• Smart Structures and Systems
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• v.9 no.6
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• pp.505-534
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• 2012

The present work deals with second order statistics of post buckling response of piezoelectric laminated composite cylindrical shell panel subjected to hygro-thermo-electro-mechanical loading with random system properties. System parameters such as the material properties, thermal expansion coefficients and lamina plate thickness are assumed to be independent of the temperature and electric field and modeled as random variables. The piezoelectric material is used in the forms of layers surface bonded on the layers of laminated composite shell panel. The mathematical formulation is based on higher order shear deformation shell theory (HSDT) with von-Karman nonlinear kinematics. A efficient $C^0$ nonlinear finite element method based on direct iterative procedure in conjunction with a first order perturbation approach (FOPT) is developed for the implementation of the proposed problems in random environment and is employed to evaluate the second order statistics (mean and variance) of the post buckling load of piezoelectric laminated cylindrical shell panel. Typical numerical results are presented to examine the effect of various environmental conditions, amplitude ratios, electrical voltages, panel side to thickness ratios, aspect ratios, boundary conditions, curvature to side ratios, lamination schemes and types of loadings with random system properties. It is observed that the piezoelectric effect has a significant influence on the stochastic post buckling response of composite shell panel under various loading conditions and some new results are presented to demonstrate the applications of present work. The results obtained using the present solution approach is validated with those results available in the literature and also with independent Monte Carlo Simulation (MCS).

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.37-42
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• 2022

Recently, the semiconductor package structures are becoming thinner and more complex. As the thickness decrease, interfacial delamination due to material mismatch can be further maximized, so the reliability of interface is a critical issue in industry field. Especially, the polymers, which are widely used in semiconductor packaging, are significantly affected by the temperature and moisture. Therefore, in this study, the delamination prediction at the interface of package structure was performed through finite element analysis considering the moisture absorption and desorption under the various temperature conditions. The material properties such as diffusivity and saturated moisture content were obtained from moisture absorption test. The hygro-swelling coefficients of each material were analyzed through TMA and TGA after the moisture absorption. The micro-shear test was conducted to evaluate the adhesion strength of each interface at various temperatures considering the moisture effect. The finite element analysis of interfacial delamination was performed that considers both deformation due to temperature and moisture absorption. Consequently, the interfacial delamination was successfully predicted in consideration of the in-situ moisture desorption and temperature behavior during the reflow process.