• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.100-100
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• 2016

Among various two-dimensional (2D) materials, 2D semiconductors and insulators have attracted a great deal of interest from nanoscience community beyond graphene, due to their attractive and unique properties. Such excellent characteristics have triggered highly active researches on 2D materials, such as hexagonal boron nitride (hBN), molybdenum disulfide (MoS2), and tungsten diselenide (WSe2). New physics observed in 2D semiconductors allow for development of new-concept devices. Especially, these emerging 2D materials are promising candidates for flexible and transparent electronics. Recently, van der Waals heterostructures (vdWH) have been achieved by putting these 2D materials onto another, in the similar way to build Lego blocks. This enables us to investigate intrinsic physical properties of atomically-sharp heterostructure interfaces and fabricate high performance optoelectronic devices for advanced applications. In this talk, fundamental properties of various 2D materials will be introduced, including growth technique and influence of defects on properties of 2D materials. We also fabricate high performance electronic/optoelectronic devices of vdWH, such as transistors, memories, and solar cells. The device platform based on van der Waals heterostructures show huge improvement of devices performance, high stability and transparency/flexibility due to unique properties of 2D materials and ultra-sharp heterointerfaces. Our work paves a new way toward future advanced electronics based on 2D materials.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.282.1-282.1
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• 2016

The remarkable physical properties of two-dimensional (2D) semiconducting materials such as molybdenum disulfide ($MoS_2$) and tungsten disulfide ($WS_2$) etc. have attracted considerable attentions for future high-performance electronic and optoelectronic devices. The ongoing studies of $MoS_2$ based nonvolatile memories have been demonstrated by worldwide researchers. The opening hysteresis in transfer characteristics have been revealed by different charge confining layer, for instance, few-layer graphene, $MoS_2$, metallic nanocrystal, hafnium oxide, and guanine. However, limited works built their nonvolatile memories using entirely of assembled 2D crystals. This is important in aspect view of large-scale manufacture and vertical integration for future memory device engineering. We report $WS_2$ based nonvolatile memories utilizing functional van der Waals heterostructure in which multi-layered graphene is encapsulated between $SiO_2$ and hexagonal boron nitride (hBN). We experimentally observed that, large memory window (20 V) allows to reveal high on-/off-state ratio (>$10^3$). Moreover, the devices manifest perfect retention of 13% charge loss after 10 years due to large graphene/hBN barrier height. Interestingly, the performance of our memories is drastically better than ever published work related to $MoS_2$ and black phosphorus flash memory technology.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.87.1-87.1
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• 2016

The unique properties of 2D materials significantly rely on the atomic structure and defects. Thus study at atomic scale is crucial for in-depth understanding of 2D materials and provides insights into its future applications. Using aberration-corrected transmission electron microscopes, atomic resolution imaging of individual atoms has been achieved even at a low kV. Ongoing optimization of aberration correction improves the spatial resolution better than angstrom and moreover boosts the contrast of light atoms. I present the recent progress of the study on the atomic structure and defects of monolayer and multilayer graphene, hBN and MoS2. Furthermore, the defect formation mechanisms of graphene, hexagonal boron nitride and MoS2 are discussed.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.43-43
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• 2011

BN(Boron Nitride)은 온도와 압력 조건에 따라 안정한 상이 sp3 결합인 cubic 구조의 BN(cBN)과 sp2 결합인 hexagonal 구조의 BN(hBN or tBN)으로 나뉘는데, 이 중 cBN은 우수한 기계적, 물리적, 화학적 특성으로 인해 박막 분야에서 매우 높은 응용가능성을 지니고 있다. 하지만 cBN 박막의 합성과정에서의 필수적인 요소인 높은 압축잔류응력은 cBN을 응용분야에 적용하는데 있어 한계점으로 계속 남아 있었다. 그동안 이러한 잔류응력을 감소시키기 위해 열처리, 이온 주입, 제 3의 물질 첨가 등 다양한 관점에서 접근한 연구들이 진행되어 왔다. 본 연구에서는 cBN 합성과정에서 잔류응력을 감소시키기 위한 방법으로 수소를 첨가하였고, 그에 따른 잔류응력의 변화를 분석하고, 그 과정에서 잔류응력의 형성에 수소가 어떤 역할을 하는지 규명하고자 하였다. cBN 박막은 hBN을 target으로한 unbalanced magnetron sputtering를 사용하여, 실리콘 wafer 위에 합성하였다. 증착압력은 1.3mTorr로, 수소의 첨가량을 증가시키며 잔류응력과 cBN fraction을 관찰하였다. cBN fraction은 FTIR로 분석하였고, 잔류응력은 실리콘 strip의 in-situ 곡률측정법으로 계산하였다. cBN 박막의 조성과 구조 분석, 수소의 역할 규명을 위해 RBS 및 HRTEM을 이용하였다.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.252-252
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• 2013

