• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.97-103
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• 2014

Among various lead-free solders, the Sn-58Bi solders have been considered as a highly promising lead-free solders because of its low melting temperature and high tensile strength. However, Sn-58Bi solder has the poor ductility. To enhance the mechanical property of Sn-58Bi solder, epoxy-enhanced Sn-58Bi solders have been studied. This study compared the microstructures and the mechanical properties of Sn-58Bi solder and Sn-58Bi epoxy solder with aging treatment. The solders ball were formed on the printed circuit board (PCB) with organic solderability preservative (OSP) surface finish, and then the joints were aged at 85, 95, 105 and $115^{\circ}C$ for up to 100, 300, 500 and 1000 hours. The shear test was conducted to evaluate the mechanical property of the solder joints. $Cu_6Sn_5$ intermetallic compound (IMC) layer grew with increasing aging time and temperature. The IMC layer for the Sn-58Bi epoxy solder was thicker than that for the Sn-58Bi solder. According to result of shear test, the shear strength of Sn-58Bi epoxy solder was higher than that of Sn-58Bi solder and the shear strength decreased with increasing aging time.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.1
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• pp.9-17
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• 2010

In this study, von Mises stress and total strain energy density characteristics of lead pin in PGA (Pin Grid Array) packages have been calculated by using the FEM (Finite Element Method). FEM computation is carried out with various heat treatment conditions of lead pin material under $20^{\circ}$ bending and 50 mm tension condition. Results show that von Mises stress locally concentrated on lead pin corners and interface between lead pin head and solder. von Mises stress and total strain energy density decrease as heat treatment temperature of lead pin increases. Also, round shaped corner of lead pin decreases both von Mises stress and total strain energy density on interface between lead pin head and solder. This means that PGA package reliability can be improved by changing the mechanical property of lead pin through heat treatment. This has been known that solder fatigue life decreases as total strain energy density of solder increases. Therefore, it is recommended that both optimized lead pin shape and optimized material property with high lead pin heat treatment temperature determine better PGA package reliability.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.2 s.43
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• pp.23-33
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• 2007

The growing environmental regulation governs the use of lead by RoHS, WEEE, and then. The electronic industry is moving to replace Pb-bearing solder with Pb-free solder. To use the Pb-free solder, microelectronic industry needs consequently the new reliability appraisal such as the packaging for high temperature process, various mechanical change caused by new solder, and the development of Pb-free sloder for long life of product. The evaluation of solder bar and mechanical properties of joint were performed compared with international standard, and new appraisal standard was established. The solderability and spread ability of Sn-0.7Cu solder material showed up to the standard. Shear test of solder joint using by the solder resulted that the shear strengths after thermal shock or after aging were not much lower than the shear strength of as-soldered and that they were also up to the standard.

• Journal of the Korean Society for Precision Engineering
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• v.26 no.1
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• pp.71-81
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• 2009

Die steel for plastic molding were used as mold material of automobile parts and electronic component industry. The material of this paper has superior to mechanical properties, such as repair weldability, corrosion resistance and high temperature strength, required mold parts for semitransparent. Laser-induced surface hardening technology is widely adopted to improver fatigue life and wear resistance via localized hardening at the surface of mold parts. The objective of this research work is to investigate on the characteristics of surface hardening of the laser process parameters, such as beam travel speed, laser power and defocsued spot position, for the case of die steel for plastic molding. Lens for surface hardening of large area is plano-convex type with elliptical profile to maintain uniform laser irradiation. According to the experimental results, large size of hardened layer at the surface of die steel for plastic molding was achieved, and microstructure of this layer was lath martensite. Optimal surface status and mechanical property of hardened layer could be obtained at 1095Watt, $0.25{\sim}0.3m/min$, 0mm (focal length: 232mm) for laser power, beam travel speed, and focal position. Where, heat input was $0.793{\times}10^{3}J/cm^2$, and width of hardened layer was 27.58mm.

• Journal of Welding and Joining
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• v.14 no.3
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• pp.48-57
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• 1996

A study was made to examine the characteristics of base metal and stress relief cracking(SRC) of heat affected zone(HAZ) for HY-100 and Cu-bearing HSLA-100 steels. The Gleeble thermal/mechanical simulator was used to simulate the SRC/HAZ. The details of mechanical properties of base plate and SRC tested specimens were studied by impact test, optical microscopy and scanning electron microscopy. The specimens were aged at $650^{\circ}C$ for HSLA-100 steel and at $660^{\circ}C$ for HY-100 steel and thermal cycled from $1350^{\circ}C$ to $25^{\circ}C$ with a cooling time of $\Delta$t_${800^{circ}C/500^{circ}C}$=21sec. corresponds to the heat input of 30kJ/cm. The thermal cycled specimens were stressed to a predetermined level of 248~600MPa and then reheated to the stress relief temperatures of $570~620^{\circ}C$. The time to failure$(t_f)$ at a given stress level was used as a measure of SRC susceptibility. The strength, elongation and impact toughness of base plate were greater in HSLA-100 steel than in HY-100 steel. The time to failure was decreased with increasing temperature and/or stress. HSLA-100 steel was more susceptible to stress relief cracking than HY-100 steel under same conditions. It is thought to be resulted from the precipitation of $\varepsilon$-Cu phase by dynamic self diffusion of solute atoms. By the precipitation of $\varepsilon$-Cu phase, the differential strengthening of grain interior relative to grain boundary may be greater in the Cu-bearing HSLA-100 steel than in HY-100 steel. Therefore, greater strain concentration at grain boundary of HSLA-100 steel results in the increased SRC susceptibility. The activation energies for SRC of HSLA-100 steel are 103.9kcal/mal for 387MPa and 87.6kcal/mol for 437MPa and that of HY-100 steel is 129.2kcal/mol for 437MPa.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.10
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• pp.1193-1198
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• 2011

The solenoid valve used in fuel cell system need to have good sealing performance because the work fluid can explode in the system. Moreover, the temperature of the work fluid is extremely high in order to maintain the properties of the rubber ring that seals the solenoid valve. This study deals with the rubber ring which is made from a fluoro-elastomer. The life cycle of the rubber ring was estimated by the relational expression of Arrhenius, and the solenoid valve was tested to confirm the sealing characteristics.

