• 한국전기전자재료학회논문지
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• 제18권5호
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• pp.389-395
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• 2005

The etching technology of the high aspect ratio contact(HARC) is necessary at the critical contact processes of semiconductor devices. Etching the $SiO_{2}$ contact hole with the sub-micron design rule in manufacturing VLSI devices, the unexpected phenomenon of 'profile tilting' or 'bottom distortion' is often observed. This makes a short circuit between neighboring contact holes, which causes to drop seriously the device yield. As the aspect ratio of contact holes increases, the high C/F ratio gases, $C_{4}F_{6}$, $C_{4}F_{8}$ and $C_{5}F_{8}$, become widely used in order to minimize the mask layer loss during the etching process. These gases provide abundant fluorocarbon polymer as well as high selectivity to the mask layer, and the polymer with high sticking yield accumulates at the top-wall of the contact hole. During the etch process, many electrons are accumulated around the asymmetric hole mouth to distort the electric field, and this distorts the ion trajectory arriving at the hole bottom. These ions with the distorted trajectory induce the deformation of the hole bottom, which is called 'profile tilting' or 'bottom distortion'. To prevent this phenomenon, three methods are suggested here. 1) Using lower C/F ratio gases, $CF_{4}$ or $C_{3}F_{8}$, the amount of the Polymer at the hole mouth is reduced to minimize the asymmetry of the hole top. 2) The number of the neighboring holes with equal distance is maximized to get the more symmetry of the oxygen distribution around the hole. 3) The dual frequency plasma source is used to release the excessive charge build-up at the hole mouth. From the suggested methods, we have obtained the nearly circular hole bottom, which Implies that the ion trajectory Incident on the hole bottom is symmetry.

• Journal of Mechanical Science and Technology
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• 제16권11호
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• pp.1359-1366
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• 2002

The measurement of residual stresses by the hole-drilling method has been used to evaluate residual stresses in structural members. In this method, eccentricity can usually occur between the hole center and rosette gage center. In this study, we obtained the magnitude of the error due to eccentricity of a hole through the finite element analysis. To predict the magnitude of the error due to eccentricity of a hole in the biaxial residual stress field, it could be learned through the back propagation neural network. The prediction results of the error using the trained neural network showed good agreement with FE analyzed results.

• 한국공작기계학회논문집
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• 제15권1호
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• pp.1-7
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• 2006

A method of the volumetric error measurement and calibration of NC machine tools is studied using an artifact method. In this study, a hole-pate is designed and machined using stainless steel. We tested and applied the hole-plate artifact in a commercial CMM(Coordinate Measuring Machine), after calibration of the hole-plate using a precise CMM. It has been shown that not only the measurement of geometric error components but also the 2D length error calculation in a working volume is available using the hole-pate artifact method. The results of study can also be used in NC machine with touch probe as the same method in CMM.

• 한국항공운항학회지
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• 제14권1호
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• pp.43-48
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• 2006

The present study was carried out in order to develope a seven-hole pressure probe which is able to measure high flow angles. The seven-hole pressure probe is a non-nulling, directional velocity probe used for measuring three dimensional flow that having high flow angles. A 4 mm diameter seven-hole conical pressure probe was manufactured with a cone angle of 70$^{\circ}$. The probe was comprised of seven 1 mm diameter stainless steel tubes packed close together and fitted into an outer stainless steel sleeve. The calibration procedure is based on the use of the Callington's polynomial curve-fit method. The validity of the seven-hole conical pressure probe is demonstrated by comparisons with hot-wire data.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2011년도 제42회 하계학술대회
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• pp.1724-1725
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• 2011

본 논문에서는 LED 패키지의 방열문제를 해결하기 위해 FR4 PCB에 Via-hole을 형성함으로써 열전달 능력을 향상시키고자 하였다. 또한 FR4 PCB의 면적과 Via-hole 크기 및 수량을 변화를 주어 그에 따른 K-factor를 측정 하였으며 열 저항 특성을 분석하였다. 결과로서, Via-hole을 형성한 FR4 PCB의 경우 초기 면적이 증가함에 따라 열 저항 및 접합온도가 급격히 감소하는 특성을 보였으며 200 [mm2]에서 안정화 되는 특성을 보였다. 또한 PCB 면적 및 Via-hole을 형성함에 따라 광 출력이 최대 17% 향상 되었다. 따라서 접합온도 및 열 저항에 있어서 PCB면적의 증가 및 Via-hole을 구성함에 있어 열전달 능력을 향상시킬 수 있음을 확인하였다.

