• 한국재료학회:학술대회논문집
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• 한국재료학회 2005년도 춘계학술발표대회 및 제8회 신소재 심포지엄 논문개요집
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• pp.116-116
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• 2005

• 대한전기학회:학술대회논문집
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• 대한전기학회 1999년도 추계학술대회 논문집 학회본부 C
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• pp.1140-1141
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• 1999

유리 및 세라믹 미세구조물은 열적, 화학적, 기계적특성이 우수하며 이 제조방법으로 대표적인 것이 그라스의 노광, 열처리에 의한 노광부를 선택적으로 에칭시켜 구조물을 형성시키는 감광성그라스 공정이다. 그러나 공정조건을 변화시킴에 따라 기존과는 정반대로 비노광부를 선택적으로 에칭시키는 것이 가능하였으며 본 방식에 의해서 더욱 정밀한 미세구조물을 형성할 수 있음을 확인하였다.

• Journal of Electrical Engineering and Technology
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• 제6권5호
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• pp.688-692
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• 2011

Carbon nanotubes (CNTs) are vertically grown inside high-aspect-ratio vertical pores of anodized aluminum oxide. A CNT catalyst layer is introduced by atomic layer deposition to the bottom of the pores, after which the CNTs are successfully grown from the layer using chemical vapor deposition. The CNTs formed a complete vertical conductive path. The conductivity of the CNT-vertical path is also measured and discussed. The present atomic layer deposition-incorporated catalyst deposition is predicted to enable the integration of CNTs with various challenging configurations, including high-aspect-ratio vertical channels or vertical interconnects.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 추계학술대회 논문집
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• pp.543-544
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• 2010

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2011년도 춘계학술대회 논문집
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• pp.645-646
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• 2011

• Design & Manufacturing
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• 제11권3호
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• pp.1-7
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• 2017

The fabrication process of micro pattern structure with high precision and high aspect ratio using powder injection molding (PIM) is developed. In the PIM process, the metal powder is mixed with the binder systems and the mixture is injected into the metal mold. The injection molded green parts are debinded and sintered to reach final shape and properties. In this method, the optimization of physical properties such as fluidity and strength of the binder system is essential for perfect filling the high aspect ratio micro-pattern. For this purpose, the correlation between the properties of the binder system and feedstock and ${\mu}-PIM$ process was investigated, and a binder system with low viscosity at low temperature(about $110^{\circ}C$) and high strength after cooling was investigated and applied. Employing this process, high precision parts with line type micro pattern structure which has pattern size $160{\mu}m$ and aspect ratio more than 2 can be manufactured.

• 마이크로전자및패키징학회지
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• 제8권1호
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• pp.33-38
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• 2001

5인치 실리콘 기판위에 수 회 코팅기술을 이용하여 두꺼운 감광막을 얻은 후, 전기도금 법으로 솔더범프를 형성하고, 비아크기의 변화에 따른 리플로 전과, 후의 솔더범프 형성에 미치는 영향을 조사하였다. 리플로 전의 범프바닥 (bump bottom) 직경은 리플로 후에도 거의 변화가 없는 반면, 솔더범프 모양은 패턴된 비아직경 크기에 크게 의존했다. 비아직경이 클수록 높은 도금효율을 보였다. 비아직경이 작을수록 리플로 후의 범프는 리플로 전의 범프높이와 비교하여 크게 낮아졌지만, aspect ratio는 크다는 것을 알았다. 고밀도와 고aspect ratio를 갖는 범프를 얻기 위하여 비아직경과 범프피치를 줄여야하지만, 과도금 (overplating), 또는 리플로를 할 때 최인접 간 범프끼리 맞닿을 수 있기 때문에 최인접 간 범프거리 확보는 중요하다. 비아높이(film두께)를 높게 하여 과도금을 하지 않고 비아높이가지만 도금하여 과도금으로 인한 최인접 범프끼리의 맞닿음을 없애는 방법과 범프배열을 zig-zag로 하는 방법을 혼용하면 과도금, 또는 리플로를 할 때 최인접 범프 간에 맞닿는 문제는 어느 정도 해결할 수 있다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.370-370
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• 2012

Feature size of Cu interconnects keep shrinking into several tens of nanometer level. For this reason, the Cu interconnects face challenging issues such as increase of electro-migration, line-width dependent electrical resistivity increase, and gap-filling difficulty in high aspect ratio structures. As the thickness of the Cu film decreases below 30 nm, the electrical resistivity is not any more constant, but rather exponential. Research on alloying with other elements have been started to inhibit such escalation in the electrical resistivity. A faint trace of Al added in Cu film by sputtering was reported to contribute to suppression of the increase of the electrical resistivity. From an industrial point of view, we introduced cyclic metal organic chemical vapor deposition (MOCVD) in order to control Al concentration in the Cu film more easily by controlling the delivery time ratio of Cu and Al precursors. The amount of alloying element could be lowered at level of below 1 at%. Process of the alloy formation was applied into gap-filling to evaluate the performance of the gap-filling. Voidless gap-filling even into high aspect ratio trenches was achieved. In-depth analysis will be discussed in detail.

• 한국전기전자재료학회논문지
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• 제25권12호
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• pp.1015-1020
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• 2012

Resistance of the front electrode is the highest proportion of the ingredients of the series resistance in crystalline silicon solar cell. While resistance of the front electrode is decreased with larger area, it induces the optical loss, causing the conversion efficiency drop. Therefore the front electrode with high aspect ratio increasing its height and decreasing is necessary for high-efficiency solar cell in considering shadowing loss and resistance of front electrode. In this paper, we used the screen printing method to form high aspect ratio electrode by multiple printing. Screen printing is the straightforward technology to establish the electrodes in silicon solar cell fabrication. The several printed front electrodes with Ag paste on silicon wafer showed the significantly increased height and slightly widen finger. As a result, the resistance of the front electrode was decreased with multiple printing even if it slightly increased the shadowing loss. We showed the improved electrical characteristics for c-Si solar cell with repeatedly printed front electrode by 0.5%. It lays a foundation for high efficiency solar cell with high aspect ratio electrode using screen printing.

• 한국소음진동공학회논문집
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• 제22권5호
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• pp.480-488
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• 2012

The aircrafts with high aspect ratio wings made by a composite material have been developed, which enable high energy efficiency and long-term flight by reducing air resistance and structural weight. However, they have difficulties in securing the aeroelastic stability such as the flutter because of their long and flexible wings. The flutter is unstable self-excited-vibration caused by interaction between the structural dynamics and the aerodynamics. It should be verified analytically prior to first flight test that the flutter does not happen in the range of flight mission. Normally, the finite element model is used for the flutter analysis. So it is important to construct the finite element model representing dynamic characteristics similar to those of a real aircraft. Accordingly, in this research, to acquire dynamic characteristics experimentally the modal test of the aircraft with high aspect ratio composite wings was conducted. And then the modal parameters from the finite element analysis(FEA) were compared with those from the modal test. To make analysis results closer to test results, the finite element model was updated by means of the sensitivity analysis on variables and the optimization. Finally, it was proved that the updated finite element model is reliable as compared with the results of the modal test.