• Transactions of the Korean Society of Automotive Engineers
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• v.23 no.2
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• pp.199-207
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• 2015

Solid materials of ammonia sources with SCR have been considered for the application of lean NOx reduction in automobile industry, to overcome complex problems of liquid urea based SCR. These solid materials produce ammonia gas directly with proper heating and can be packaged by compact size, because of high volumetric ammonia density. Among ammonium salts and metal ammine chlorides, calcium ammine chloride was focused on this paper due to low decomposition temperature. In order to make calcium ammine chloride in lab-scale, simple reactor and glove box was designed and built with ammonium gas tank, regulator, and sensors. Basic test conditions of charging ammonia gas to anhydrous calcium chloride are chosen from equilibrium vapor pressure by Van't Hoff plot based on thermodynamic properties of materials. Synthetic method of calcium ammine chloride were studied for different durations, temperatures, and pressures with proper ammonia gas charged, as a respect of ammonia gas adsorption rate(%) from simple weight calculations which were confirmed by IC. Also, lab-made calcium ammine chloride were analyzed by TGA and DSC to clarify decomposition step in the equations of chemical reaction. To understand material characteristics for lab-made calcium ammine chloride, DA, XRD and FT-IR analysis were performed with published data of literature. From analytical results, water content in lab-made calcium ammine chloride can be discovered and new test procedures of water removal were proposed.

• Macromolecular Research
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• v.17 no.9
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• pp.658-665
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• 2009

This study examined the effects of the sodium salts of aliphatic dicarboxylic acids (DCAs) on the dynamic mechanical properties and morphology of two sets of poly(styrene-co-sodium methacrylate) (MNa) and poly(styrene-co-sodium styrenesulfonate) (SNa) ionomers. When the DCA content was relatively low, the ionic moduli of the MNa and SNa ionomers increased but the matrix and cluster glass transition temperature ($T_g$) did not change significantly. The increasing ionic modulus was almost independent of the type of the ionic groups of the ionomer, and the chain length of DCAs. When a large amount of the sodium succinate (DCA4) was added to the MNa and SNa ionomers, the ionic moduli of the two ionomers increased strongly but the matrix and cluster $T_g's$ increased slightly and significantly, respectively. In the case of sodium hexadecanedioate (DCA 16), DCA 16 increased the ionic moduli of the two ionomers. The addition of DCA16 changed the matrix and cluster $T_g's$ of the MNa ionomer slightly, but decreased the cluster $T_g$ of the SNa ionomer significantly with no change in the matrix $T_g$. In addition, the DCA-containing ionomers showed an X-ray diffraction peak indicating the presence of ordered domains of DC As in the ionomers. Hence, DCA4 acts mainly as a reinforcing filler in MNa and SNa systems. In the case of DCA 16, it initially behaved like a filler but also functioned as a preferential plasticizer for the clusters at high content.

• Journal of Powder Materials
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• v.18 no.5
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• pp.456-462
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• 2011

Yttrium oxide is one of the most thermo-dynamically stable materials, so that it is generally used as a dispersoid in many kinds of dispersion strengthed alloys. In this study, a nickel-base superalloy is strengthened by dispersion of yttrium oxide particles. Elemental powders with the composition of Ni-22Cr-18Fe-9Mo were mechanically alloyed(M.A.) with 0.6 wt% $Y_2O_3$. The MA powders were then HIP(hot isotactic press)ed and hot rolled. Most oxide particles in Ni-22Cr-18Fe-9Mo base ODS alloy were found to be Y-Ti-O type. The oxide particles were uniformly dispersed in the matrix and also on the grain boundaries. Tensile test results show that the yield strength and ultimate tensile strength of ODS alloy specimens were 1.2~1.7 times higher than those of the conventional $Hastelloy^{TM}$ X(R), which has the same chemical compositions with ODS alloy specimens except the oxide particles.

• Journal of the Korea Institute of Military Science and Technology
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• v.13 no.6
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• pp.1121-1126
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• 2010

Borosilicate glass (81% $SiO_2$-2% $Al_2O_3$-13% $B_2O_3$-4% $Na_2O_3$) was prepared, and the glass was ion exchanged in $KNO_3$ powder containing different temperature and time. The $K^+-Na^+$ ion exchange takes place at the glass surface and creates compressed stress, which raise the mechanical strength of the glass. The depth profile of $Na^+$ and $K^+$ was observed by electron probe micro analyzer. With the increasing heat-treatment time from 0min to 20min, the depth profile was increased from 17.1um to 29.4um, but mechanical properties were decreased. It was also found out that excessive heat treatment brings stress relaxation. The Vickers hardness, Fracture Toughness and bending strength of ion exchanged samples at $570^{\circ}C$ for 10min were $821.8H_v$, $1.3404MPa{\cdot}m^{1/2}$, and 953MPa, which is about 120%, 180%, and 450% higher than parent borosilicate glass, respectively. Transmittance was analyzed by UV-VIS-NIR spectrophotometer. Transmittance of ion exchanged borosilicate glass was decreased slightly at visible-range. It can be expected that transparent bulletproof materials in more light-weight and thinner by ion exchanged borosilicate glass.