Kim, Seongtak;Park, Sungeun;Kim, Young Do;Kim, Hyunho;Bae, Soohyun;Park, Hyomin;Lee, Hae-Seok;Kim, Donghwan
Proceedings of the Korean Vacuum Society Conference
/
2014.02a
/
pp.490.2-490.2
/
2014
Since the general solar cells accept sun light at the front side, excluding the electrode area, electrons move from the emitter to the front electrode and start to collect at the grid edge. Thus the edge of gridline can be important for electrical properties of screen-printed silicon solar cells. In this study, the improvement of electrical properties in screen-printed crystalline silicon solar cells by contact treatment of grid edge was investigated. The samples with $60{\Omega}/{\square}$ and $70{\Omega}/{\square}$ emitter were prepared. After front side of samples was deposited by SiNx commercial Ag paste and Al paste were printed at front side and rear side respectively. Each sample was co-fired between $670^{\circ}C$ and $780^{\circ}C$ in the rapid thermal processing (RTP). After the firing process, the cells were dipped in 2.5% hydrofluoric acid (HF) at room temperature for various times under 60 seconds and then rinsed in deionized water. (This is called "contact treatment") After dipping in HF for a certain period, the samples from each firing condition were compared by measurement. Cell performances were measured by Suns-Voc, solar simulator, the transfer length method and a field emission scanning electron microscope. According to HF treatment, once the thin glass layer at the grid edge was etched, the current transport was changed from tunneling via Ag colloids in the glass layer to direct transport via Ag colloids between the Ag bulk and the emitter. Thus, the transfer length as well as the specific contact resistance decreased. For more details a model of the current path was proposed to explain the effect of HF treatment at the edge of the Ag grid. It is expected that HF treatment may help to improve the contact of high sheet-resistance emitter as well as the contact of a high specific contact resistance.
This study was undertaken to clarify the microstructure of the different IPS Empress ingots by etching and to observe the change of leucite crystal structure according to subsequent heat treatment and the crystal distribution according to sprue types(${\phi}2.8mm$, single sprue; ${\phi}1.8mm$, double sprue) by scanning electron microscopy. IPS Empress T1, O1 ingots used for staining technique, and Dentin(A2) ingots used for layering technique were selected for this study. To observe the microstructures of these ingots before pressing, the specimens were prepared in splinters($3{\times}3{\times}3mm$) taken from the original ingots. And to estimate crystal distribution and microstructural change by sprue type and subsequent heat treatment. the specimens($3{\times}3{\times}3mm$) were heat-pressed through the two types of sprues with different diameters and numbers, and all specimens were fired according to the recommended firing schedule. The observed surface was ground with waterproof papers($#800{\sim}#1800$) on the grind polisher and was cleaned ultrasonically. All specimen were etched with 0.5% hydrofluoric acid. After etching, the surface was treated by ion sputter coating for SEM observation at an accelerating voltage of 20kV. In all specimens, the central area of ground surface was observed because there was less difference in microstructure between the peripheral area and the central area. The results were as follows ; 1. In the microstructure according to the ingot type, there was a wide difference between the staining (T1,O1) and layering(Dentin A2) ingots, but there was not a considerable difference between the T1 ingot and the O1 ingot for staining technique. 2. In all specimens, the crystal dispersion of IPS Empress ceramic using double sprue was significantly more scattered than that of IPS Empress ceramic using single sprue. The degree of scattering was strongest in the Dentin(A2) specimen and weakest in the O1 ingot. 3. In the microstructural change according to the subsequent heat treatment, all of ingots had some microcracks in the inside of the leucite crystal and the glass matrix after pressing. The inner splinters of the leucite crystal became smaller, and more microcracks occurred in the glass matrix due to increasing heat treatment times. 4. The size of leucite crystals varied from $1{\mu}m\;to\;5{\mu}m$. The mean size of mature crystals was about $5{\mu}m$. The form of the crystal was similar to a circle when it was smaller and similar to an ellipse when it was larger.