최근 그래핀, hexagonal boron nitride (h-BN) 및 $MoS_2$ (molybdenum disulfide)와 같은 2차원 결정 물질들은 무어의 법칙(Moore's Law)를 뛰어넘어 계속적인 소자의 소형화를 가능케 하고 또한 대면적, 저비용 소자 개발을 가능케 하는 우수한 특성을 가진 차세대 반도체 트랜지스터 소재로 각광받고 있다. $MoS_2$는 bulk 상태일 때는 1.2 eV의 indirect 밴드갭을 가지지만 단층형태일 때는 1.8 eV의 direct 밴드갭을 가지며 dielectric screening 기법등을 통해 mobility를 향상시킬 수 있는 것으로 연구된 바 있다. 본 연구에서는 화학기상증착 (chemical vapor deposition)법을 이용하여 $MoS_2$ 박막을 형성하기 위한 기초연구인 Mo 전구체의 특성평가 및 적합한 공정조건 개발 연구를 수행하였다. 사용한 전구체는 $Mo(CO)_6$ (Molybdenum hexacarbonyl)이고, 온도 및 압력, 반응기체(H2 S, Hydrogen sulfide) 유량 등의 공정 조건 변화에 따른 거동을 Fourier transform infrared spectroscopy (FT-IR) 시스템을 사용하여 측정하였다. 또한 $Mo(CO)_6$의 분자구조를 상용 프로그램인 Gaussian으로 시뮬레이션 하여 실제 FT-IR 측정 결과값과 비교 분석하였다.

• Corrosion Science and Technology
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• v.19 no.1
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• pp.23-30
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• 2020

Heat sinks are most widely used in thermal management systems; however, the heat dissipation efficiency is usually limited. Therefore, in order to increase heat dissipation efficiency of the heat sink, the heat-dissipating paint using 2D materials (hexagonal boron nitride (h-BN) and graphene) as thermally conductive additive was designed and evaluated in the present study. The heat dissipation performance of the paint was calculated from temperature difference between the paint-coated and -uncoated specimens mounted on the heat source. The highest heat dissipation performance was obtained when the ratio of h-BN to resin was 1/10 in the paint. In addition, further reduction in the temperature of the test specimen by 6.5 ℃ was achieved. The highest heat dissipation performance of the paint prepared using graphene was achieved at a 1/50 ratio of graphene to the resin, and a 6.5 ℃ reduction was attained. In addition, graphene exhibited enhanced corrosion resistance property of heat-dissipating paint by inhibiting the growth of the paint blisters.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.116.2-116.2
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• 2013

최근 그래핀, hexagonal boron nitride (h-BN) 및 $MoS_2$ (molybdenum disulfide)와 같은 2차원 결정 물질들은 무어의 법칙 (Moore's Law)를 뛰어넘어 계속적인 소자의 소형화를 가능케 하고 또한 대면적, 저비용 소자 개발을 가능케 하는 우수한 특성을 가진 차세대 반도체 트랜지스터 소재로 각광받고 있다. $MoS_2$는 bulk 상태일 때는 1.2 eV의 indirect 밴드갭을 가지지만 단층형태일 때는 1.8 eV의 direct 밴드갭을 가지며 dielectric screening 기법 등을 통해 mobility를 향상시킬 수 있는 것으로 연구된 바 있다. 본 연구에서는 화학기상증착(chemical vapor deposition, CVD)법을 이용하여 $MoS_2$박막을 형성하기 위한 기초연구인 Mo전구체의 특성 평가 및 적합한 공정조건 개발 연구를 수행하였다. 사용한 전구체는 $Mo(CO)^6$ (Molybdenum hexacarbonyl)이고, 온도 및 압력, 반응기체($H_2S$, Hydrogen sulfide) 유량 등의 공정 조건 변화에 따른 거동을 Fourier transform infrared spectroscopy (FT-IR) 시스템을 사용하여 측정하였다. 또한 $Mo(CO)^6$의 분자구조를 상용 프로그램인 Gaussian으로 시뮬레이션 하여 실제 FT-IR 측정 결과값과 비교 분석하였다. 화학기상증착법을 이용한 $MoS_2$ 증착조건 최적화를 위하여 다양한 온도, 유량, 압력, 및 기판 종류에 대하여 증착 실험을 수행하였으며, 증착된 샘플은 scanning electron microscope (SEM), Raman spectroscopy를 이용하여 분석하였다.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.388.2-388.2
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• 2014

최근 그래핀 연구와 더불어 2차원 구조의 나노소재에 대한 관심이 급증하면서 육각형의 질화붕소(hexagonal boron nitride; h-BN) 박막(nanosheet) [1]이나 붕소 탄화질화물(boron caronitride; BCN) 박막 [2,3]와 같은 2차원 구조체에 대한 연구가 활발히 진행되고 있다. 그 중 BCN은 반금속(semimetal)인 흑연(graphite)과 절연체인 h-BN이 결합된 박막으로 원소의 구성 비율에 따라 전기적 특성을 제어할 수 있다는 장점이 있다. 따라서 다양한 나노소자로의 응용을 위한 연구가 활발히 진행되고 있다. 본 연구에서는 폴리스틸렌(polystyrene, PS)과 보레인 암모니아(borane ammonia)를 고체 소스로 이용하여 열화학기상증착법을 이용하여 BCN 박막를 SiO2 기판 위에 직접 합성하였다. SEM과 AFM 관측을 통해 합성된 BCN 박막을 확인하였으며, RMS roughness가 0.5~2.6 nm로 매우 낮은 것을 확인하였다. 합성과정에서 PS의 양을 조절하여 BCN 박막의 탄소의 밀도를 성공적으로 제어하였으며, 이에 따라 전기적인 특성이 제어되는 양상을 확인하였다. 또한 합성온도 변화에 따른 BCN 박막의 전기적인 특성이 제어되는 양상을 확인하였다. 추가적으로 같은 방법을 이용하여 BCN 박막을 Ni 위에서 합성하여 SiO2 기판위에 전사 하였다. 합성된 BCN 박막의 구조적 특징과 화학적 조성 및 결합 상태를 투과전자현미경(transmission electron microscopy), X-선 광전자 분광법(X-ray photoelectron spectroscopy)을 통해 조사하였다.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 1996.11a
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• pp.6-6
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• 1996

