• Journal of the Korean Society for Industrial and Applied Mathematics
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• v.11 no.1
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• pp.95-105
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• 2007

A mathematical modeling for the drying process of hygroscopic porous media, such as wood, has been developed in the past decades. The governing equations for wood drying consist of three conservation equations with respect to the three state variables, moisture content, temperature and air density. They are involving simultaneous, highly coupled heat and mass transfer phenomena. In recent, the equations were extended to account for material heterogeneity through the density of the wood and via the density variation of the material process, capillary pressure, absolute permeability, bound water diffusivity and effective thermal conductivity. In this paper, we investigate the drying behavior for the three primary variables of the drying process in terms of control volume finite element method to the heterogeneous transport model on one-dimensional grid.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.37-42
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• 2022

Recently, the semiconductor package structures are becoming thinner and more complex. As the thickness decrease, interfacial delamination due to material mismatch can be further maximized, so the reliability of interface is a critical issue in industry field. Especially, the polymers, which are widely used in semiconductor packaging, are significantly affected by the temperature and moisture. Therefore, in this study, the delamination prediction at the interface of package structure was performed through finite element analysis considering the moisture absorption and desorption under the various temperature conditions. The material properties such as diffusivity and saturated moisture content were obtained from moisture absorption test. The hygro-swelling coefficients of each material were analyzed through TMA and TGA after the moisture absorption. The micro-shear test was conducted to evaluate the adhesion strength of each interface at various temperatures considering the moisture effect. The finite element analysis of interfacial delamination was performed that considers both deformation due to temperature and moisture absorption. Consequently, the interfacial delamination was successfully predicted in consideration of the in-situ moisture desorption and temperature behavior during the reflow process.