• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 춘계학술대회 논문집
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• pp.244-247
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• 2002

The performance of the precision micro-positioning 4-dof stage is presented. The compact design utilizes the monolithic mechanism to achieve the translation in the Z axis and rotation in the $\theta$ z, $\theta$ x and $\theta$ y axes with high stiffness and high damping. Hysteresis, nonlinearity, and drift of the piezoelectric effects are improved by incorporating the sensors in a feedback control. Experiments demonstrate that the micro-positioning stage is capable of 2nm resolution over the travel range of 25$\mu\textrm$ m in the Z axis, 0.0l7 $\mu\textrm$ rad resolution over the 170$\mu\textrm$ rad in the $\theta$ z and 0.011 $\mu\textrm$ rad resolution over the $\mu\textrm$ rad in the $\theta$ x and $\theta$ y axes. The cross-axis interferences among the axes are at a noise range. This stage is available for positioning error compensation of the XY stage with large stroke.

• 반도체디스플레이기술학회지
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• 제20권4호
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• pp.119-124
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• 2021

In a situation where Moore's law, which states that the performance of semiconductor integrated circuits doubles every two years, is showing a limit from a certain point, and it is difficult to increase the performance due to the limitations of exposure technology.In this study, a wafer hybrid method that can increase the degree of integration Various research on bonding technology is currently in progress. In this study, in order to achieve rotational precision between wafers in wafer hybrid bonding technology, modeling of θ_z alignment stage and VCM actuator modeling used for rotational alignment, magnetic field analysis and desgin, control, and evaluation are performed. The system of this study was controlled by VCM actuator, capactive sensor, and dspace, and the working range was ±7200 arcsec, and the in-position and resoultion were ±0.01 arcsec. The results of this study confirmed that safety and precise control are possible, and it is expected to be applied to the process to increase the integration.