The purpose of this study was to evaluate the fracture strength of porcelain laminate veneer with various lingual extention length when incisal restoring. Sixty recently extracted, intact maxillary incisors were used and stored in a physiologic saline solution from the time of extraction. Seating form was preparation at the labial surface of each tooth with a water-cooled round diamond bur. Standard block was formed with 32 gauge and 24 gauge wax at tooth labial and lingual surface. Lingual extention length differed according to each group. (group I : 0.5mm, group II : 1 mm, group III : 2mm, group IV : 0mm) All tooth specimens were impressioned with examix(GC Inc., Japan). Refractory cast were maked with refractory die material(Ceramco Inc., U.S.A.) Laminate porcelain (Ceramco II Veneer porcelain, Ceramco Inc., U.S.A.) was condensed in refractory die cast and baked according to the manufacturer's recommendations. Each surface was contoured with low speed diamond bur according to guide block. All porcelain specimens were sandblasted and ultrasonically cleaned in distlled water for 3 minutes. Then, all porcelain specimen were etched with 8% hydrofluoric acid for 5 minutes. Sixty specimens were bonded with composite resin cement(Choice Porcelain Veneer System, Bisco Inc., U.S.A.) according to manufacture's directions. The fracture loads of the specimen were measured by Instron universal testing machine. The mean values of fracture loads for the groups were statistically compared by Duncan's multiful range test. The result were as follows : Mean fracture strengths of each group were 86.95Mpa in no lingual extention group, 44.98Mpa in 0.5mm lingual extention group, 27.47Mpa in 1mm lingual extention group, 19.61Mpa in 2mm lingual extention group. There was a statistically significant difference between all group(p<0.01).
This study evaluated the shear bond properties of IPS Empress glass ceramic to enamel and dentin surfaces with three ceramic surface treatments, and three resin cements. The influence of thermocycling was also investigated. The purpose of this study was to investigate the influences of resin cements, ceramic surface treatments, and thermocycling on shear bond properties. Ninety freshly extracted, noncarious human molars were selected for this study. The surface treatments of ceramic were etching <5.0% hydrofluoric acid, application of silane coupling agents(Tokuso Ceramic Primer, Clearfil porcelain bond, Monobond-S), and the combination of the two methods. Empress cylinders were bonded to enamel and dentin surfaces with three kinds of resin cements(Bistite resin cement, Panavia 21, Variolink). The specimens were aged in $37^{\circ}C$ distilled water for 24 hours. Half of the specimens were then thermocycled 500times between $5^{\circ}C$ and $55^{\circ}C$ with a dwell time of 15 seconds. Each specimen was debonded in shear mode and measured shear bond properties by using the universal testing machine(Zwick 020, Germany). The data were analyzed by SPSS/PC+(one-way ANOVA, Scheffe' s test and t-test). The results were as follows : 1. Without thermocyling, there was significant difference of shear bond strength to enamel surface between Bistite Resin Cement and Panavia 21 in case of etched and silane-treatment(p<0.05). 2. Without thermocyling, the shear bond strength of a group treated with silane and etching was significantly higher than that of a group treated with silane or etching with the application of Panavia 21 and Variolink(p<0.05). 3. A group treated with etching with the application of Variolink only showed a decrease of shear bond strength after thermocycling(p<0.05).
