinds of magnesium alloys with better strength, ductility, and high corrosion resistance. The main objective of this research is to investigate the corrosion behaviour of new magnesium alloys: Mg-Zn-Ag (ZQ), Mg-Zn-Mn-Si (ZSM) and Mg-Zn-Mn-Si-Ca (ZSMX). These ZQ6X, ZSM6X1, and ZSM651+YCa alloys were prepared using hot extrusion. AC, DC polarization and immersion tests were carried out on the extruded rods. Microstructure was examined using optical and electron microscopy (SEM) and EDS. The addition of silver decreased the corrosion resistance. The additions of silicon and calcium also affected the corrosion behaviour. These results can be explained by the effects of alloying elements on the microstructure of Mg-Zn alloys such as grain size and precipitates caused by the change in precipitation and recrystallisation behaviour.

• The Journal of Korean Physical Therapy
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• v.2 no.1
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• pp.47-63
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• 1990

The purpose of this study was to determined the effect of low-frequency electrical stimulation on the denervated gastrocnemius muscles of the albino rats, Sprague-Dawley. Fifteen Sprague-Dawley adult male albino rats were divided into non-treated (normal) group, denervated (control) group, denervated and electrical stimulated (experiments). The gastrocnemius muscles of the right leg were submaximally stimulated with 30 Hz electrical stimulation. After 4-week period, the animals were sacrificed, and muscle were removed, fixed by immersion, and processed for light and electron microscopy. The numbers of Ag-NOR increased significantly (p<0.001), but significant reductions of girth(p<0.01), wet muscle weight (p<0.001), high glycogen content fiber (p<0.01), and mitochondrial number (p<0.05) were found in denervated control group. In comparison with control group, significant increase of right leg girth (p<0.05), wet muscle weight (p<0.001), high glycogen content fiber (p<0.05), numbers of Ag-NOR(p<0.001), number of mitochondria (p<0.01), mitochondrial volume found in electrical stimulated experimental group. The results suggest that the electrical stimulation of the muscle partially prevented the denervated atrophy in the rat gastrocnemius muscles.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.151-151
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• 2012

A new plasma process, i.e., the combination of PIII&D and HIPIMS, was developed to implant non-gaseous ions into materials surface. HIPIMS is a special mode of operation of pulsed-DC magnetron sputtering, in which high pulsed DC power exceeding ~1 kW/$cm^2$ of its peak power density is applied to the magnetron sputtering target while the average power density remains manageable to the cooling capacity of the equipment by using a very small duty ratio of operation. Due to the high peak power density applied to the sputtering target, a large fraction of sputtered atoms is ionized. If the negative high voltage pulse applied to the sample stage in PIII&D system is synchronized with the pulsed plasma of sputtered target material by HIPIMS operation, the implantation of non-gaseous ions can be successfully accomplished. The new process has great advantage that thin film deposition and non-gaseous ion implantation along with in-situ film modification can be achieved in a single plasma chamber. Even broader application areas of PIII&D technology are believed to be envisaged by this newly developed process. In one application of non-gaseous plasma immersion ion implantation, Ge ions were implanted into SiO2 thin film at 60 keV to form Ge quantum dots embedded in SiO2 dielectric material. The crystalline Ge quantum dots were shown to be 5~10 nm in size and well dispersed in SiO2 matrix. In another application, Ag ions were implanted into SS-304 substrate to endow the anti-microbial property of the surface. Yet another bio-application was Mg ion implantation into Ti to improve its osteointegration property for bone implants. Catalyst is another promising application field of nongaseous plasma immersion ion implantation because ion implantation results in atomically dispersed catalytic agents with high surface to volume ratio. Pt ions were implanted into the surface of Al2O3 catalytic supporter and its H2 generation property was measured for DME reforming catalyst. In this talk, a newly developed, non-gaseous plasma immersion ion implantation technique and its applications would be shown and discussed.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.85-91
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• 2002

