• 제목/요약/키워드: high power property

검색결과 500건 처리시간 0.032초

고출력, 고효율 실현을 위한 새로운 레이저매질 개발 (Development of Laser Material for High Power and High Efficiency)

  • 김정호
    • 한국전기전자재료학회:학술대회논문집
    • /
    • 한국전기전자재료학회 2001년도 하계학술대회 논문집
    • /
    • pp.15-18
    • /
    • 2001
  • Perdeuterated hexaflouroacetylacetonato-ytterbium [Yb(SOL)-D)$_3$] complexes were synthesized by the keto-enol tautomerism reaction of Yb(SOL-H)$_3$ in methanol-d$_4$in methanol-d$_4$in order to reduce the radiationless transition to the ligands. The luminescence properties of Yb(SOL-D)$_3$complex were measured in the following anhydrous deuterated organic solvents ; Methanol-d$_4$, THF-d$\sub$8/, PO(OCH$_3$)$_3$ and DMSO-d$\sub$6/. The intensity, lifetime and quantum efficiency of the luminescence in DMSO-d$\sub$6/ were superior to those in other deuterated solvents. It was suggested that the anhydrous DMSO-d$\sub$6/ might be the most appropriate solvent for the liquid laser material of Yb(SOL-D)$_3$ complex.

  • PDF

PCB 구조적 설계에 따른 LED Module의 열적 광학적 특성 (Optical, Thermal property by Applied PCB Structure design)

  • 이승민;이성진;최기승;이종찬;박대희
    • 대한전기학회:학술대회논문집
    • /
    • 대한전기학회 2006년도 제37회 하계학술대회 논문집 A
    • /
    • pp.609-610
    • /
    • 2006
  • As developing the information society, Lighting Emitted diode(LED) which is light source for illumination of next generation is attracted public attention. LED have many problem as narrow light view angle, high price, drift phenomenon of color coordinate, high heating problem for lower power, lower weight and small size. So, many researches have continued in a illumination as LED module type. in this problem, heating problem is very important and difficult and that is caused in decreasing phenomenon of brightness and drift phenomenon of color coordinate. so the problem of heating is urgent question for illumination of LED. In this paper, structural design of PCB changed as two type for solving the heating problem. also the properties of heating is analysed and optical properties is measured with heating image camera and spectrometer according to change in this design.

  • PDF

PCB 구조적 설계에 따른 LED Module의 열적 광학적 특성 (Optical, Thermal property by Applied PCB Structure design)

  • 이승민;이성진;최기승;이종찬;박대희
    • 대한전기학회:학술대회논문집
    • /
    • 대한전기학회 2006년도 제37회 하계학술대회 논문집 D
    • /
    • pp.2241-2242
    • /
    • 2006
  • As developing the information society, Lighting Emitted diode(LED) which is light source for illumination of next generation is attracted public attention. LED have many problem as narrow light view angle, high price, drift phenomenon of color coordinate, high heating problem for lower power, lower weight and small size. So, many researches have continued in a illumination as LED module type. in this problem, heating problem is very important and difficult and that is caused in decreasing phenomenon of brightness and drift phenomenon of color coordinate. so the problem of heating is urgent question for illumination of LED. In this paper, structural design of PCB changed as two type for solving the heating problem. also the properties of heating is analysed and optical properties is measured with heating image camera and spectrometer according to change in this design.

  • PDF

H종 주상용 몰드 변압기의 덕크구조에 따른 열해석 특성 (Surface Ageing Property of Polymer Insulator for Transmission line with Forest Fire Test)

  • 조한구;김광용
    • 한국전기전자재료학회:학술대회논문집
    • /
    • 한국전기전자재료학회 2010년도 하계학술대회 논문집
    • /
    • pp.111-111
    • /
    • 2010
  • The mold transformers have been widely used in underground substations in large building and have some advantages in comparison to oil-transformer, that is low fire risk, excellent environmental compatibility, compact size and high reliability. In addition, the application of mold transformer for outdoor is possible due to development of epoxy resin. The mold transformer generally has cooling duct between low voltage coil and high voltage coil. A mold transformer made by one body molding method has been developed for small size and low loss, but it needs some cooling method because heat radiation between each winding is difficult. In this paper, the temperature distribution and thermal stress analysis of H class 100kVA pole cast resin transformer for power distribution are investigated by FEM program.

  • PDF

릴레이 제어법을 이용한 실리콘 웨이퍼의 정전부상에 관한 연구 (Electrostatic Suspension System of Silicon Wafer using Relay Feedback Control)

  • 전종업;이상욱;정일진;박규열
    • 한국정밀공학회:학술대회논문집
    • /
    • 한국정밀공학회 2003년도 춘계학술대회 논문집
    • /
    • pp.969-974
    • /
    • 2003
  • A simple and cost-effective method for the electrostatic suspension of thin plates like silicon wafers is proposed which is based on a switched voltage control scheme. It operates according to a relay feedback control and deploys only a single high-voltage power supply that can deliver a dc voltage of positive and/or negative polarity. This method possesses the unique feature that no high-voltage amplifiers are needed which leads to a remarkable system simplification relative to conventional methods. It is shown that despite the inherent limit cycle property of the relay feedback based control, an excellent performance in vibration suppression is attained due to the presence of a relatively large squeeze film damping origination from the air between the electrodes and levitated object. Using this scheme, a 4-inch silicon wafer was levitated stably with airgap variation decreasing down to 1 $\mu\textrm{m}$ at an airgap of 100 $\mu\textrm{m}$