The objective of this investigation was to compare the effects of water storage on the aspect of hardness and diametral tensile strengths of four hybrid glass ionomer cements(two compomers and two resin-reinforced glass ionomers) with a resin composite material. One composite resin(Degufill Ultra), two compomers(Dyract, Compoglass Cavifil), and two resin-reinforced glass ionomers(Fuji Duet, Vitremer) were used in this study. Cylindrical specimens were prepared and stored at $36{\pm}1^{\circ}C$ in distilled water for 10 minutes after set, and then tested on an Instron testing machine(No.4467) at 1.0 mm/min displacement rate. Vicker's hardness and diametral tensile strengths as time elapsed were measured after aging in water for 10 minutes, 1 hour, 3 hours, 1 day, 3 days, 5 days and 7 days at $36{\pm}1^{\circ}C$. During the test of diametral tensile strength, stress-strain curves were obtained, from which the compressive modulus were calculated and compared. The structure of four set glass ionomer cement mass was observed on SEM(Hitachi, S-2300) after being etched with 9.6% hydrofluoric acid for 1 minute. The results were as follows; 1. The hardness of the experimental group(compomer and the resin reinforced glass ionomer cement) did not exceed the value of control group(Degufill Ultra). 2. Vicker's hardness of the Fuji Duet tended to increase succeedingly, Dyract was decreased after 3 hours in water, and Vitremer was the lowest. 3. The control group(Degufill Ultra) presented progressively on increased diametral tensile strength with time, Fuji Duet were decreased after 3 days, Compoglass Cavifil and Vitremer were decreased after 5 days in water storage. 4. Compressive modulus of the control group(Degufill Ultra) and Dyract were increased sharply timely, Fuji Duet and Vitremer were increased smoothly by lapse of time in water. Fuji Duet were stronger than Vitremer. On the other hand, Vitremer exhibited the lowest toughness. 5. The microstructure of compomer was similar with that of the composite resin(Degufill Ultra), and the fillers in resin-reinforced glass ionomer cements were noticed. It can be concluded that mechanical properties of hybrid glass ionomer cements is weaker than composite resin, and that the compomers or the resin-reinforced glass ionomers can not substitute the composite resins. A plenty of considerations should be done on the application of them to the area under the loading and high wear has a little adverse effect on the mechanical properties on the water storage for 7 days. The further research should be needed to confirm the advantage of the compomer.
Although Lithium metal battery (LMB) has a very large theoretical capacity, it has a critical problem such as formation of dendrite which causes short circuit and short cycle life of the LMB. In this study, PDMS/GO composite with evenly dispersed graphene oxide (GO) nanosheets in poly (dimethylsiloxane) (PDMS) was synthesized and coated into a thin film, resulting in the effect that can physically suppress the formation of dendrite. However, PDMS has low ion conductivity, so that we attained improved ion conductivity of PDMS/GO thin film by etching technic using 5wt% hydrofluoric acid (HF), to facilitate the movement of lithium (Li) ions by forming the channel of Li ions. The morphology of the PDMS/GO thin film was observed to confirm using SEM. When the PDMS/GO thin film was utilized to lithium metal battery system, the columbic efficiency was maintained at 87.4% on average until the 100th cycles. In addition, voltage profiles indicated reduced overpotential in comparison to the electrode without thin film.
Park, Jong-Myeong;Kim, Yeong-Rae;Kim, Sung-Dong;Kim, Jae-Won;Park, Young-Bae
Journal of the Microelectronics and Packaging Society
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v.19
no.1
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pp.39-45
/
2012
Three-dimensional integrated circuit(3D IC) technology has become increasingly important due to the demand for high system performance and functionality. In this work, BOE and HF wet etching of Cu line surfaces after CMP were conducted for Cu-Cu pattern direct bonding. Step height of Cu and $SiO_2$ as well as Cu dishing after Cu CMP were analyzed by the 3D-Profiler. Step height increased and Cu dishing decreased with increasing BOE and HF wet etching times. XPS analysis of Cu surface revealed that Cu surface oxide layer was partially removed by BOE and HF wet etching treatment. BOE treatment showed not only the effective $SiO_2$ etching but also reduced dishing and Cu surface oxide rather than HF treatment, which can be used as an meaningful process data for reliable Cu-Cu pattern bonding characteristics.