• 한국해양공학회지
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• 제8권1호
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• pp.96-104
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• 1994

The use of advanced composite materials has grown in recent years in aerospace and other structures. Out of various kinds of repairing methods the one selecteh for this study is an idealized case which simulates a situation where a damaged laminate has been repaired by drilling a hole and therefter plugging the hole with reinforcement. Two typesof reinforcement are investigated ;adhesively bonged plug reinforcement or snug-fit unbonded plug in the hole. For each case of reinforcement, four different sizes of hole diameter and three types of reinforcing material(steel, aluminum, plexiglass) are employed for investigation. The experiment are mainloy forced on the evaluation of ultimate strength of laminate with reinforced hole in comparison to its counterpart with the open hole.

• 대한기계학회논문집A
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• 제31권11호
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• pp.1053-1058
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• 2007

Micro-EDM technology (or the manufacture of miniature parts is used to make a micro hole. Two electrode shaping methods, mechanical electrode grinding and WEDG technique, have been studied. In this study, an electrode shaping method by using previously machined hole is introduced in order to obtain an optimal hole-making condition. Key factors such as applied voltage, capacitance, feedrate, and hole-dimension have an influence on the fabricating error of electrode shaping, which are taper ratio of a hole, electrode form accuracy, and electrode surface. Therefore, we try to investigate the optimal fabricating of electrode shaping from various experiments. Results from experiments, it was able to minimize the electrode fabricating error as voltage increases, and also applied feedrate and capacitance decreases.

• 대한화학회지
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• 제39권10호
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• pp.763-768
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• 1995

Weak burn intensity limit에서 홀의 깊이를 계산하는 기존의 이론을 임의의 burn 세기에서도 계산할수 있도록 NPHB kinetic에 관한 유사 3-준위계를 이용하여 확장하였다, 이 모델은 같은 burn fluence에 대하여 burn 세기가 클 때는 다른 홀의 깊이를 burn 세기가 약한 경우에는 같은 홀의 깊이를 나타내었다. 이 모델을 이용하여 계산된 홀 성장곡선들과 기존의 oxzaine720/glycerol와 tetracene/MTHF glass의 실험 데이타를 비교하였다.

• 대한기계학회논문집B
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• 제21권11호
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• pp.1437-1448
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• 1997

Pressures of a five-hole probe were measured for a full range of yaw and pitch angles and complete pressure coefficient maps were obtained. Based on these maps, various features of five-hole probe pressures were revealed and new five-hole probe calibration coefficients were devised. The new calibration coefficients show non-diverging characteristics for any flow direction and one-to-one correspondence for a wide range of flow angles. These calibration coefficients expand the valid flow angle range of five-hole probe calibration by .+-.10 degrees and complement a critical defect of five-hole probe zone-division calibration method which has not been known yet. Moreover new non-diverging calibration coefficients have advantages in nulling methods, too.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2001년도 추계학술대회논문집B
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• pp.952-957
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• 2001

The objectives of this investigation were to obtain an excellent spray by cavitation under the low injection pressure. When cavitation occurs in the nozzle hole, the atomization of the liquid jet enhanced considerably. In this experiments, a acrylic nozzle made the gap and installed the bypass in the nozzle hole was used to enhance the atomization of the liquid jet at the low injection pressure. The liquid flow in the nozzle hole was photographed by a transmitted light using a micro flash. The spray angle was measured macroscope images of PMAS and the Sauter mean diameter was measured PDA system. To measure the pressure of the nozzle hole, pressure transducer was used. The results of this study indicated that enhanced atomization of the liquid jet at the low injection pressure was obtained by making the gap and installing the bypass at the single hole nozzle.