Ceramic based nanocomposite, in which nano-sized ceramics and metals were dispersed within matrix grains and/or at grain boundaries, were successfully fabricated in the ceramic/cerarnic and ceramic/metal composite systems such as $Al_2O_3$/SiC, $Al_2O_3$/$Si_3N_4$, MgO/SiC, mullite/SiC, $Si_3N_4/SiC, $Si_3N_4$/B, $Al_2O_3$/W, $Al_2O_3$/Mo, $Al_2O_3$/Ni and $ZrO_2$/Mo systems. In these systems, the ceramiclceramic composites were fabricated from homogeneously mixed powders, powders with thin coatings of the second phases and amorphous precursor composite powders by usual powder metallurgical methods. The ceramiclmetal nanocomposites were prepared by combination of H2 reduction of metal oxides in the early stage of sinterings and usual powder metallurgical processes. The transmission electron microscopic observation for the $Al_2O_3$/SiC nanocomposite indicated that the second phases less than 70nm were mainly located within matrix grains and the larger particles were dispersed at the grain boundaries. The similar observation was also identified for other cerarnic/ceramic and ceramiclmetal nanocornposites. The striking findings in these nanocomposites were that mechanical properties were significantly improved by the nano-sized dispersion from 5 to 10 vol% even at high temperatures. For example, the improvement in hcture strength by 2 to 5 times and in creep resistance by 2 to 4 orders was observed not only for the ceramidceramic nanocomposites but also for the ceramiclmetal nanocomposites with only 5~01%se cond phase. The newly developed silicon nitride/boron nitride nanocomposites, in which nano-sized hexagonal BN particulates with low Young's modulus and fracture strength were dispersed mainly within matrix grains, gave also the strong improvement in fracture strength and thermal shock fracture resistance. In presentation, the process-rnicro/nanostructure-properties relationship will be presented in detail. The special emphasis will be placed on the understanding of the roles of nano-sized dispersions on mechanical properties.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.284-284
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• 2016

Topological insulator (TI) is a bulk-insulating material with topologically protected Dirac surface states in the band gap. In particular, $Bi_2Se_3$ attracted great attention as a model three-dimensional TI due to its simple electronic structure of the surface states in a relatively large band gap (~0.3 eV). However, experimental efforts using $Bi_2Se_3$ have been difficult due to the abundance of structural defects, which frequently results in the bulk conduction being dominant over the surface conduction in transport due to the bulk doping effects of the defect sites. One promising approach in avoiding this problem is to reduce the structural defects by heteroepitaxially grow $Bi_2Se_3$ on a substrate with a compatible lattice structure, while also preventing surface degradation by encapsulating the pristine interface between $Bi_2Se_3$ and the substrate in a clean growth environment. A particularly promising choice of substrate for the heteroepitaxial growth is hexagonal boron nitride (h-BN), which has the same two-dimensional (2D) van der Waals (vdW) layered structure and hexagonal lattice symmetry as $Bi_2Se_3$. Moreover, since h-BN is a dielectric insulator with a large bandgap energy of 5.97 eV and chemically inert surfaces, it is well suited as a substrate for high mobility electronic transport studies of vdW material systems. Here we report the heteroepitaxial growth and characterization of high quality topological insulator $Bi_2Se_3$ thin films prepared on h-BN layers. Especially, we used molecular beam epitaxy to achieve high quality TI thin films with extremely low defect concentrations and an ideal interface between the films and substrates. To optimize the morphology and microstructural quality of the films, a two-step growth was performed on h-BN layers transferred on transmission electron microscopy (TEM) compatible substrates. The resulting $Bi_2Se_3$ thin films were highly crystalline with atomically smooth terraces over a large area, and the $Bi_2Se_3$ and h-BN exhibited a clear heteroepitaxial relationship with an atomically abrupt and clean interface, as examined by high-resolution TEM. Magnetotransport characterizations revealed that this interface supports a high quality topological surface state devoid of bulk contribution, as evidenced by Hall, Shubnikov-de Haas, and weak anti-localization measurements. We believe that the experimental scheme demonstrated in this talk can serve as a promising method for the preparation of high quality TI thin films as well as many other heterostructures based on 2D vdW layered materials.