Even though electroless Hi and Sn-Ag-Cu solder are widely used materials in electronic packaging applications, interfacial reactions of the ternary Ni-Cu~Sn system have not been known well because of their complexity. Because the growth of intermetallics at the interface affects reliability of solder joint, the intermetallics in Ni-Cu-Sn system should be identified, and their growth should be investigated. Therefore, in present study, interfacial reactions between electroless Ni UB7f and 95.5Sn-4.0Ag-0.5Cu alloy were investigated focusing on morphology of the IMCs, thermodynamics, and growth kinetics. The IMCs that appear during a reflow and an aging are different each other. In early stage of a reflow, ternary IMC whose composition is Ni$_{22}$Cu$_{29}$Sn$_{49}$ forms firstly. Due to the lack of Cu diffusion, Ni$_{34}$Cu$_{6}$Sn$_{60}$ phase begins growing in a further reflow. Finally, the Ni$_{22}$Cu$_{29}$Sn$_{49}$ IMC grows abnormally and spalls into the molten solder. The transition of the IMCs from Ni$_{22}$Cu$_{29}$Sn$_{49}$ to Ni$_{34}$Cu$_{6}$Sn$_{60}$ was observed at a specific temperature. From the measurement of activation energy of each IMC, growth kinetics was discussed. In contrast to the reflow, three kinds of IMCs (Ni$_{22}$Cu$_{29}$Sn$_{49}$, Ni$_{20}$Cu$_{28}$Au$_{5}$, and Ni$_{34}$Cu$_{6}$Sn$_{60}$) were observed in order during an aging. All of the IMCs were well attached on UBM. Au in the quaternary IMC, which originates from immersion Au plating, prevents abnormal growth and separation of the IMC. Growth of each IMC is very dependent to the aging temperature because of its high activation energy. Besides the IMCs at the interface, plate-like Ag3Sn IMC grows as solder bump size inside solder bump. The abnormally grown Ni$_{22}$Cu$_{29}$Sn$_{49}$ and Ag$_3$Sn IMCs can be origins of brittle failure.failure.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.82-82
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• 2010

표면실장 공법을 통해 CSP 패키지를 보드에 실장 하는데 있어 무연솔더 접합부의 신뢰성에 영향을 미치는 인자 중 가장 중요한 것은 접합부에 형성되는 IMC (Intermetallic compound, 금속간화합물)인 것으로 알려져 있다. 접합부의 칩 부분에는 솔더와 칩의 UBM (Under bump metalization)이 접합하여 IMC가 형성되나, 보드 부분에는 솔더와 보드의 UBM 뿐만 아니라 그 사이에 솔더 페이스트가 함께 접합되어 IMC가 형성된다. 본 연구에서는 패키지의 신뢰성 연구를 위해 솔더 페이스트의 유무 및 두께에 따른 무연 솔더 접합부의 미세조직의 변화를 분석하였다. 본 실험에서는 Sn-3.0(Wt.%)Ag-0.5Cu 조성과 본 연구진에 의해 개발된 Sn-Ag-Cu-In 조성의 직경 $450{\mu}m$ 솔더 볼을 사용하였으며, 솔더 페이스트는 상용 Sn-3.0Ag-0.5Cu (ALPHA OM-325)를 사용하였다. 칩은 ENIG (Electroless nickel immersion gold) finish pad가 형성된 CSP (Chip scale package)를, 보드는 OSP (Organic solderability preservative)/Cu finish pad가 형성된 것을 사용하였다. 실험 방법은 보드를 솔더 페이스트 없이 플라즈마 처리 한 것, 솔더 페이스트를 $30{\mu}m$ 두께로 인쇄한 것, $120{\mu}m$의 두께로 인쇄한 것, 이렇게 3가지 조건으로 준비한 후, 솔더 볼이 bumping된 칩을 mounting하여, $242^{\circ}C$의 peak 온도 조건의 oven(1809UL, Heller)에서 reflow를 실시하여 패키지를 형성하였다. 이후 시편은 정밀 연마한 후, OM(Optical Microscopic)과 SEM(scanning electron microscope) 및 EDS(energy dispersive spectroscope)를 사용하여 솔더 접합부 IMC의 미세조직을 관찰, 분석하였다.