  • PDF

3차원 패키징용 TSV의 열응력에 대한 열적 전기적 특성 (A study on Electrical Characteristic and Thermal Shock Property of TSV for 3-Dimensional Packaging)

  • 정일호;기세호;정재필
    • 마이크로전자및패키징학회지
    • /
    • 제21권2호
    • /
    • pp.23-29
    • /
    • 2014
  • Less power consumption, lower cost, smaller size and more functionality are the increasing demands for consumer electronic devices. The three dimensional(3-D) TSV packaging technology is the potential solution to meet this requirement because it can supply short vertical interconnects and high input/output(I/O) counts. Cu(Copper) has usually been chosen to fill the TSV because of its high conductivity, low cost and good compatibility with the multilayer interconnects process. However, the CTE mismatch and Cu ion drift under thermal stress can raise reliability issues. This study discribe the thermal stress reliability trend for successful implementation of 3-D packaging.

간접유도가열용 고주파 공진형 인버터 시스템에 관한 연구 (A Study on the High-Frequency Resonant Inverter System for Indirect Induction Heating)

  • 권혁민;신대철;김기환;김용주
    • 전력전자학회:학술대회논문집
    • /
    • 전력전자학회 2002년도 전력전자학술대회 논문집
    • /
    • pp.322-325
    • /
    • 2002
  • In this paper are described the indirect induction heated boiler and induction heated hot air producer using the voltage-fed series resonant high-frequency inverter which can operate in the frequency range from 20kHz to 50kHz. A specially designed induction heater, which is composed of laminated stainless assembly with many tiny holes and interconnected spot welding points between stainless plates, is inserted Into the ceramic type vessel with external working coil. This working coil is connected to the inverter and turbulence fluid through this induction heater to moving fluid generates in the vessel. The operating performances of this unique appliance in next generation and its effectiveness are evaluated and discussed from a practical point of view.

  • PDF

A CHARGER/DISCHARGER FOR MODELING OF SERIAL/PARALLEL CONNECTED NI-MH BATTERY

  • Heo, Min-Ho;Ahn, Jae-Young;Kim, Kwang-Heon
    • 전력전자학회:학술대회논문집
    • /
    • 전력전자학회 1998년도 Proceedings ICPE 98 1998 International Conference on Power Electronics
    • /
    • pp.554-559
    • /
    • 1998
  • Equalizing the state of charge of cell that affects the charge/discharge quality and efficiency of the battery through the charge/discharge characteristic experiments of battery source, we develope the high efficiency charge/discharge system which would be used in serial HEV with the constant engine-generator output. For this, establishes the electrical model of Ni-MH battery appropriate to the high efficiency charge/discharge conditions. There is no model of Ni-MH cell, so we used Ni-Cd model and obtain the Ni-MH model through the experiment. A reason that each cell has the same charge/discharge property for applying the cell model to serial/parallel connected battery source extensively is needed. Therefore, in this paper, propose the Ni-MH charger/discharger has the equalization charging function and selectable cut-off function.

  • PDF

릴레이 제어법을 이용한 실리콘 웨이퍼의 정전부상에 관한 연구 (Electrostatic Suspension System of Silicon Wafer using Relay Feedback Control)

  • 이상욱;전종업
    • 한국정밀공학회지
    • /
    • 제22권10호
    • /
    • pp.56-64
    • /
    • 2005
  • A simple and cost-effective method for the electrostatic suspension of thin plates like silicon wafers is proposed which is based on a switched voltage control scheme. It operates according to a relay feedback control and deploys only a single high-voltage power supply that can deliver a DC voltage of positive and/or negative polarity. This method possesses the unique feature that no high-voltage amplifiers are needed which leads to a remarkable system simplification relative to conventional methods. It is shown that despite the inherent limit cycle property of the relay feedback based control, an excellent performance in vibration suppression is attained due to the presence of a relatively large squeeze film damping origination from the air between the electrodes and levitated object. Using this scheme, a 4-inch silicon wafer was levitated stably with airgap variation decreasing down to $1 {\mu}m$ at an airgap of $100{\mu}m$.

Characterization of Low-Temperature Graphene Growth with Plasma Enhanced Chemical Vapor Deposition

  • Ma, Yifei;Kim, Dae-Kyoung;Xin, Guoqing;Chae, Hee-Yeop
    • 한국진공학회:학술대회논문집
    • /
    • 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
    • /
    • pp.421-421
    • /
    • 2012
  • Graphene has drawn enormous attention owing to its outstanding properties, such as high charge mobility, excellent transparence and mechanical property. Synthesis of Graphene by chemical vapor deposition (CVD) is an attractive way to produce large-scale Graphene on various substrates. However the fatal limitation of CVD process is high temperature requirement(around $1,000^{\circ}C$), at which many substrates such as Al substrate cannot endure. Therefore, we propose plasma enhanced CVD (PECVD) and decrease the temperature to $400^{\circ}C$. Fig. 1 shows the typical structure of RF-PECVD instrument. The quality of Graphene is affected by several variables. Such as plasma power, distance between substrate and electronic coil, flow rate of source gas and growth time. In this study, we investigate the influence of these factors on Graphene synthesis in vacuum condition. And the results were checked by Raman spectra and conductivity measurement.

  • PDF