Kim, Jae-Hyun;Kim, Gang-Phil;Ryu, Hong-Keun;Suh, Hong-Suk;Lee, Jung-Ho
Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
/
2008.06a
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pp.241-241
/
2008
Macrofore formation in silicon and other semiconductors using electrochemical etching processes has been, in the last years, a subject of great attention of both theory and practice. Its first reason of concern is new areas of macropore silicone applications arising from microelectromechanical systems processing (MEMS), membrane techniques, solar cells, sensors, photonic crystals, and new technologies like a silicon-on-nothing (SON) technology. Its formation mechanism with a rich variety of controllable microstructures and their many potential applications have been studied extensively recently. Porous silicon is formed by anodic etching of crystalline silicon in hydrofluoric acid. During the etching process holes are required to enable the dissolution of the silicon anode. For p-type silicon, holes are the majority charge carriers, therefore porous silicon can be formed under the action of a positive bias on the silicon anode. For n-type silicon, holes to dissolve silicon is supplied by illuminating n-type silicon with above-band-gap light which allows sufficient generation of holes. To make a desired three-dimensional nano- or micro-structures, pre-structuring the masked surface in KOH solution to form a periodic array of etch pits before electrochemical etching. Due to enhanced electric field, the holes are efficiently collected at the pore tips for etching. The depletion of holes in the space charge region prevents silicon dissolution at the sidewalls, enabling anisotropic etching for the trenches. This is correct theoretical explanation for n-type Si etching. However, there are a few experimental repors in p-type silicon, while a number of theoretical models have been worked out to explain experimental dependence observed. To perform ordered macrofore formaion for p-type silicon, various kinds of mask patterns to make initial KOH etch pits were used. In order to understand the roles played by the kinds of etching solution in the formation of pillar arrays, we have undertaken a systematic study of the solvent effects in mixtures of HF, N-dimethylformamide (DMF), iso-propanol, and mixtures of HF with water on the macrofore structure formation on monocrystalline p-type silicon with a resistivity varying between 10 ~ 0.01 $\Omega$ cm. The etching solution including the iso-propanol produced a best three dimensional pillar structures. The experimental results are discussed on the base of Lehmann's comprehensive model based on SCR width.
The usage of toxic gas in Korea is increasing in the development of high-tech industries such as semiconductors, displays and solar panels. The recent survey of domestic toxic gas consumption indicates an increase in annual average of 12.4 percent, but it is still focused on usage, and it is negligent in safety and treating the post. In September 2012, an accident occurred in Gu-mi involving hydrofluoric acid leak demonstrates the absence of safety management. Due to the incident, the government, industry and academia have been interested in chemical substances(toxic gas), and the government-led safety management has been established and implemented, but there are still a lot of safety blind spots. The purpose of this study is to develop effective measurement methods for the destruction or removal efficiency of gaseous materials emitted from the Scrubber used in the semiconductor and display industries. Also, this study demonstrated how toxic gas facilities can be applied without error by verification test for the measurement method guideline of the destruction or removal efficiency of the green-house gas reduction facility in the semiconductor and display industries used by the National Institute of Environmental Research and the UNFCCC, and suggested the differentiated measurement methods for toxic gas reduction facilities, and the third party certification for safety facilities is needed to prevent toxic gas accidents.
The purpose of this study was to estimate shear bond strength according to difference in Targis surface treatment and storage condition. 140 non-carious extracted human molars and Targis D210(Ivoclar, Liechtenstein) were used in the present study and were divided into 7 experimental groups respectively according to surface treatment of Targis. Group 1 ; No treatment, Group 2 ; $50{\mu}m$ aluminium oxide blasting, Group 3 ; 4% HF etching for 3 minutes, Group 4 ; 4% HF etching after blasting, Group 5 ; silane treatment after blasting, Group 6 ; silane treatment after 4% HF etching, Group 7 ; silane treatment after blasting and 4% HF etching. In Each group, one half of 20 specimens was stored in distilled water at $37^{\circ}C$ for 24 hours and the other half was stored at atmosphere for 24 hours respectively. Dentin surface was etched with 10% $H_3PO_4$ for 15 seconds and luting cement(Variolink II, Vivadent, Liechtenstein) was applied by manufacturer's recommendation. Shear bond strength for each group was then measured. To examine the failure patterns after shear bond test and to observe the change after surface treatment of Targis. Specimens were fabricated and observed under the SEM. Statistical analysis was performed by One Way ANOVA test and t-test. The results were as follows ; 1. The shear bond strength of the groups stored in water significantly lower than that of groups stored at atmosphere (P<0.05). 2. There was no significant difference in shear bond strength in groups stored in water (P>0.05). 3. The shear bond strength without surface treatment of Targis were lowest among all experimental groups in atmosphere condition(P<0.05). 4. There was no significant difference in bond strength between groups using the silane or not(P>0.05). 5. The groups treated by blasting, hydrofluoric acid and silane sequentially showed highest bond strength than that of other groups in atmosphere condition, but there was no significant difference(P>0.05). 6 The proportions of the specimens showing the mixed fracture failure were 20% in HF etching group and blasting + HF group, 40% in blasting + HF + silane group in atmosphere condition. All the specimens stored in water showed adhesive fracture failure.
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