• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2001년도 제4회 압출 및 인발가공 심포지엄
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• pp.55-62
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• 2001

An electrolytic copper rod was drawn up to $90\%$ in area reduction and annealed under various conditions. The EBSD measurement of the drawn wire showed that in the center region the <111> + <100> fiber duplex texture was dominant, while in the middle and surface regions relatively defused textures developed with a little higher density in <11w>//wire axis. The inhomogeneous texture in the deformed wire gave rise to the inhomogeneous microstructure and texture after annealing. The annealing texture could be classified into the recrystallization texture developed during low temperatures and at the early stage at a high temperature and the growth texture developed after a prolonged annealing at the high temperature. The recrystallization temperature could be explained by the strain energy release maximization model and the growth texture was discussed based on the grain boundary mobility anisotropy.

• 대한금속재료학회지
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• 제48권9호
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• pp.856-860
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• 2010

Silver nanoparticles were formed on silica substrates through thin film dewetting at high temperature. The microstructural and morphological evolution of the particles were characterized as a function of processing variables such as initial film thickness, annealing time, and temperature. Silver thin films were deposited onto the silica using a pulsed laser deposition system and annealed in reducing atmosphere to induce agglomeration of the films. The film thicknesses before dewetting were in the range of 5 to 25 nm. A noticeable agglomeration occurs with annealing at temperatures higher than $300^{\circ}C$, and higher annealing temperature increases particle size uniformity for the same film thickness sample. Average particle size linearly correlates to the film thickness, but it does not strongly depend on annealing temperature and time, although threshold temperature for complete dewetting increases with an increase of film thickness. Lower annealing temperature develops faceted surface morphology of the silver particles by enhancing the growth of the low index crystal plane of the particles.

• 한국정보통신학회논문지
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• 제20권10호
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• pp.1980-1986
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• 2016

본 논문에서는 KrF 레이저를 이용한 격자 공정 후 고온 어닐링 온도조건에 따른 감마방사선 영향을 분석하였다. 제작된 광섬유 브래그 격자는 게르마늄(Ge)이 첨가된 동일한 광섬유에 어닐링 온도를 달리하여 제작하였으며, $Co^{60}$ 감마선원을 이용하여 약 115 Gy/min의 선량률로 총선량 약 31 kGy 감마선을 조사하였다. 격자의 안정화를 위한 고온 어닐링 공정은 광섬유 브래그 격자의 방사선 민감도 변화에 영향을 주는 것으로 나타났다. 실험결과를 통하여, 각각 다른 온도(100, 150, $200^{\circ}C$)로 안정화시킨 광섬유 브래그 격자들은 고온에 노출될수록 방사선 민감도가 증가했으며, 어닐링 온도조건에 따라서 방사선에 의한 브래그 파장 변화는 2배 이상의 차이를 보였다.

• Transactions on Electrical and Electronic Materials
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• 제2권1호
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• pp.22-26
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• 2001

ITO (Indium-tin-oxide) thin films were deposited on glass substrates by a dc magnetron sputtering system using ITO powder target. The methods of heat treatment are important factor to obtain high quality ITO films with low electrical resistivity and good optical transmittance. Therefore, both methods of the substrate temperature and post-deposition annealing temperature have been compared on the film structural, electrical and optical properties. A preferred orientations shifts from (411) to (222) peak at annealing temperature of 200$\^{C}$. Minimum resistivity of ITO film is approximately 8.7$\times$10$\^$-4/ Ωcm at substrate temperature of 450$\^{C}$. Optical transmittances at post annealing temperature above 200$\^{C}$ are 90%. As a result, the minimum value of annealing temperature that is required for the recrystallization of as-deposited ITo thin films is 200$\^{C}$.

• 한국정밀공학회지
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• 제11권2호
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• pp.173-181
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• 1994

A Cold spot temperature control system for the batch annealing furnace has been estabilished in order to reduce energy consumption to improve productivity and stabilize the propertics of products. Therefore we confirmed a relation between annealing cycle time and atmospheric gas, variation of coil cold spot temperature with time during heating and actual temperature measurements at mid-width of each coil during heating and actual temperature measurements at mid-width of each coil during soaking. The results of the tempaeature variation effect on the batch annealing are as follows. 1) Heating time is reduced to one half with increasing atmospheric gas flow rate and changing of atmospheric gas component from HNx to Ax gas, and annealing cycle time is reduced to 2.7 times. 2) In case of short time healing, the slowest heating part is the center of B coil, in case of long time heating, the low temperature point moves from the center of coil to inside coil. And the temperature in this part is higher than other parts when cooling. When finished heating, the cold spot is located 1/3 of coil inside in case of HNx atmospheric gas. But center of coil in case of Ax atmospheric gas. 3) The outside of top coil is the highest temperature point when heating, which becomes the lowest temperature point when cooling. So, this point becomes high temperature zone at heating and low temperature zone at cooling, It has relation according to atmospheric gas component and flow rate. 4) Soaking time at batch annealing cycle determination is made a decision by the input coil width, and soaking time for quality homogenization of 1214mm width coil must be 2.5 hours longer than that of 914mm width coil for the same ciol weight. 5) Annealing cycle time with Ax atmospheric gas is extended 1 hour in of slow cooling during 5 hours in order to avoid rapid cooling.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1998년도 하계학술대회 논문집 D
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• pp.1349-1351
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• 1998

