• Transactions of the Korean Society of Mechanical Engineers A
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• v.37 no.5
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• pp.619-624
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• 2013

A bendable electronic module is developed. In this module, thin silicon electronic chips are embedded in a polymer-based encapsulating adhesive between flexible copper-clad polyimide layers. During the qualification test of a harshly thermal-hygroscopic complex loading condition, delaminations occur inside the module layers. A finite element model is developed for the module. To investigate the effect of hygroscopic stress on delamination, the results of the thermal and thermal-hygroscopic loads are compared. The analysis results reveal that the hygroscopic effect more strongly affects delamination than does the thermal effect. The potential failure mechanisms of the module are investigated based on the stress analysis.

• Structural Engineering and Mechanics
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• v.65 no.3
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• pp.275-290
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• 2018

The hygrothermal stresses in sandwich plate with composite faces due to through the thickness gradient temperature and (or) moisture content are investigated. The layer-wise theory is employed for formulation of the problem. The formulation is derived for sandwich plate with general layer stacking, subjected to uniform and non-uniform temperature and moisture content through the thickness of the plate. The governing equations are solved for free edge conditions and 3D stresses are investigated. The out of plane stresses are obtained by equilibrium equations of elasticity and by the constitutive law and the results for especial case are compared with the predictions of a 3D finite element solution in order to study the accuracy of results. The three-dimensional stresses especially the free edge effect on the distribution of the stresses is studied in various sandwich plates and the effect of uniform and non-uniform thermal and hygroscopic loading is investigated.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.2
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• pp.11-15
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• 2011

Heat transfer equation is first reviewed and then governing equation of moisture diffusion. Analogy scheme is applied to analysis the moisture absorption problem of polymers. It make possible to numerically analyze the diffusion problem for single medium by using commercial finite element code if it is under the isothermal loading condition. It is extended to special multimaterial system by introducing pressure ratio function, whose moisture characteristics of materials are proportional to temperature only. The weight changes of silicon-nonconductive-polymer joint model due to moisture absorption is measured and been very close to the numerical results as for single media with boundary condition with zero concentration, but yields numerical errors as for multisystem media.

• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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• v.20 no.3
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• pp.259-268
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• 2022

Molten salt consisting primarily of eutectic LiCl-KCl is currently being used in electrorefiners in the Fuel Conditioning Facility at Idaho National Laboratory. Options are currently being evaluated for storing this salt outside of the argon atmosphere hot cell. The hygroscopic nature of eutectic LiCl-KCl makes is susceptible to deliquescence in air followed by extreme corrosion of metallic cannisters. In this study, the effect of occluding the salt into a zeolite on water sorption/desorption was tested. Two zeolites were investigated: Na-Y and zeolite 4A. Na-Y was ineffective at occluding a high percentage of the salt at either 10 or 20wt% loading. Zeolite-4A was effective at occluding the salt with high efficiency at both loading levels. Weight gain in salt occluded zeolite-4A (SOZ) from water sorption at 20% relative humidity and 40℃ was 17wt% for 10% SOZ and 10wt% for 20% SOZ. In both cases, neither deliquescence nor corrosion occurred over a period of 31 days. After hydration, most of the water could be driven off by heating the hydrated salt occluded zeolite to 530℃. However, some HCl forms during dehydration due to salt hydrolysis. Over a wide range of temperatures (320-700℃) and ramp rates (5, 10, and 20℃ min^-1), HCl formation was no more than 0.6% of the Cl^- in the original salt.