Platinum-Cobalt alloy thin films were deposited on $Al_2O_3$ substrates by r.f. cosputtering for RTD temperature sensors. We made Pt-Co alloy resistance patterns on the $Al_2O_3$ substrates by lift-off method and investigated the physical and electrical characteristics of these films under various conditions (the input power, working vacuum, annealing temperature, thickness of thin films) and also after annealing these films. At input power of Pt : $4.4 W/cm^2$. Co:6.91W/$cm^2$. working vacuum of 10 mTorr and annealing conditions of $1000^{\circ}C$ and 60 min, the resistivity and sheet resistivity of Pt-Co thin films was $15{\mu}{\Omega}{\cdot}cm$ and $0.5{\Omega}/{\square}$, respectively. The TCR value of Pt-Co alloy thin films was measured with various thickness of thin films and annealing conditions. The optimum TCR value is gained under conditions $3000{\AA}$ of thin films thickness and $1000^{\circ}C$ of annealing temperature. These results indicate that Pt-Co alloy thin films have potentiality for the high resolution RTD temperature sensors.

• 한국전기전자재료학회논문지
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• 제21권1호
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• pp.1-4
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• 2008

The electrical characteristics of polycrystalline silicon (poly-Si) thin film transistor (TFT) crystallized by excimer laser annealing (ELA) method were evaluated, The polycrystalline silicon thin-film transistor (poly-Si TFT) has higher electric field-effect-mobility and larger drivability than the amorphous silicon TFT. However, to poly-Si TFT's using conventional processes, the temperature must be very high. For this reason, an amorphous silicon film on a buried oxide was crystallized by annealing with a KrF excimer laser (248 nm)to fabricate a poly-Si film at low temperature. Then, High permittivity $HfO_2$ of 20 nm as the gate-insulator was deposited by atomic layer deposition (ALD) to low temperature process. In addition, the solid phase crystallization (SPC) was compared to the ELA method as a crystallization technique of amorphous-silicon film. As a result, the crystallinity and surface roughness of poly-Si crystallized by ELA method was superior to the SPC method. Also, we obtained excellent device characteristics from the Poly-Si TFT fabricated by the ELA crystallization method.

• 열처리공학회지
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• 제34권2호
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• pp.53-59
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• 2021

Due to high specific strength and low density, AZ series magnesium alloys have been receiving high interest as a lightweight material. However, their industrial application is limited due to the phenomenon that the strength decreases at elevated temperature by the occurrence of softening effect because of the Mg17Al12 phase decomposition. To solve this problem, many research were conducted to increase the high-temperature strength by forming a thermal stable second-phase component by adding new elements to the AZ magnesium. Especially, adding Ca to AZ magnesium has been reported that Ca forms the new second-phase. However, studies about the analysis of decomposition or precipitation temperature, formation composition, and components to understand the formation behavior of these precipitated phases are still insufficient. Therefore, the effect of Ca addition to AZ61 on the phase change and microstructure of the alloy during annealing was investigated. As a result of analysis of the initial and heat-treated specimen, AZ61 formed α-Mg matrix and precipitated phase of Mg17Al12, and AZX611 formed one more type of precipitated phase, Al2Ca. Also, Al2Ca was thermal stable at high temperatures. And after annealing, the laves phase was decomposed to under 10 ㎛ size and distributed in matrix.

• Journal of Advanced Marine Engineering and Technology
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• 제39권1호
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• pp.81-85
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• 2015

본 연구에서는 Poly (3-hexylthiophene-2,5-diyl) (P3HT):[6,6]-Phenyl C61 butyric acid methyl ester (PCBM)과 GaN를 이용하여 유무기 하이브리드 광전변환소자를 제작함에 있어서, P3HT:PCBM 활성층의 열처리가 소자의 단락전류밀도에 미치는 영향을 알아보았으며 이때 유기물의 농도와 혼합비율을 달리 하였다. 유기물 각각의 층을 코팅하여 층을 만들 때마다 열처리 한 경우, 즉 pre-annealing샘플과 pre-annealing 과정을 거쳐 제작된 소자 전체를 한 번 더 열처리하여 즉 post-annealing까지 행한 샘플을 비교하였다. 그 결과 post-annealing한 샘플이 더 높은 단락전류밀도의 값을 가졌고 이때 P3HT와 PCBM은 1wt%와 1:1 혼합비율에서 좋은 열처리 효과를 나타내었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 추계학술대회 논문집
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• pp.107-108
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• 2007

In order to investigate the electrical properties of Hf-silicate as a function of annealing temperature, Hf-silicate deposited by atomic layer deposition (ALD) was studied. After Hf-silicate film deposition, annealing was proceeded at $500^{\circ}C\;and\;700^{\circ}C$. The hysteresis of C-V curves and trapping charge densities were decreased after annealing process. As annealing temperature became higher from $500^{\circ}C\;to\;700^{\circ}C$, the capacitance equivalent thickness (CET) was increased from 1.66 nm to 1.76 nm and the leakage current at -1 V was decreased from $1.70{\times}10^{-4}\;to\;5.68{\times}10^{-5}\;A/cm^2$.